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Hermetically sealed package and method of fabrication of a hermetically sealed package

  • US 20050151151A1
  • Filed: 10/13/2004
  • Published: 07/14/2005
  • Est. Priority Date: 04/16/2003
  • Status: Active Grant
First Claim
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1. A method, comprising:

  • providing a first substrate;

    providing an electromagnetic radiation absorbent sealing material over a surface of the first substrate;

    providing a second substrate over the first substrate; and

    heating the sealing material, which forms a hermetic seal between the first and second substrates.

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