Semiconductor device, IC card, IC tag, RFID, transponder, bills, securities, passport, electronic apparatus, bag, and clothes

• US 20050180187A1
• Filed: 01/28/2005
• Published: 08/18/2005
• Est. Priority Date: 02/12/2004
• Status: Active Grant

• Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Original Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Inventors: Koyama, Jun
• Granted Patent: US 7,663,473 B2
• Time in Patent Office: Days
• US Class Current: 365/100
• CPC Class Codes: G06K 19/073 Special arrangements for circuits, e.g. for protecting identification code in memory protection against unauthorised use of computer memory G06F12/14
• CPC Class Codes: G11C 17/12 using field-effect devices
• CPC Class Codes: H01L 27/1214 comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
• CPC Class Codes: H01L 27/1266 the substrate on which the devices are formed not being the final device substrate, e.g. using a temporary substrate
• CPC Class Codes: H01L 27/13 combined with thin-film or thick-film passive components

Abstract

A contactless ID chip to which a signal is inputted from an antenna by a wireless means, where data can be written only once. In the contactless ID chip having a nonvolatile EEPROM, data indicating whether writing is performed to the EEPROM is written simultaneously with basic data writing, and once writing is performed to the EEPROM, other data cannot be written thereto.

Claims

1. A semiconductor device comprising:

a modulation circuit, a demodulation circuit, a logic circuit, a memory circuit, and an antenna circuit which are formed over an insulating substrate,

wherein the modulation circuit and the demodulation circuit are electrically connected to the antenna circuit,

wherein the demodulation circuit is connected to the logic circuit,

wherein the memory circuit includes means for storing an output signal of the logic circuit,

wherein the memory circuit is a nonvolatile memory circuit for storing data by charge injection, and

wherein a control circuit capable of writing data to the memory circuit only once is provided.

2. The semiconductor device according to claim 1, wherein an element constituting the nonvolatile memory circuit stores data by charge injection into a floating gate.

3. The semiconductor device according to claim 1, wherein an element constituting the nonvolatile memory circuit stores data by charge injection into a gate insulating film.

4. The semiconductor device according to claim 1, wherein a power supply used by the nonvolatile memory circuit for storing data is obtained by rectifying and boosting a signal outputted from the antenna circuit.

5. The semiconductor device according to claim 1, wherein a power supply used by the nonvolatile memory circuit for storing data is obtained from an external high voltage power supply.

6. The semiconductor device according to claim 1, wherein at least one of the modulation circuit, the demodulation circuit, the logic circuit, and the memory circuit is constituted by a thin film transistor.

7. The semiconductor device according to claim 1, wherein the insulating substrate is selected from the group consisting of a glass substrate, a plastic substrate and a film insulator.

8. The semiconductor device according to claim 1, wherein the antenna circuit is formed over at least one of the modulation circuit, the demodulation circuit, the logic circuit, and the memory circuit.

9. The semiconductor device according to claim 1, wherein a signal inputted to the antenna circuit is a wireless signal.

10. A product having the semiconductor device according to claim 1, wherein the product is selected from the group consisting of an IC card, an IC tag, an RFID, a transponder, a bill, a security, a passport, an electronic apparatus, a bag, and clothes.

11. A semiconductor device comprising:

a modulation circuit, a demodulation circuit, a logic circuit, a memory circuit, and an antenna circuit which are formed over an insulating substrate,

wherein the modulation circuit and the demodulation circuit are electrically connected to the antenna circuit,

wherein the demodulation circuit is connected to the logic circuit,

wherein the memory circuit includes means for storing an output signal of the logic circuit,

wherein the memory circuit is a nonvolatile memory circuit for storing data by charge injection, and

wherein the logic circuit includes means for controlling whether data can be written to the memory circuit or not depending on the data stored in the memory circuit.

12. The semiconductor device according to claim 11, wherein an element constituting the nonvolatile memory circuit stores data by charge injection into a floating gate.

13. The semiconductor device according to claim 11, wherein an element constituting the nonvolatile memory circuit stores data by charge injection into a gate insulating film.

14. The semiconductor device according to claim 11, wherein a power supply used by the nonvolatile memory circuit for storing data is obtained by rectifying and boosting a signal outputted from the antenna circuit.

15. The semiconductor device according to claim 11, wherein a power supply used by the nonvolatile memory circuit for storing data is obtained from an external high voltage power supply.

16. The semiconductor device according to claim 11, wherein at least one of the modulation circuit, the demodulation circuit, the logic circuit, and the memory circuit is constituted by a thin film transistor.

17. The semiconductor device according to claim 11, wherein the insulating substrate is selected from the group consisting of a glass substrate, a plastic substrate and a film insulator.

18. The semiconductor device according to claim 11, wherein the antenna circuit is formed over at least one of the modulation circuit, the demodulation circuit, the logic circuit, and the memory circuit.

19. The semiconductor device according to claim 11, wherein a signal inputted to the antenna circuit is a wireless signal.

20. A product having the semiconductor device according to claim 11, wherein the product is selected from the group consisting of an IC card, an IC tag, an RFID, a transponder, a bill, a security, a passport, an electronic apparatus, a bag, and clothes.

21. A semiconductor device comprising:

an antenna circuit;

a modulation circuit electrically connected to the antenna circuit;

a demodulation circuit electrically connected to the antenna circuit;

a logic circuit electrically connected to the demodulation circuit;

a memory circuit having means for storing an output signal of the logic circuit; and

a control circuit capable of writing data to the memory circuit only once,

wherein the memory circuit is a nonvolatile memory circuit for storing data by charge injection.

22. The semiconductor device according to claim 21, wherein an element constituting the nonvolatile memory circuit stores data by charge injection into a floating gate.

23. The semiconductor device according to claim 21, wherein an element constituting the nonvolatile memory circuit stores data by charge injection into a gate insulating film.

24. The semiconductor device according to claim 21, wherein a power supply used by the nonvolatile memory circuit for storing data is obtained by rectifying and boosting a signal outputted from the antenna circuit.

25. The semiconductor device according to claim 21, wherein a power supply used by the nonvolatile memory circuit for storing data is obtained from an external high voltage power supply.

26. The semiconductor device according to claim 21, wherein at least one of the modulation circuit, the demodulation circuit, the logic circuit, and the memory circuit is constituted by a thin film transistor.

27. The semiconductor device according to claim 21, wherein the insulating substrate is selected from the group consisting of a glass substrate, a plastic substrate and a film insulator.

28. The semiconductor device according to claim 21, wherein the antenna circuit is formed over at least one of the modulation circuit, the demodulation circuit, the logic circuit, and the memory circuit.

29. The semiconductor device according to claim 21, wherein a signal inputted to the antenna circuit is a wireless signal.

30. A product having the semiconductor device according to claim 21, wherein the product is selected from the group consisting of an IC card, an IC tag, an RFID, a transponder, a bill, a security, a passport, an electronic apparatus, a bag, and clothes.