Method of manufacturing electronic components including a method for three dimensional inspection

  • US 20050190961A1
  • Filed: 02/28/2005
  • Published: 09/01/2005
  • Est. Priority Date: 01/16/1998
  • Status: Active Grant
First Claim
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1. A method of manufacturing a ball grid array (BGA) device, the method comprising:

  • placing an electronic circuit into a BGA package;

    making a three dimensional inspection of a lead on the BGA package; and

    selecting the combination of the electronic circuit placed inside the BGA package as a produced BGA device based upon the results of the three dimensional inspection;

    wherein the three dimensional inspection comprises;

    illuminating the lead;

    providing fixed optical elements to obtain both a bottom view of the lead and a side perspective view of the lead;

    receiving at least the bottom view and the side perspective view of the lead using a single camera;

    transmitting the bottom view and the side perspective view of the lead to memory as pixel values;

    determining a first lead reference pixel position in the bottom view;

    determining a second lead reference pixel position in the side view; and

    converting the first and second lead reference pixel positions into a world value by using pixel values and parameters determined during a calibration.

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