Method and apparatus for manufacturing a transistor -outline (TO) can having a ceramic header
First Claim
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1. A method of manufacturing an optoelectronic package having an insulating base with multiple conductive vias running through the insulating base, and having a metal cover that at least partially encloses an optoelectronic device mounted on the insulating base, the method comprising:
- placing a solder preform between the metal cover and the insulating base;
applying pressure between the metal cover and the insulating base; and
applying a current through the multiple conductive vias to heat the solder preform to melt.
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Abstract
A method of manufacturing an optoelectronic packaging comprises placing a solder preform between a metal cover and an insulating base, applying pressure to the metal cover and the insulating base, and applying a current through multiple conductive vias to heat the solder preform to melt.
19 Citations
7 Claims
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1. A method of manufacturing an optoelectronic package having an insulating base with multiple conductive vias running through the insulating base, and having a metal cover that at least partially encloses an optoelectronic device mounted on the insulating base, the method comprising:
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placing a solder preform between the metal cover and the insulating base;
applying pressure between the metal cover and the insulating base; and
applying a current through the multiple conductive vias to heat the solder preform to melt. - View Dependent Claims (2, 3, 4)
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5. A method of manufacturing a TO can comprising:
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placing a solder preform between a metal cover and an insulating base; and
applying a current to the solder preform until the solder preform melts to seal a metal cover to the insulating base. - View Dependent Claims (6, 7)
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Specification