Micro thermoelectric device and manufacturing method thereof
First Claim
1. A micro thermoelectric device, comprising:
- a first substrate, having a first surface and a plurality of first grooves disposed on said first surface;
a first metal conductive wire layer, disposed on said first surface and each of said first grooves;
a second substrate, having a second surface corresponding to said first surface, and a plurality of second grooves disposed on said second surface and corresponding to said plurality of first grooves;
a second metal conductive wire layer, disposed on said second surface and each of said second grooves;
a plurality of adhesive layers, individually disposed in said first grooves and said second grooves;
a plurality of thermoelectric materials, being individually inseted into said first grooves and said second grooves.
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Accused Products
Abstract
The present invention discloses a micro thermoelectric device and manufacturing method thereof, and the manufacturing method comprises the steps of providing a substrate and depositing a barrier layer on the substrate, using the barrier layer as a mask to etch a pattern on the barrier layer to form a plurality of openings, adopting a reactive ion etching (RIE) method to remove the barrier layer and smoothing the curvature of the corner of each groove, depositing a metal conductive wire layer, coating an adhesive layer in said each groove by a surface mount technology (SMT), placing a plurality of thermoelectric materials individually into each groove, repeating steps (a) to (f) to produce another substrate, and connecting the two substrates into an aligned position.
25 Citations
34 Claims
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1. A micro thermoelectric device, comprising:
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a first substrate, having a first surface and a plurality of first grooves disposed on said first surface;
a first metal conductive wire layer, disposed on said first surface and each of said first grooves;
a second substrate, having a second surface corresponding to said first surface, and a plurality of second grooves disposed on said second surface and corresponding to said plurality of first grooves;
a second metal conductive wire layer, disposed on said second surface and each of said second grooves;
a plurality of adhesive layers, individually disposed in said first grooves and said second grooves;
a plurality of thermoelectric materials, being individually inseted into said first grooves and said second grooves. - View Dependent Claims (2, 3, 4, 5)
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6. A method of manufacturing micro thermoelectric device, comprising the steps of:
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(a) providing a substrate and depositing a barrier layer on said substrate;
(b) etching a pattern on said barrier layer to form a plurality of openings;
(c) using said barrier layer as a mask to perform an anisotropic etching to produce a plurality of grooves;
(d) adopting a reactive ion etching (RIE) method to remove said barrier layer, and smoothing the curvature of the corner of said each groove;
(e) depositing a metal conductive wire layer;
(f) coating an adhesive layer in said each groove by a surface mount technology (SMT);
(g) placing a plurality of thermoelectric materials individually into said each groove;
(h) repeating steps (a) to (f) to produce another substrate; and
(i) connecting said two substrates into an aligned position. - View Dependent Claims (7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 25)
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18. A method of manufacturing micro thermoelectric device, comprising the steps of:
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(a) providing a substrate and depositing a barrier layer on said substrate;
(b) etching a pattern on said barrier layer to form a plurality of openings;
(c) using said barrier layer as a mask to perform an Isotropic etching to produce a plurality of grooves;
(d) adopting a reactive ion etching (RIE) method to remove said barrier layer, and smoothing the curvature of the corner of said each groove. (e) depositing a metal conductive wire layer;
(f) coating an adhesive layer in said each groove by a surface mount technology (SMT);
(g) placing a plurality of thermoelectric materials individually into said each groove;
(h) repeating steps (a) to (f) to produce another substrate; and
(i) connecting said two substrates into an aligned position. - View Dependent Claims (19, 20, 21, 22, 23, 24, 26, 27, 28, 29)
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30. A micro thermoelectric device, comprising:
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a first substrate and a second substrate, at least one of said first and second substrate comprising a plurality of groove;
a metal conductive wire layer, disposed on the surface of said first and second substrate, and each of said grooves;
a plurality of adhesive layers, individually disposed in each of said grooves;
a plurality of thermoelectric materials, being individually inseted into each of said grooves. - View Dependent Claims (31, 32, 33, 34)
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Specification