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Electronic component package

  • US 20050156312A1
  • Filed: 03/15/2005
  • Published: 07/21/2005
  • Est. Priority Date: 10/08/2002
  • Status: Active Grant
First Claim
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1. An electronic component package comprising:

  • a ceramic substrate;

    a plurality of bonding pads formed on the substrate, each pad forming an interface with the ceramic;

    a bonding material formed on the bonding pads;

    a plurality of electrical leads secured by the bonding material to corresponding pads; and

    a layer of adhesive formed over at least the interfaces between the pads and ceramic

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  • 8 Assignments
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