Light-emitting device comprising led chip and method for manufacturing this device

• US 20050122031A1
• Filed: 03/03/2003
• Published: 06/09/2005
• Est. Priority Date: 03/05/2002
• Status: Active Grant

• Current Assignee: ROHM Co., Ltd.
• Original Assignee: ROHM Co., Ltd.
• Inventors: Kitamura, Takeshi, Ishihara, Takayuki, Itai, Junichi
• Granted Patent: US 7,126,159 B2
• Time in Patent Office: Days
• US Class Current: 313/498
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/52 Encapsulations
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

A light emitting device includes a first patterned electrode 12 and a second patterned electrode 13 both of which are formed on a wiring board 11, an LED chip 19 mounted on the second patterned electrode 13, a metal wire 20 electrically connecting the LED chip 19 and the first patterned electrode 12 to each other, and a lens member 21 made of a transparent synthetic resin for packaging the LED chip 19 and the metal wire 20. The first patterned electrode 12 is circular and formed with a cutout 14 at the center thereof. The second patterned electrode 13 is arranged in the cutout 14. With this arrangement, the lens member 21 can be formed into a predetermined configuration, while the reflection of light by the patterned electrodes can be ensured.

Claims

1. A light emitting device comprising:

a first patterned electrode and a second patterned electrode both of which made of a metal film and provided on an obverse surface of a wiring board;

an LED chip mounted on the second patterned electrode;

a metal wire electrically connecting the LED chip and the first patterned electrode to each other; and

a lens member made of a transparent synthetic resin and provided on the obverse surface of the wiring board for packaging the LED chip and the metal wire;

wherein the first patterned electrode is circular and has a central cutout, the second patterned electrode being arranged in the cutout.

3. The light emitting device according to claim 1, wherein the wiring board has a reverse surface formed with a power supply wiring pattern for electrical connection to the first patterned electrode and the second patterned electrode via a through-hole formed in the wiring board.

2. A light emitting device comprising:

a first patterned electrode and a plurality of second patterned electrodes, the first and second patterned electrodes being made of a metal film and provided on an obverse surface of a wiring board;

LED chips each mounted on a respective one of the second patterned electrodes;

metal wires each electrically connecting a respective one of the LED chips and the first patterned electrode; and

a lens member made of a transparent synthetic resin and provided on the obverse surface of the wiring board for packaging the LED chips and the metal wires;

wherein the first patterned electrode is circular and has a central cutout, the second patterned electrodes are arranged in the cutout while being equally spaced from each other along a circumference of a circle which is generally concentric with the circle of the first patterned electrode, and wherein the metal wires electrically connecting the LED chips mounted on the second patterned electrodes to the first patterned electrode extend radially outward.

4. The light emitting device according to claim 2, wherein the cutout of the first patterned electrode has a peripheral edge which includes an indentation entering between the second patterned electrodes.

6. The light emitting device according to claim 2, wherein the wiring board has a reverse surface formed with a power supply wiring pattern for electrical connection to the first patterned electrode and the second patterned electrode via a through-hole formed in the wiring board.

5. A method of making a light emitting device, comprising the steps of:

forming, on a wiring board, a first patterned electrode of a metal film into a circular configuration while forming a cutout at a center of the first patterned electrode;

forming a second patterned electrode of a metal film in the cutout;

mounting an LED chip on the second patterned electrode;

electrically connecting the LED chip and the first patterned electrode to each other via a metal wire; and

forming a lens member by dropping transparent synthetic resin in a liquid state onto the first patterned electrode so that the transparent synthetic resin bulges to cover the LED chip and the metal wire and then hardening the synthetic resin.