Interference display plate and manufacturing method thereof

• US 20050195462A1
• Filed: 07/02/2004
• Published: 09/08/2005
• Est. Priority Date: 03/05/2004
• Status: Abandoned Application

• Current Assignee: Snaptrack Incorporated (Qualcomm, Inc.)
• Original Assignee: Prime View International Company Limited (E Ink Holdings Incorporated)
• Inventors: Lin, Wen-Jian
• Application Number:
  US10/884,555
• Publication Number:
  US 20050195462A1
• Time in Patent Office: Days
• US Class Current: 359/290
• CPC Class Codes: G02B 26/001 based on interference in an adjustable optical cavity interference filters G02B5/28; devices or arrangements using multiple reflections in spectrometry or monochromators G01J3/26

Abstract

An optical interference display plate has a substrate, a protection structure, a plurality of color-changeable pixels and a plurality of supports. The color-changeable pixels are located on the substrate. The protection structure encloses the color-changeable pixels such that a gap is maintained between it and the substrate. The supports are located between the color-changeable pixels and the protection structure, and ends thereof are higher than the color-changeable pixels for preventing the color-changeable pixels from being damaged by a deformation of the protection structure.

Claims

1. An optical interference display panel, comprising:

a substrate;

a plurality of color-changeable pixels on the substrate;

a protection structure covering the color-changeable pixels, wherein a gap is preserved between the protection structure and the color-changeable pixels; and

a plurality of first supports located between the color-changeable pixels and the protection structure, and a height of first ends of the first supports is higher than a height of the color-changeable pixels;

wherein the first supports protect the color-changeable pixels from being damaged from a deformation of the protection structure.

2. The optical interference display panel of claim 1, wherein each of the color-changeable pixels comprises:

a first electrode on the substrate;

a second electrode situated in parallel with the first electrode substantially; and

a second support located on the first electrode to support the second electrode, wherein a portion of the second support is not covered by the second electrode.

3. The optical interference display panel of claim 2, wherein the first supports are located on the first electrodes.

4. The optical interference display panel of claim 2, wherein the first supports are located on portions of the second supports.

5. The optical interference display panel of claim 1, wherein the first ends of the first supports are connected to the protection structure, and second ends of the first supports are connected to the color-changeable pixels.

6. The optical interference display panel of claim 5, wherein the protection structure is adhered to the substrate with an adhesive.

7. The optical interference display panel of claim 6, wherein the adhesive comprises a UV glue or a thermosetting adhesive.

8. The optical interference display panel of claim 1, wherein the first ends of the first supports are not connected to the protection structure, and second ends of the first supports are connected to the color-changeable pixels.

9. The optical interference display panel of claim 8, wherein the protection structure is adhered to the substrate with an adhesive, and the adhesive comprises spacers to keep a predetermined distance between the protection structure and the substrate.

10. The optical interference display panel of claim 9, wherein the adhesive comprises a UV glue or a thermosetting adhesive.

11. The optical interference display panel of claim 1, wherein a material of the first supports is a photoresist, a dielectric material or a conductive material.

12. An method for manufacturing an optical interference display panel, the method comprising:

providing a substrate;

forming a plurality of color-changeable pixels on the substrate;

forming a plurality of first supports on the color-changeable pixels, and a height of first ends of the first supports is higher than a height of the color-changeable pixels; and

joining a protection structure to the substrate in order to position the color-changeable pixels between the protection structure and the substrate.

13. The method of claim 12, wherein the step of forming the color-changeable pixels comprises:

forming a first electrode on the substrate;

forming a sacrificial layer on the first electrode;

forming a plurality of first openings in the first electrode and the sacrificial layer;

forming a second support in each of the first openings;

forming a second electrode on the sacrificial layer and the second support, wherein a portion of the second support is not covered by the second electrode; and

removing the sacrificial layer by a release etching process.

14. The method of claim 13, wherein the method further comprises forming a plurality of second openings in the first electrode and the sacrificial layer, and forming the first supports in the second openings before removing the sacrificial layer.

15. The method of claim 13, wherein the method further comprises forming the first supports on the portions of the second supports before removing the sacrificial layer.

16. The method of claim 12, wherein the first ends of the first supports are connected to the protection structure, and second ends of the first supports are connected to the color-changeable pixels.

17. The method of claim 12, wherein the first ends of the first supports are not connected to the protection structure, and second ends of the first supports are connected to the color-changeable pixels.

18. The method of claim 12, wherein the step of joining comprises adhering the protection structure to the substrate with an adhesive.

19. The method claim 18, wherein the adhesive comprises spacers to keep a predetermined distance between the protection structure and the substrate.

20. The method of claim 18, wherein the adhesive comprises a UV glue or a thermosetting adhesive.

21. The method of claim 12, wherein a material of the first supports is a photoresist, a dielectric material or a conductive material.