Electronic component package
First Claim
Patent Images
1. An electronic component package comprising:
- a ceramic substrate;
a plurality of bonding pads formed on the substrate, each pad forming an interface with the ceramic;
a bonding material formed on the bonding pads;
a plurality of electrical leads secured by the bonding material to corresponding pads; and
a layer of adhesive formed over at least the interfaces between the pads and ceramic
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Accused Products
Abstract
An electronic component package and method of fabrication is provided. The electronic component package includes a ceramic substrate and a plurality of bonding pads formed on the substrate, each pad forming an interface with the ceramic. Formed on the bonding pads is a bonding material, and a plurality of electrical leads are secured to corresponding pads by the bonding material. A layer of adhesive is formed over at least the interfaces between the pads and ceramic.
10 Citations
19 Claims
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1. An electronic component package comprising:
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a ceramic substrate;
a plurality of bonding pads formed on the substrate, each pad forming an interface with the ceramic;
a bonding material formed on the bonding pads;
a plurality of electrical leads secured by the bonding material to corresponding pads; and
a layer of adhesive formed over at least the interfaces between the pads and ceramic - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10-17. -17. (canceled)
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18. An electronic component package comprising:
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a ceramic substrate;
a plurality of bonding pads formed on the substrate, each pad forming an interface with the ceramic;
a bonding material formed on the bonding pads;
a plurality of electrical leads secured by the bonding material to corresponding pads; and
means for preventing cracking of the ceramic material comprising a layer of adhesive formed over at least the interfaces between the pads and ceramic. - View Dependent Claims (19)
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Specification