Apparatus and methods for measuring parasitic capacitance and inductance of I/O leads on an electrical component using a network analyzer

• US 20050161801A1
• Filed: 03/18/2005
• Published: 07/28/2005
• Est. Priority Date: 08/30/2000
• Status: Active Grant

• Current Assignee: Aaron M. Schoenfeld, David R. Cuthbert, Mark T Van Horn, Richard N. Hedden
• Original Assignee: Aaron M. Schoenfeld, David R. Cuthbert, Mark T Van Horn, Richard N. Hedden
• Inventors: Schoenfeld, Aaron M., Van Horn, Mark T., Cuthbert, David R., Hedden, Richard N.
• Granted Patent: US 7,212,013 B2
• Time in Patent Office: Days
• US Class Current: 257/691
• CPC Class Codes: G01R 1/0408 Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets G01R1/067 takes precedence; mass production testing systems G01R31/59; testing of connections G01R31/66; for testing printed circuit boards G01R31/2808
• CPC Class Codes: G01R 1/06772 High frequency probes
• CPC Class Codes: G01R 27/2617 Measuring dielectric properties, e.g. constants testing dielectric strength G01R31/12; detecting insulation faults G01R31/52; G01R27/2688 takes precedence
• CPC Class Codes: G01R 31/2896 Testing of IC packages; Test features related to IC packages containers per se H01L23/02, encapsulations per se H01L23/28
• CPC Class Codes: G01R 31/66 Testing of connections, e.g. of plugs or non-disconnectable joints testing for incorrect line connections G01R31/55
• CPC Class Codes: H01L 2224/32013 the layer connector being larger than the bonding area, e.g. bond pad
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48253 connecting the wire to a potential ring of the item
• CPC Class Codes: H01L 2224/4847 the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01087 Francium [Fr]
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/30107 : Inductance
• CPC Class Codes: H01L 2924/3011 : Impedance

Abstract

Apparatus and methods are provided for measuring the potential for mutual coupling in an integrated circuit package of any type or configuration using a network analyzer in conjunction with a coaxial test probe. Simple, low-cost test fixturing and methods of testing may be used to measure the parasitic capacitance and inductance of one or more I/O leads of an integrated circuit package, the measured parasitic capacitances and inductances providing an indication of the susceptibility of the integrated circuit package to mutual coupling between electrical leads of the package or between an electrical lead and other components of the integrated circuit package.

Claims

1. In combination, a network analyzer and an electrical component device under test using the network analyzer, the combination comprising:

a network analyzer comprising;

a first port;

a second port;

a coaxial probe connected to one of the first port and the second port for establishing electrical contact on one or more electrical leads of an electrical component device under test; and

an electrical component device under test comprising;

a substrate;

a plurality of leads formed on said substrate, each lead of said plurality of leads at least including a conductive trace formed on a surface of said substrate, a conductive via extending through said substrate having one end thereof electrically connected to said conductive trace, and a ball lead formed on an opposing surface of said substrate and in electrical communication with an opposing end of said conductive via; and

a central conductive plane formed on at least a portion of said surface of said substrate, said conductive trace of at least one lead of said plurality of leads electrically connected to said central conductive plane.

2. The combination of claim 1, wherein said conductive trace of each lead of said plurality of leads is electrically connected to said central conductive plane.

3. The combination of claim 1, further comprising an encapsulant material disposed over at least a portion of said surface of said substrate and encasing said central conductive plane and at least a portion of each lead of said plurality of leads.

4. The combination of claim 1, further comprising:

a die-attach pad formed on said at least a portion of said surface of said substrate;

wherein said central conductive plane is formed on at least a portion of a surface of said die-attach pad.

5. In combination, a network analyzer and an electrical component device under test using the network analyzer, the combination comprising:

a network analyzer comprising;

a first port;

a second port;

a coaxial probe connected to one of the first port and the second port for establishing electrical contact on one or more electrical leads of an electrical component device under test; and

an electrical component device under test comprising;

a lead frame comprising;

a die-attach pad; and

a plurality of leads extending outwardly from said die-attach pad, each lead of said plurality of leads comprising a conductor having a bond end located proximate said die-attach pad and an opposing end; and

a central conductive plane formed on at least a portion of a surface of said die-attach pad, said bond end of said conductor of at least one lead of said plurality of leads electrically connected to said central conductive plane.

6. The combination of claim 5, wherein said bond end of said conductor of each lead of said plurality of leads is electrically connected to said central conductive plane.

7. The electrical component of claim 5, further comprising an encapsulant material encapsulating said die-attach pad, said central conductive plane, and at least a portion of each lead of said plurality of leads.

8. In combination, a network analyzer and an electrical component device under test using the network analyzer, the combination comprising:

a network analyzer comprising;

a first port;

a second port;

a coaxial probe connected to one of the first port and the second port for establishing electrical contact on one or more electrical leads of an electrical component device under test; and

an electrical component device under test comprising;

a die-attach pad;

a plurality of leads extending outwardly from said die-attach pad, each lead of said plurality of leads comprising a conductor having a bond end located proximate said die-attach pad and an opposing end; and

a central conductive plane formed on at least a portion of a surface of said die-attach pad, said bond end of at least one lead of said plurality of leads electrically connected to said central conductive plane.

9. The combination of claim 8, wherein said bond end of each lead of said plurality of leads is electrically connected to said central conductive plane.

10. The combination of claim 8, further comprising an encapsulant material encapsulating said die-attach pad, said central conductive plane, and at least a portion of each lead of said plurality of leads.

11. The combination of claim 8, wherein said die-attach pad and said plurality of leads comprise a lead frame.

12. In combination, a network analyzer and an electrical component device under test using the network analyzer, the combination comprising:

a network analyzer for measuring the parasitic inductance of a lead of an integrated circuit comprising;

a first port;

a second port; and

a coaxial probe connected to one of the first port and the second port for establishing electrical contact on one or more electrical leads of an electrical component device under test;

an electrical component device under test comprising;

a substrate;

a plurality of leads formed on said substrate, each lead of said plurality of leads at least including a conductive trace formed on a surface of said substrate, a conductive via extending through said substrate having one end thereof electrically connected to said conductive trace, and a ball lead formed on an opposing surface of said substrate and in electrical communication with an opposing end of said conductive via; and

a central conductive plane formed on at least a portion of said surface of said substrate, said conductive trace of at least one lead of said plurality of leads electrically connected to said central conductive plane; and

a chart from the network analyzer for the parasitic inductance of a lead of an integrated circuit of the electrical component device under test.

13. The combination of claim 12, wherein said conductive trace of each lead of said plurality of leads is electrically connected to said central conductive plane.

14. The combination of claim 12, further comprising an encapsulant material disposed over at least a portion of said surface of said substrate and encasing said central conductive plane and at least a portion of each lead of said plurality of leads.

15. The combination of claim 12, further comprising:

a die-attach pad formed on said at least a portion of said surface of said substrate;

wherein said central conductive plane is formed on at least a portion of a surface of said die-attach pad.

16. In combination, a network analyzer and an electrical component device under test using the network analyzer, the combination comprising:

a network analyzer for measuring the parasitic inductance of a lead comprising;

a first port;

a second port; and

a coaxial probe connected to one of the first port and the second port for establishing electrical contact on one or more electrical leads of an electrical component device under test;

an electrical component device under test comprising;

a lead frame comprising;

a die-attach pad;

a plurality of leads extending outwardly from said die-attach pad, each lead of said plurality of leads comprising a conductor having a bond end located proximate said die-attach pad and an opposing end; and

a central conductive plane formed on at least a portion of a surface of said die-attach pad, said bond end of said conductor of at least one lead of said plurality of leads electrically connected to said central conductive plane; and

a chart from the network analyzer for the parasitic inductance of a lead of an integrated circuit of the electrical component device under test.

17. The combination of claim 16, wherein said bond end of said conductor of each lead of said plurality of leads is electrically connected to said central conductive plane.

18. The electrical component of claim 16, further comprising an encapsulant material encapsulating said die-attach pad, said central conductive plane, and at least a portion of each lead of said plurality of leads.

19. In combination, a network analyzer and an electrical component device under test using the network analyzer, the combination comprising:

a network analyzer comprising;

a first port;

a second port; and

a coaxial probe connected to one of the first port and the second port for establishing electrical contact on one or more electrical leads of an electrical component device under test;

an electrical component device under test comprising;

a die-attach pad;

a plurality of leads extending outwardly from said die-attach pad, each lead of said plurality of leads comprising a conductor having a bond end located proximate said die-attach pad and an opposing end; and

a central conductive plane formed on at least a portion of a surface of said die-attach pad, said bond end of at least one lead of said plurality of leads electrically connected to said central conductive plane; and

a chart from the network analyzer for the parasitic inductance of a lead of an integrated circuit of the electrical component device under test.

20. The combination of claim 19, wherein said bond end of each lead of said plurality of leads is electrically connected to said central conductive plane.

21. The combination of claim 19, further comprising an encapsulant material encapsulating said die-attach pad, said central conductive plane, and at least a portion of each lead of said plurality of leads.

22. The combination of claim 19, wherein said die-attach pad and said plurality of leads comprise a lead frame.