Image sensor module and camera module package including the same

• US 20050184352A1
• Filed: 09/20/2004
• Published: 08/25/2005
• Est. Priority Date: 02/20/2004
• Status: Active Grant

• Current Assignee: Hanwha Techwin Co., Ltd. (Hanwha Corporation)
• Original Assignee: Samsung Techwin Corporation (Hanwha Corporation)
• Inventors: Jeong, Ha-cheon, Hwang, San-deok, Yoon, Dong-hyeon, Lyu, Jung-kang
• Granted Patent: US 7,456,901 B2
• Time in Patent Office: Days
• US Class Current: 257/432
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/49175 Parallel arrangements
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding
• CPC Class Codes: H04N 23/51 Housings
• CPC Class Codes: H04N 23/55 Optical parts specially adapted for electronic image sensors; Mounting thereof

Abstract

A camera module package includes an image sensor module that can be formed as a chip scale package (CSP) with a wire bonding structure. The image sensor module includes an image sensing device unit having an image sensing device, a pixel area part formed on a surface of the image sensing device, and a device connecting pad formed on a surface of the image sensing device for electrically connecting to external devices; a circuit board to which the image sensing device unit is attached on one surface, to which a board connecting pad that is electrically connected to the image sensing device unit is formed on the other surface, and that contains holes corresponding to locations of the pixel area part and the device connecting pad; and a connecting unit for connecting the device connecting pad and the board connecting pad.

Claims

1. An image sensor module comprising:

an image sensing device unit that comprises an image sensing device and a pixel area part;

a device connecting pad formed on a surface of the image sensing device;

a circuit board that comprises at least one hole corresponding to locations of the pixel area part and the device connecting pad;

a board connecting pad; and

a connecting unit for connecting the device connecting pad and the board connecting pad,

wherein the board connecting pad is attached to one surface of the circuit board and the image sensing device unit is attached to the opposite surface of the circuit board.

2. The image sensor module of claim 1, wherein the pixel area part is formed on a surface of the image sensing device.

3. The image sensor module of claim 1, wherein the pixel area part collects light images to be photographed.

4. The image sensor module of claim 1, wherein the device connecting pad assists in forming an electrical connection to an external device.

5. The image sensor module of claim 1, wherein the image sensing device unit is attached to the circuit board so that the image sensing device is attached to the circuit board.

6. The image sensor module of claim 1, wherein the connecting unit is a bonding wire for connecting the circuit board and the image sensing device unit in a wire bonding method.

7. The image sensor module of claim 1, wherein the perimeter of the image sensing device unit does not extend beyond the surface of the circuit board that is opposite to the surface to which the image sensing device unit is attached.

8. The image sensor module of claim 1, wherein the pixel area part is formed on a surface of the image sensing device.

9. The image sensor module of claim 8, wherein the pixel area part and the device connecting pad are located such that a single hole in the circuit board corresponds to the locations of the pixel area part and the device connecting pad.

10. The image sensor module of claim 8, wherein the pixel area part is located corresponding to one hole in the circuit board, and the device connecting pad is located corresponding to a different hole in the circuit board.

11. A camera module package comprising:

an image sensing device unit that comprises an image sensing device and a pixel area part;

a device connecting pad formed on a surface of the image sensing device;

a circuit board that comprises at least one hole corresponding to locations of the pixel area part and the device connecting pad;

a board connecting pad;

a housing attached to the circuit board; and

a connecting unit for connecting the device connecting pad and the board connecting pad,

wherein the board connecting pad is attached to one surface of the circuit board and the image sensing device unit is attached to the opposite surface of the circuit board.

12. The camera module package of claim 11, wherein the housing maintains an airtight status for the module.

13. The camera module package of claim 11, wherein the housing comprises a lens barrel unit for passing through light images collected from outside the module.

14. The camera module package of claim 12, wherein the housing comprises a cover installed on an outer end portion of the lens barrel unit.

15. The camera module package of claim 12, wherein the housing comprises an infrared ray and reflection prevention filter installed at an inner end portion of the lens barrel unit near the pixel area part, for shielding against infrared rays and preventing light induced into the image sensing device unit from being reflected.

16. The camera module package of claim 12, wherein the housing comprises a lens being mounted in the lens barrel unit so as to be moved along threads that are formed on the inner surface of the lens barrel unit.

17. The camera module package of claim 11, wherein the pixel area part is formed on a surface of the image sensing device.

18. The camera module package of claim 11, wherein the pixel area part collects light images to be photographed.

19. The camera module package of claim 11, wherein the device connecting pad assists in forming an electrical connection to an external device.

20. The camera module package of claim 11, wherein the image sensing device unit is attached to the circuit board so that the image sensing device is attached to the circuit board.

21. The camera module package of claim 11, wherein the connecting unit is a bonding wire for connecting the circuit board and the image sensing device unit in a wire bonding method.

22. The camera module package of claim 11, wherein the perimeter of the image sensing device unit does not extend beyond the surface of the circuit board that is opposite to the surface to which the image sensing device unit is attached.

23. The camera module package of claim 11, wherein the pixel area part is formed on a surface of the image sensing device.

24. The camera module package of claim 23, wherein the pixel area part and the device connecting pad are located such that a single hole in the circuit board corresponds to the locations of the pixel area part and the device connecting pad.

25. The camera module package of claim 23, wherein the pixel area part is located corresponding to one hole in the circuit board, and the device connecting pad is located corresponding to a different hole in the circuit board.

26. The camera module package of claim 11, wherein the housing, a hole in the circuit board, and the pixel area part are lined up so that light may pass through the housing and the hole and contact the pixel area part.

27. An image obtaining apparatus comprising a camera module package that comprises:

an image sensing device unit that comprises an image sensing device and a pixel area part;

a device connecting pad formed on a surface of the image sensing device;

a circuit board that comprises at least one hole corresponding to locations of the pixel area part and the device connecting pad;

a board connecting pad;

a housing attached to the circuit board; and

a connecting unit for connecting the device connecting pad and the board connecting pad,

wherein the board connecting pad is attached to one surface of the circuit board and the image sensing device unit is attached to the opposite surface of the circuit board