Light-emitting structures

• US 20050174049A1
• Filed: 02/05/2004
• Published: 08/11/2005
• Est. Priority Date: 02/05/2004
• Status: Active Grant

• Current Assignee: General LED, Inc.
• Original Assignee: Marpole International, Inc. (Anything Technologies Media, Inc.)
• Inventors: Ratcliffe, William R.
• Granted Patent: US 7,332,861 B2
• Time in Patent Office: Days
• US Class Current: 313/506
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 25/167 comprising optoelectronic devices, e.g. LED, photodiodes
• CPC Class Codes: H01L 27/15 including semiconductor components having potential barriers, specially adapted for light emission
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 2924/12044 OLED
• CPC Class Codes: H01L 2924/3011 Impedance
• CPC Class Codes: H01L 33/44 characterised by the coatings, e.g. passivation layer or anti-reflective coating
• CPC Class Codes: H01L 33/48 characterised by the semiconductor body packages
• CPC Class Codes: Y10S 362/80 Light emitting diode

Abstract

Light-emitting structures of reduced size are realized with combinations of light-emitting diodes, resistive and conductive films, and interconnect members. Other embodiments are provided which simplify fabrication and assembly.

Claims

1. A light-emitting structure, comprising:

a light-emitting diode having an anode and a cathode; and

a resistive member carried over at least one of said anode and said cathode.

2. The structure of claim 1, wherein said resistive member has a resistivity and a cross section configured to realize a predetermined resistance.

3. The structure of claim 1, wherein said resistive member comprises a resistive film.

4. The structure of claim 1, wherein said resistive member comprises a thin film resistor.

5. The structure of claim 1, wherein said resistive member comprises a thick film resistor.

6. The structure of claim 1, further including a conductive film inserted between said resistive member and said light-emitting diode.

7. The structure of claim 1, wherein said resistive member is carried over said anode and further including an interconnect member coupled to a selected one of said cathode and said resistive member.

8. The structure of claim 7, wherein said interconnect member is coupled through at least one contact.

9. The structure of claim 7, wherein said interconnect member includes a tab that couples to said selected one.

10. The structure of claim 7, further including a wire bond that couples said interconnect member to said selected one.

11. The structure of claim 1, wherein said resistive member is carried over said cathode and further including an interconnect member coupled to a selected one of said anode and said resistive member.

12. The structure of claim 11, wherein said interconnect member is coupled through at least one contact.

13. The structure of claim 11, wherein said interconnect member includes a tab that couples to said selected one.

14. The structure of claim 11, further including a wire bond that couples said interconnect member to said selected one.

15. The structure of claim 1, wherein said light-emitting diode is a semiconductor light-emitting diode.

16. The structure of claim 1, wherein said light-emitting diode is an organic light-emitting diode.

17. The structure of claim 1, wherein said light-emitting diode is a polymer light-emitting diode.

18. A light-emitting structure, comprising:

a light-emitting diode having an anode and a cathode;

a resistive member carried over a selected one of said anode and said cathode; and

first and second contacts respectively on first and second portions of said resistive member.

19. The structure of claim 18, further including a conductive film inserted between said resistive member and said light-emitting diode.

20. The structure of claim 18, wherein said resistive member has a resistivity and a cross section configured to realize predetermined resistances between said first and second contacts and said light-emitting diode.

21. The structure of claim 18, further including first and second interconnect members respectively coupled to said first and second contacts.

22. The structure of claim 18, wherein said resistive member comprises a resistive film.

23. The structure of claim 18, wherein said resistive member comprises a thin film resistor.

24. The structure of claim 18, wherein said resistive member comprises a thick film resistor.

25. The structure of claim 18, wherein said light-emitting diode is a semiconductor light-emitting diode.

26. The structure of claim 18, wherein said light-emitting diode is an organic light-emitting diode.

27. The structure of claim 18, wherein said light-emitting diode is a polymer light-emitting diode.

28. A light-emitting structure, comprising:

a light-emitting diode having an anode and a cathode; and

at least first and second spaced resistive members carried over a selected one of said anode and said cathode.

29. the structure of claim 28, further including a conductive film inserted between each of said resistive members and said light-emitting diode.

30. The structure of claim 28, wherein each of said resistive members has a resistivity and a cross section configured to realize a respective predetermined resistance.

31. The structure of claim 28, further including an interconnect member coupled to a selected one of said resistive films.

32. The structure of claim 28, wherein said resistive member comprises a resistive film.

33. The structure of claim 28, wherein each resistive member comprises a thin film resistor.

34. The structure of claim 28, wherein each resistive member comprises a thick film resistor.

35. The structure of claim 28, wherein said light-emitting diode is a semiconductor light-emitting diode.

36. The structure of claim 28, wherein said light-emitting diode is an organic light emitting diode.

37. The structure of claim 28, wherein said light-emitting diode is a polymer light-emitting diode.