[PACKAGE WITH STACKED SUBSTRATES]

• US 20050205970A1
• Filed: 06/25/2004
• Published: 09/22/2005
• Est. Priority Date: 03/17/2004
• Status: Active Grant

• Current Assignee: Cyntec Co. Ltd. (Delta Electronics Incorporated)
• Original Assignee: Cyntec Co. Ltd. (Delta Electronics Incorporated)
• Inventors: Chen, Da-Jung, Liu, Steven, Yang, Tung-Yi
• Granted Patent: US 6,972,479 B2
• Time in Patent Office: Days
• US Class Current: 257/666
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 23/49861 Lead-frames fixed on or encapsulated in insulating substrates H01L23/4985, H01L23/49805 take precedence
• CPC Class Codes: H01L 23/5385 Assembly of a plurality of insulating substrates
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 25/162 the devices being mounted on two or more different substrates
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2924/1815 Shape
• CPC Class Codes: H01L 2924/19107 off-chip wires
• CPC Class Codes: H01L 2924/207 Diameter ranges
• CPC Class Codes: H05K 1/144 Stacked arrangements of planar printed circuit boards
• CPC Class Codes: H05K 2201/10242 Metallic cylinders small solder preforms other than balls H05K2203/0415
• CPC Class Codes: H05K 2201/10924 Leads formed from a punched metal foil affixing a prefabricated self-supporting metal foil pattern H05K3/202
• CPC Class Codes: H05K 3/341 Surface mounted components
• CPC Class Codes: H05K 3/368 parallel to each other H05K3/361 takes precedence

Abstract

A package having a plurality of stacked substrates is provided. The package has at least two substrates. One substrate is stacked over the other to construct a three-dimensional circuit structure. Elements are disposed on the respective substrates. At least a conductive column is disposed between the two substrates. A lead-frame is connected to the substrates or the elements. The lead-frame also has a plurality of leads. The two neighboring substrates are electrically connected through the conductive column so that the average signal transmission length is shortened and the signal transmission quality is improved. Furthermore, the conductive column increases the mechanical strength of the package and reduces the degree of warping in the package so that a longer life span can be expected.

Claims

1. A package with stacked substrates, comprising:

a first substrate, having a first surface;

at least a first element, connected to the surface of the first substrate;

at least a conductive column, such that one end of the conductive column is connected to the surface of the first substrate;

a second substrate, having a front surface and a back surface such that the back surface of the second substrate is connected to the other end of the conductive column, wherein the second substrate and the first substrate are located at different levels;

at least a second element, connected to the front surface or the back surface of the second substrate;

a lead-frame, having at least a lead, at least a down-set portion and at least an up-set portion such that the down-set portion is connected to the first substrate and the up-set portion is connected to the second substrate; and

a molding compound, encapsulating part of the first substrate, the first element, the conductive column, part of the second substrate, and the down-set portion and the up-set portion of the lead-frame.

2. The package of claim 1, wherein the first substrate is selected from a group consisting of printed circuit board (PCB), ceramic substrate, direct copper bonded (DCB) substrate, direct aluminum bonded (DAB) substrate and insulated metal substrate (IMS).

3. The package of claim 1, wherein the first element comprises a power source element.

4. The package of claim 1, wherein the first element and the surface of the first substrate are connected through wire bonding or surface mount technology.

5. The package of claim 1, wherein the two ends of the conductive column are connected to the first substrate and the second substrate respectively by soldering.

6. The package of claim 1, wherein a material of the conductive column includes metal.

7. The package of claim 1, wherein the second substrate has an area equal to or smaller than the first substrate.

8. The package of claim 1, wherein the second substrate is selected from a group consisting of a printed circuit board (PCB), a ceramic substrate, a direct copper bonded (DCB) substrate, a direct aluminum bonded (DAB) substrate and an insulated metal substrate (IMS).

9. The package of claim 1, wherein the lead of the lead-frame is attached to the down-set portion or the up-set portion.

10. The package of claim 1, wherein the up-set portion of the lead-frame extends to the back surface of the second substrate and solders with the back surface of the second substrate.

11. The package of claim 1, wherein the second element comprises a control element or a passive element.

12. The package of claim 1, wherein the second element and the front surface of the second substrate are connected through wire bonding or surface mount technology.

13. The package of claim 1, wherein the molding compound also encapsulates the second element when the second element is connected to the back surface of the second substrate.

14. The package of claim 1, wherein the molding compound also encapsulates the second element when the second element is connected to the front surface of the second substrate.