Methods for the optimization of substrate etching in a plasma processing system
First Claim
1. In a plasma processing system, a method etching a substrate, said substrate having a semi-conductor layer, a first barrier layer disposed above said semi-conductor layer, a low-k layer disposed above said first barrier layer, a third hard mask layer disposed above said low-k layer;
- a second hard mask layer disposed above said third hard mask layer, and a first hard mask layer disposed above said second hard mask layer, comprising;
alternatively etching said substrate with a first etchant and a second etchant, wherein said first etchant has a low selectivity to a first hard mask material of said first hard mask layer, a third hard mask material of said a third hard mask layer, and a first barrier layer material of said first barrier layer, but a high selectivity to a second hard mask material of said second hard mask layer, and wherein said second etchant has a high selectivity to said first hard mask material of said first hard mask layer, said third hard mask material of said third hard mask layer, and said first barrier layer material of said first barrier layer, and said first etchant has a low selectivity to said second hard mask material of said second hard mask layer.
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Abstract
A method of etching a substrate in a plasma processing system is disclosed. The substrate has a semi-conductor layer, a first barrier layer disposed above the semi-conductor layer, a low-k layer disposed above the first barrier layer, a third hard mask layer disposed above the low-k layer; a second hard mask layer disposed above the third hard mask layer, and a first hard mask layer disposed above the second hard mask layer. The method includes alternatively etching the substrate with a first etchant and a second etchant, wherein the first etchant has a low selectivity to a first hard mask material of the first hard mask layer, a third hard mask material of the a third hard mask layer, and a first barrier layer material of the first barrier layer, but a high selectivity to a second hard mask material of the second hard mask layer; and wherein the second etchant has a high selectivity to the first hard mask material of the first hard mask layer, the third hard mask material of the third hard mask layer, and the first barrier layer material of the first barrier layer, and the first etchant has a low selectivity to the second hard mask material of the second hard mask layer.
26 Citations
39 Claims
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1. In a plasma processing system, a method etching a substrate, said substrate having a semi-conductor layer, a first barrier layer disposed above said semi-conductor layer, a low-k layer disposed above said first barrier layer, a third hard mask layer disposed above said low-k layer;
- a second hard mask layer disposed above said third hard mask layer, and a first hard mask layer disposed above said second hard mask layer, comprising;
alternatively etching said substrate with a first etchant and a second etchant, wherein said first etchant has a low selectivity to a first hard mask material of said first hard mask layer, a third hard mask material of said a third hard mask layer, and a first barrier layer material of said first barrier layer, but a high selectivity to a second hard mask material of said second hard mask layer, and wherein said second etchant has a high selectivity to said first hard mask material of said first hard mask layer, said third hard mask material of said third hard mask layer, and said first barrier layer material of said first barrier layer, and said first etchant has a low selectivity to said second hard mask material of said second hard mask layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
- a second hard mask layer disposed above said third hard mask layer, and a first hard mask layer disposed above said second hard mask layer, comprising;
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21. In a plasma processing system, a method etching a substrate, said substrate having a semi-conductor layer, a first barrier layer disposed above the semi-conductor layer, a low-k layer disposed above the first barrier layer, a second barrier layer disposed above the low-k layer, a third hard mask layer disposed above the second barrier layer, a second hard mask layer disposed above the third hard mask layer, and a first hard mask layer disposed above the second hard mask layer, comprising:
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alternatively etching said substrate with a first etchant and a second etchant, wherein said first etchant has a low selectivity to a first hard mask material of said first hard mask layer, a third hard mask material of said a third hard mask layer, and a first barrier layer material of said first barrier layer, but a high selectivity to a second hard mask material of said second hard mask layer, and wherein said second etchant has a high selectivity to said first hard mask material of said first hard mask layer, said third hard mask material of said third hard mask layer, and said first barrier layer material of said first barrier layer, and said first etchant has a low selectivity to said second hard mask material of said second hard mask layer and said second barrier layer. - View Dependent Claims (22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39)
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Specification