Backlight module and heat dissipation structure thereof

• US 20050180142A1
• Filed: 02/17/2004
• Published: 08/18/2005
• Est. Priority Date: 02/17/2004
• Status: Active Grant

• Current Assignee: AU Optronics Corporation
• Original Assignee: AU Optronics Corporation
• Inventors: Tsai, Yi-Shiuan
• Granted Patent: US 6,966,674 B2
• Time in Patent Office: Days
• US Class Current: 362/294
• CPC Class Codes: F21K 9/00 Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
• CPC Class Codes: F21V 29/89 Metals
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: G02B 6/0073 Light emitting diode [LED]
• CPC Class Codes: G02B 6/0085 Means for removing heat created by the light source from the package heat extraction or cooling elements for semiconductor light sources in general H01L33/64
• CPC Class Codes: G02F 1/133603 with LEDs
• CPC Class Codes: G02F 1/133628 with cooling means
• CPC Class Codes: H05K 1/0204 using means for thermal conduction connection in the thickness direction of the substrate H05K1/0207 takes precedence
• CPC Class Codes: H05K 2201/10106 Light emitting diode [LED]
• CPC Class Codes: H05K 2201/10416 Metallic blocks or heatsinks completely inserted in a PCB metallic supports H05K3/0061

Abstract

A backlight module and heat dissipation structure thereof. The heat dissipation structure is used for a backlight module which comprises a circuit board having a through hole with a light emitting diode (LED) corresponding thereto and disposed on one side of the circuit board. The heat dissipation structure comprises a heat conducting portion thermo-conductively connected to the LED and positioned in the through hole, a thermal conductive element disposed between the heat conducting portion and the LED, and a heat dissipating portion thermo-conductively connected to the heat conducting portion. Heat from the LED is conducted through the thermal conductive element and the heat conducting portion to the heat dissipation portion.

Claims

1. A heat dissipation structure for a backlight module comprising a circuit board having a through hole with a light emitting diode (LED) corresponding thereto, disposed on one side of the circuit board, comprising:

a heat conducting portion thermo-conductively connected to the LED and positioned in the through hole;

a thermal conductive element disposed between the heat conducting portion and the LED; and

a heat dissipating portion thermo-conductively connected to the heat conducting portion.

2. The heat dissipation structure as claimed in claim 1, wherein the thermal conductive element contacts the heat conducting portion and the LED.

3. The heat dissipation structure as claimed in claim 2, wherein the thermal conductive element comprises a thermal conductive pad.

4. The heat dissipation structure as claimed in claim 2, wherein the thermal conductive element comprises a layer of thermal conductive paste.

5. The heat dissipation structure as claimed in claim 1, wherein the heat conducting portion and the heat dissipating portion are integrally formed.

6. The heat dissipation structure as claimed in claim 1, wherein the heat conducting portion comprises a heat conducting column.

7. The heat dissipation structure as claimed in claim 1, wherein the heat dissipation portion comprises a heat dissipation plate.

8. The heat dissipation structure as claimed in claim 1, wherein the heat conducting portion and the heat dissipation portion are made of metal.

9. The heat dissipation structure as claimed in claim 1, wherein the heat conducting portion and the heat dissipation portion are made of engineering plastic.

10. A backlight module, comprising:

a housing;

a circuit board having a plurality of through holes and disposed on the housing;

a plurality of light emitting diodes (LEDs) corresponding to the through holes and disposed on and electrically connected to the circuit board;

a plurality of heat conducting portions thermo-conductively connected to the LEDs and disposed in the through holes;

a plurality of thermal conductive elements disposed between the LEDs and the heat conducting portions; and

at least one heat dissipation portion thermo-conductively connected to the heat conducting portions and positioned between the circuit board and the housing.

11. The backlight module as claimed in claim 10, wherein the heat dissipation portion contacts the housing.

12. The backlight module as claimed in claim 10, wherein the thermal conductive element contacts the heat conducting portion and the LED.

13. The backlight module as claimed in claim 12, wherein the thermal conductive element comprises a thermal conductive pad.

14. The backlight module as claimed in claim 12, wherein the thermal conductive element comprises a layer of thermal conductive paste.

15. The backlight module as claimed in claim 10, wherein the heat conducting portion and the heat dissipating portion are integrally formed.

16. The backlight module as claimed in claim 10, wherein the heat conducting portion comprises a heat conducting column.

17. The backlight module as claimed in claim 10, wherein the heat dissipation portion comprises a heat dissipation plate.

18. The backlight module as claimed in claim 10, wherein the heat conducting portion and the heat dissipation portion are made of metal.

19. The backlight module as claimed in claim 10, wherein the heat conducting portion and the heat dissipation portion are made of engineering plastic.