High density front access device

• US 20050201073A1
• Filed: 02/22/2005
• Published: 09/15/2005
• Est. Priority Date: 03/15/2004
• Status: Active Grant

• Current Assignee: Microsemi Corp. - Analog Mixed Signal Group, Ltd. (Microchip Technology Incorporated)
• Original Assignee: Microsemi Corp. - Analog Mixed Signal Group, Ltd. (Microchip Technology Incorporated)
• Inventors: Pincu, David, Epstein, Haim
• Granted Patent: US 7,259,325 B2
• Time in Patent Office: Days
• US Class Current: 361/797
• CPC Class Codes: H04Q 1/02 Constructional details
• CPC Class Codes: H04Q 1/021 using pivoting mechanisms for accessing the interior of the apparatus
• CPC Class Codes: H04Q 1/023 using sliding mechanisms for accessing the interior of the apparatus
• CPC Class Codes: H04Q 1/09 Frames or mounting racks not otherwise provided for
• CPC Class Codes: H04Q 2201/02 Details of frames
• CPC Class Codes: H04Q 2201/08 Pivotable parts
• CPC Class Codes: H04Q 2201/10 Housing details
• CPC Class Codes: H05K 7/1448 with connections to the front board

Abstract

A high density device comprising: a chassis frame configured and dimensioned for mounting in a standardized telecommunications rack, the chassis frame defining a front plane and a back plane, the front plane being substantially coincident with a front support of the telecommunications rack; a sub-module chassis secured to the chassis frame, the sub-module chassis exhibiting a proximal face and a distal face; a first plurality of jacks located distal of the proximal face of the sub-module chassis; and a passageway formed between the sub-module chassis and an inner wall of the chassis frame, the passageway configured and dimensioned for the passage of cabling for connection to the first plurality of jacks.

Claims

1. A high density device comprising:

a chassis frame configured and dimensioned for mounting in a standardized telecommunications rack;

a sub-module chassis secured to said chassis frame, said sub-module chassis exhibiting a proximal face and a distal face;

a first plurality of jacks located distal of said proximal face of said sub-module chassis; and

a passageway formed between said sub-module chassis and an inner wall of said chassis frame, said passageway configured and dimensioned for the passage of cabling for connection to said first plurality of jacks.

2. A high density device according to claim 1, further comprising a second plurality of jacks appearing on said proximal face of said sub-module chassis.

3. A high density device according to claim 2, further comprising a network management jack appearing on said proximal face of said sub-module chassis.

4. A high density device according to claim 1, wherein at least one of said first plurality of jacks is secured to said sub-module chassis.

5. A high density device according to claim 1, wherein said first plurality of jacks appears on said distal face of said sub-module chassis.

6. A high density access device according to claim 5, wherein said sub-module chassis is slideably connected to said chassis frame, said sub-module chassis having a first position in which front access to said first plurality of jacks is not supplied, and a second extended position in which front access to said first plurality of jacks is provided.

7. A high density access device according to claim 5, wherein said sub-module chassis is pivotally connected to said chassis frame, said sub-module chassis having a first position in which front access to said first plurality of jacks is not supplied, and a second pivoted position in which front access to said first plurality of jacks is provided.

8. A high density access device according to claim 5, wherein said sub-module chassis is slideably and pivotally connected to said chassis frame, said sub-module chassis having a first position in which front access to said first plurality of jacks is not supplied, and a second extended and pivoted position in which front access to said first plurality of jacks is provided.

9. A high density access device according to claim 1, wherein said sub-module chassis is mounted in a drawer connected to said chassis frame.

10. A high density access device according to claim 1, wherein said sub-module chassis is removably secured to said chassis frame, said sub-module chassis being removed from said chassis frame to enable access to said first plurality of ports.

11. A high density access device according to claim 1, wherein said sub-module chassis is slideably connected to said chassis frame, said sub-module chassis having a first position in which front access to said first plurality of jacks is not supplied, and a second extended position in which front access to said first plurality of jacks is provided.

12. A high density access device according to claim 1, wherein said sub-module chassis is pivotally connected to said chassis frame, said sub-module chassis having a first position in which front access to said first plurality of jacks is not supplied, and a second pivoted position in which front access to said first plurality of jacks is provided.

13. A high density access device according to claim 1, wherein said sub-module chassis is slideably and pivotally connected to said chassis frame, said sub-module chassis having a first position in which front access to said first plurality of jacks is not supplied, and a second extended and pivoted position in which front access to said first plurality of jacks is provided.

14. A high density front access device according to claim 1, wherein said first plurality of jacks substantially define a plane, said plane being located proximal of point half way between a front plane defined by said chassis frame and a back plane defined by said chassis frame.

15. A high density front access device according to claim 1, wherein said first plurality of jacks comprise at least one RJ-45 jack.

16. A high density front access device according to claim 1, wherein said first plurality of jacks comprise at least one of a telecom jack and an Amp Champ jack.

17. A high density device according to claim 1, further comprising a power supply, said power supply being connected to said chassis frame distal of said first proximal face of said sub-module chassis.

18. A high density front access device according to claim 1, wherein said chassis frame exhibits a flange, said flange at least partially defining said passageway.

19. A high density front access device according to claim 1, wherein the device comprises midspan power insertion equipment supporting at least 40 ports in accordance with the IEEE 802.3 af-2003 standard.

20. A high density front access device according to claim 1, further comprising a network management jack.

21. A high density front access device according to claim 20, wherein said network management jack appears on said distal face of said sub-module chassis.

22. An apparatus for connecting a plurality of cables, the apparatus comprising:

a chassis frame configured and dimensioned for mounting in a standardized telecommunications rack, said chassis frame exhibiting a front and a back;

a sub-module chassis connected to said chassis frame, said sub-module chassis exhibiting a proximal face and a distal face, said proximal face of said sub-module chassis exhibiting unobstructed access from said chassis frame front;

a first plurality of jacks secured to said sub-module chassis frame and exhibiting unobstructed access from said chassis frame front; and

a second plurality of jacks located distal of said proximal face of said sub-module chassis and proximal of said back of said chassis frame.

23. An apparatus according to claim 22, wherein at least one of said second plurality of jacks is secured to said sub-module chassis frame.

24. An apparatus according to claim 22, further comprising a passageway formed between said sub-module chassis and said chassis frame, said passageway being configured and dimensioned for the passage of at least one cable connected to said second plurality of jacks.

25. An apparatus for connecting a plurality of cables, the apparatus comprising:

a chassis frame configured and dimensioned for mounting in a standardized telecommunications rack, said chassis frame defining a front and a back;

a sub-module chassis connected to said chassis frame, said sub-module chassis exhibiting a front and a back;

a first plurality of jacks secured to said sub-module chassis, said first plurality of jacks facing said back of said chassis frame;

a second plurality of jacks secured to said sub-module chassis, said second plurality of jacks facing said front of said chassis frame; and

a passageway formed between said sub-module chassis and said chassis frame, said passageway being configured and dimensioned for the passage of at least one cable connected to said first plurality of jacks.

26. A midspan power insertion module comprising:

a chassis frame configured and dimensioned for mounting in a standardized telecommunications rack;

a sub-module chassis secured to said chassis frame, said sub-module chassis exhibiting a proximal face and a distal face;

a first plurality of jacks supporting at least 40 ports located distal of said proximal face of said sub-module chassis;

a second plurality of jacks supporting at least 40 ports appearing on said proximal face of said sub-module chassis; and

a passageway formed between said sub-module chassis and an inner wall of said chassis frame, said passageway configured and dimensioned for the passage of cabling for connection to said first plurality of jacks.