Integrated lens and chip assembly for a digital camera

• US 20050185088A1
• Filed: 02/20/2004
• Published: 08/25/2005
• Est. Priority Date: 02/20/2004
• Status: Active Grant

• Current Assignee: Nan Chang O-Film Optoelectronics Technology, Ltd.
• Original Assignee: Flextronics International USA Incorporated (Flex, Ltd.)
• Inventors: Shangguan, Dongkai, Tam, Samuel Waising, Kale, Vidyadhar Sitaram
• Granted Patent: US 7,872,686 B2
• Time in Patent Office: Days
• US Class Current: 348/374
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 27/14623 Optical shielding
• CPC Class Codes: H01L 27/14625 Optical elements or arrangements associated with the device
• CPC Class Codes: H01L 27/14818 Optical shielding
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 31/02325 the optical elements not being integrated nor being directly associated with the device
• CPC Class Codes: H04N 23/54 Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
• CPC Class Codes: H04N 23/55 Optical parts specially adapted for electronic image sensors; Mounting thereof

Abstract

A integrated camera module (10, 10a) for capturing video images in very small digital cameras, cell phones, personal digital assistants, and the like. A lens assembly (24, 24a) is rigidly affixed in relation to a sensor array area (14) of a camera chip (12) by a molding (26). The molding (26) is formed on the camera chip (12), and optionally on a printed circuit board (16, 16a) on which the camera chip (12) is mounted. The lens assembly (24, 24a) is held in place in a recess (29) of the molding (26) by an adhesive (28). The molding (26) is formed such that a precise gap (30) exists between the lens assembly (24) and a sensor array area (14) of the camera chip (12).

Claims

1. A camera module apparatus, comprising:

a camera integrated circuit chip;

a lens; and

a molding formed on the integrated circuit chip for holding the lens such that the lens is positioned thereby in relation to the integrated circuit chip.

2. The camera module apparatus of claim 1, wherein:

the camera integrated circuit chip is mounted on a printed circuit board.

3. The camera module apparatus of claim 1, further comprising:

a protective cover over the integrated circuit chip.

4. The camera module apparatus of claim 3, wherein:

the protective cover is a molded spacer.

5. The camera module apparatus of claim 3, wherein:

the protective cover is a glass sheet.

6. The camera module apparatus of claim 1, wherein:

the molding has a recess for receiving the lens.

7. The camera module apparatus of claim 1, wherein:

the lens is held in place on the molding by an adhesive.

8. The camera module apparatus of claim 1, wherein:

the molding has a recess for positioning the lens relative to the integrated circuit chip.

33. The camera apparatus of claim 31, wherein:

the lens assembly is rigidly affixed within the lens assembly receiving apparatus.

9. An integrated camera circuit and lens module, comprising:

a camera integrated circuit; and

a lens assembly; and

wherein

the lens assembly is affixed to the integrated circuit.

10. The integrated camera circuit and lens module of claim 9, wherein:

the lens assembly is rigidly affixed to the integrated circuit such that there is a gap between at least a portion of the lens assembly and a sensor array of the integrated circuit.

11. The integrated camera circuit and lens module of claim 9, wherein:

the lens assembly is attached to the integrated circuit by a molded component.

12. The integrated camera circuit and lens module of claim 11, wherein:

the lens assembly is attached to the molding by an adhesive.

13. The integrated camera circuit and lens module of claim 9, wherein:

the integrated circuit is mounted on a circuit board.

14. The integrated camera circuit and lens module of claim 9, further comprising:

a protective cover over the integrated circuit chip.

15. The integrated camera circuit and lens module of claim 14, wherein:

the protective cover is a molded spacer.

16. The integrated camera circuit and lens module of claim 14, wherein:

the protective cover is a glass sheet.

17. A method for producing a camera module, comprising:

molding a receptacle over an integrated circuit;

inserting a lens assembly into the receptacle; and

securing the lens assembly into the receptacle.

18. The method of claim 17, wherein:

the lens assembly is secured to the receptacle by an adhesive.

19. The method of claim 17, wherein:

the integrated circuit is secured to a circuit board before the receptacle is molded over the integrated circuit.

20. The method of claim 17, wherein:

the receptacle includes a recessed portion for receiving the lens assembly.

21. The method of claim 20, wherein:

the recess portion includes a projection for fixing the distance of the lens assembly from the integrated circuit.

22. The method of claim 17, wherein:

the camera module is affixed to a flex circuit.

23. The method of claim 17, further comprising:

placing a protective cover over the integrated circuit.

24. The method of claim 23, wherein:

the step of placing the protective cover over the integrated circuit occurs during the step of molding a receptacle over the integrated circuit.

25. The method of claim 23, wherein:

the protective cover is a molded spacer.

26. The method of claim 23, wherein:

the protective cover is a glass plate.

27. An camera apparatus, comprising:

an integrated circuit camera apparatus having thereon a photosensitive array; and

a lens assembly for focusing light on the photosensitive array;

wherein

the lens assembly is rigidly affixed on the integrated circuit camera apparatus.

28. The camera apparatus of claim 27, wherein:

the lens assembly has a housing for receiving at least one lens.

29. The camera apparatus of claim 27, wherein:

the lens assembly has a housing for receiving two lenses.

30. The camera apparatus of claim 27, wherein:

the integrated circuit camera apparatus is affixed to a circuit board.

31. The camera apparatus of claim 27, wherein:

the integrated circuit camera apparatus is affixed to a circuit board; and

a lens assembly receiving apparatus is affixed to the circuit board.

32. The camera apparatus of claim 31, wherein:

the lens assembly receiving apparatus is a molded receptacle.

34. The camera apparatus of claim 31, wherein;

the lens assembly is affixed within the lens assembly receiving apparatus by an adhesive.

35. The camera apparatus of claim 27, further comprising:

a protective cover fixed between the integrated circuit camera apparatus and the lens assembly.

36. The camera apparatus of claim 35, wherein:

the protective cover is a molded spacer.

37. The camera apparatus of claim 35, wherein:

the protective cover is a glass plate.

38. The camera apparatus of claim 35, wherein:

the protective cover is held in place by an overmold formed over the integrated circuit camera apparatus.

39. A camera module apparatus, comprising:

a camera integrated circuit chip;

a lens; and

means for holding the lens such that the lens is positioned thereby in relation to the integrated circuit chip.