Package for housing an optoelectronic assembly

• US 20050141828A1
• Filed: 01/19/2005
• Published: 06/30/2005
• Est. Priority Date: 05/23/2003
• Status: Active Grant

• Current Assignee: Sumitomo Electric Device Innovations, U.S.A., Inc. (Sumitomo Corporation)
• Original Assignee: Intel Corporation
• Inventors: Narayan, Raghuram, Zheng, Tieyu
• Granted Patent: US 7,255,496 B2
• Time in Patent Office: Days
• US Class Current: 385/92
• CPC Class Codes: G02B 6/4201 Packages, e.g. shape, construction, internal or external details
• CPC Class Codes: G02B 6/4251 Sealed packages G02B6/4248 takes precedence
• CPC Class Codes: G02B 6/4256 Details of housings
• CPC Class Codes: G02B 6/4269 with heat sinks or radiation fins
• CPC Class Codes: H01L 25/167 comprising optoelectronic devices, e.g. LED, photodiodes
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/3011 Impedance
• CPC Class Codes: H01L 31/0203 Containers; Encapsulations , e.g. encapsulation of photodiodesfor photovoltaic devices H01L31/048; for organic photosensitive devices H10K30/80

Abstract

A package for housing an optoelectronic device and an integrated circuit is disclosed. The package includes an insulating base having an upper surface. The optoelectronic device and the integrated circuit are mounted to the upper surface of the insulating base. The package also includes a metal sealing member having a top wall and a bottom wall. The bottom wall of the metal sealing member is attached to the upper surface of the insulating base. The package further includes a metal cover having a rim located at a bottom portion thereof. The rim of the metal cover is adapted to attach to the top wall of the metal sealing member to thereby hermetically seal the metal cover to the insulating base.

Claims

1-30. -30. (canceled)

31. A package configured to house an optoelectronic assembly, the package comprising:

an insulating base having an upper surface;

an optoelectronic device mounted to the upper surface of the insulating base;

a first metal member comprising a bottom wall and a top wall, the bottom wall of the first metal member being attached to the upper surface of the insulating base; and

a metal cover having a rim located at a bottom portion thereof, the rim of the metal cover being configured to attach to the top wall of the first metal member to hermetically seal the metal cover to the insulating base.

32. The package of claim 31, further comprising an integrated circuit mounted adjacent to the optoelectronic device on the upper surface of the insulating base, the integrated circuit being electrically coupled to the optoelectronic device.

33. The package of claim 32, further comprising a submount attached to the upper surface of the insulating base, at least one of the optoelectronic device and the integrated circuit being mounted to the submount.

34. The package of claim 32, wherein the first metal member further comprises an outer wall and an inner wall, both of which extend along a perimeter of the insulating base, the optoelectronic device and the integrated circuit being located within an inner region of the first metal member.

35. The package of claim 34, wherein the first metal member is a sealing ring extending around a circumference of the upper surface of the insulating base, the sealing ring comprising one of a circular cross-sectional shape between the outer wall and the inner wall, or an oval cross-sectional shape between the outer wall and the inner wall.

36. The package of claim 34, wherein the first metal member has a polygonal shape.

37. The package of claim 32, further comprising a first metal layer disposed on the upper surface of the insulating base.

38. The package of claim 37, further comprising a second metal layer disposed on a lower surface of the insulating base, each of the first and second metal layers comprising a pattern of conductive paths.

39. The package of claim 37, further comprising a plurality of holes extending through the upper and lower surfaces of the insulating base, each of the plurality of holes being filled with a conductive material, and the plurality of filled holes being configured to conduct welding current to couple the metal cover to the insulating base.

40. The package of claim 38, further comprising at least one electrical lead attached to the second metal layer disposed on the lower surface of the insulating base, the at least one electrical lead being configured to communicate an electrical signal from at least one of the optoelectronic device and the integrated circuit housed inside the package to a component located external to the package.

41. The package of claim 38, further comprising an upper adhesive layer disposed on the upper surface of the insulating base, the first metal member being attached to the first metal layer disposed on the upper surface of the insulating base via the upper adhesive layer.

42. The package of claim 41, further comprising a lower adhesive layer disposed on the lower surface of the insulating base and a second metal member attached to the second metal layer disposed on the lower surface of the insulating base via the lower adhesive layer.

43. The package of claim 42, wherein each of the upper adhesive layer and the lower adhesive layer comprises one of a solder preform layer or a brazing material.

44. The package of claim 31, wherein the insulating base is a multilayer base comprising metal layers located at a plurality of levels of the insulating base and electrically coupled together.

45. The package of claim 31, further comprising a heat dissipating device attached to the insulating base.

46. The package of claim 31, wherein the insulating base comprises a ceramic material.

47. The package of claim 31, wherein the insulating base has a polygonal shape.

48. The package of claim 31, wherein the metal cover has a transparent portion.

49. A method for providing a hermetic enclosure, the method comprising:

mounting an optoelectronic device to an upper surface of an insulating base;

attaching a bottom wall of a first metal member to the upper surface of the insulating base;

positioning a metal cover over the optoelectronic device, the metal cover comprising a rim at a bottom portion thereof; and

attaching the rim of the metal cover to a top wall of the first metal member to hermetically enclose the optoelectronic device.

50. The method of claim 49, further comprising:

mounting an integrated circuit adjacent to the optoelectronic device on the upper surface of the insulating base, the integrated circuit being electrically coupled to the optoelectronic device;

positioning the metal cover over both the optoelectronic device and the integrated circuit located on the upper surface of the insulating base; and

attaching the rim of the metal cover to the top wall of the first metal member to hermetically enclose both the optoelectronic device and the integrated circuit.

51. The method of claim 50, wherein mounting an integrated circuit adjacent to the optoelectronic device on the upper surface of the insulating base comprises mounting both the optoelectronic device and the integrated circuit within an inner region of the first metal member.

52. The method of claim 50, further comprising forming a first metal layer on the upper surface of the insulating base, the bottom wall of the first metal member being attached to the first metal layer disposed on the upper surface of the insulating base.

53. The method of claim 52, further comprising attaching the first metal member to the insulating base using an upper adhesive layer located between the bottom wall of the first metal member and the first metal layer disposed on the upper surface of the insulating base.

54. The method of claim 52, further comprising:

forming a second metal layer on a lower surface of the insulating base; and

patterning both the first and second metal layers into a plurality of conductive paths.

55. The method of claim 54, further comprising:

forming a plurality of holes that extends through the upper and lower surfaces of the insulating base;

filling the plurality of holes with a conductive material; and

attaching a second metal member to the second metal layer formed on the lower surface of the insulating base, the second metal member being in contact with each of the plurality of filled holes.

56. The method of claim 55, further comprising attaching the second metal member to the insulating base using a lower adhesive layer located between the second metal member and the second metal layer formed on the lower surface of the insulating base.

57. The method of claim 54, further comprising:

attaching at least one electrical lead to the second metal layer formed on the lower surface of the insulating base; and

communicating an electrical signal from at least one of the optoelectronic device and the integrated circuit housed inside the metal cover to a component located external to the metal cover using the at least one electrical lead.

58. An automated process for manufacturing a package, the package being configured to house an optoelectronic assembly, the automated process comprising:

providing an insulating substrate having an upper surface and a lower surface, the insulating substrate comprising a plurality of vias formed through the upper and lower surfaces of the insulating substrate, and the plurality of vias being filled with a conductive material;

forming a metallization layer on each of the upper and lower surfaces of the insulating substrate;

attaching a metal sealing ring to the metallization layer formed on the upper surface of the insulating substrate;

mounting the optoelectronic assembly to the metallization layer formed on the upper surface of the insulating substrate and within an inner region of the metal sealing ring, the optoelectronic assembly comprising at least one optical device and at least one integrated circuit electrically coupled to the at least one optical device;

aligning a metal cap over the optoelectronic assembly; and

sealing the metal cap to the insulating substrate to hermetically enclose the optoelectronic assembly.

59. The automated process of claim 58, wherein sealing the metal cap to the insulating substrate comprises hermetically sealing a lower edge of the metal cap to the metal sealing ring that is attached to the insulating substrate using one of a laser welding technique or a resistance welding technique.

60. A packaged optical module, comprising:

a base formed of an electrically insulating material and having at least a first surface and a second surface, an optical device being mounted to the base at the first surface;

a sealing member formed of an electrically conducting material and attached to the base, the sealing member extending along a perimeter of the base with the optical device being located within an inner region of the sealing member;

a heat dissipating device attached to the second surface of the base; and

a cover formed of the electrically conducting material, the cover being configured to attach to the sealing member on the base to provide a hermetic enclosure for the optical device.

61. The packaged optical module of claim 60, further comprising:

an electronic circuit mounted to the base at the first surface and electrically coupled to the optical device, the electronic circuit being located within the inner region of the sealing member, and the cover being configured to provide a hermetic enclosure for both the optical device and the electronic circuit.

62. The packaged optical module of claim 61, further comprising at least one other component mounted to the base, the cover providing a hermetic enclosure for the optical device, the electronic circuit, and the at least one other component.

63. The packaged optical module of claim 61, further comprising a plurality of holes formed through the base, each of the plurality of holes being filled with a conductive material, and each of the plurality of holes being configured to conduct welding current to connect the cover to the base.