Routing system

• US 20050136728A1
• Filed: 12/19/2003
• Published: 06/23/2005
• Est. Priority Date: 12/19/2003
• Status: Active Grant

• Current Assignee: Hewlett Packard Enterprise Development LP (Hewlett-Packard Enterprise Company)
• Original Assignee: Hewlett-Packard Development Company, L.P. (HP Inc.)
• Inventors: Harris, Shaun L., Williams, Gary W., Wirtzberger, Paul A., Boudreaux, Brent A.
• Granted Patent: US 7,018,215 B2
• Time in Patent Office: Days
• US Class Current: 439/374
• CPC Class Codes: H01R 13/60 Means for supporting coupling part when not engaged

Abstract

Embodiments of a routing system for electronic module assemblies are disclosed that may incorporate a module base having at least one routing end and a channel formed across a length of the at least one routing end, wherein the channel has a dimension that allows a wire to be routed from the module base to a connection point external to the module base and allows the wire to be bent within the channel in a direction of the connection point.

Claims

1. A routing system for electronic module assemblies comprising:

a module base having at least one routing end; and

a channel formed across a length of said at least one routing end, wherein said channel has a dimension that allows a wire to be routed from said module base to a connection point external to said module base and allows said wire to be bent within said channel in a direction of said connection point.

2. The routing system of claim 1 wherein said wire is routed to one of:

a left side of said module base; and

a right side of said module base.

3. The routing system of claim 1 wherein said wire provides one of:

input power; and

output data.

4. A method for routing a conductor from an electronic module comprising:

connecting said conductor to a module connection point; and

placing said conductor into a routing slot along a wire exit end of said electronic module.

5. The method of claim 4 further comprising:

bending said conductor within said routing slot prior to said placing step.

6. The method of claim 5 wherein said bending comprises one of:

bending to a right side of said electronic module; and

bending to a left side of said electronic module.

7. The method of claim 4 wherein said module connection point comprises one of:

a power input, connection;

a data input connection; and

a data output connection.

8. The method of claim 4 further comprising:

connecting said conductor to an external connection point.

9. An electronic module assembly comprising:

a plurality of modules connected into a backbone of said electronic module assembly;

a plurality of connection pads external to said plurality of modules;

a routing channel formed into at least one routing end of each of said plurality of modules; and

a plurality of conductors for connecting each of said plurality of modules to selected ones of said plurality of connection pads, wherein said plurality of conductors are routed from said plurality of modules through said routing channels.

10. The electronic module assembly of claim 9 wherein said plurality of connection pads are located at one or more of:

a left-hand side of said plurality of modules; and

a right-hand side of said plurality of modules.

11. The electronic module assembly of claim 9 wherein a portion of said conductors routed through said routing channel remains within a dimension of said routing channel.

12. The electronic module assembly of claim 9 wherein each of said modules is connected side-by-side on said backbone.