Multi-layer wiring structure with dummy patterns for improving surface flatness
First Claim
Patent Images
1. A multi-layer wiring structure comprising:
- a support substrate, on a surface of which a first area, a loop shape second area surrounding the first area, and a third area surrounding the second area are defined;
a first wiring layer disposed above the support substrate, a wiring being formed in the third area, dummy patterns being formed in the second area, and conductive patterns are not formed in the first area; and
a functional element disposed above the first wiring layer and in the first area.
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Abstract
A first area, a ring shape second area surrounding the first area, and a third area surrounding the second area are defined on the surface of a support substrate. A first wiring layer is disposed above the support substrate. A wiring is formed in the third area, dummy patterns being formed in the second area, and conductive patterns are not formed in the first area. A functional element is disposed above the first wiring layer and in the first area.
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Citations
13 Claims
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1. A multi-layer wiring structure comprising:
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a support substrate, on a surface of which a first area, a loop shape second area surrounding the first area, and a third area surrounding the second area are defined;
a first wiring layer disposed above the support substrate, a wiring being formed in the third area, dummy patterns being formed in the second area, and conductive patterns are not formed in the first area; and
a functional element disposed above the first wiring layer and in the first area. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A multi-layer wiring structure comprising:
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a support substrate having a loop shape first area, a second area surrounding the first area, and a third area surrounded by the first area, respectively defined on a surface of the support substrate;
a first wiring layer disposed above the support substrate, a wiring being formed in the second area, dummy patterns being formed in the third area, and conductive patterns are not formed in the first area; and
a functional element disposed above the first wiring layer and in the first area. - View Dependent Claims (11, 12, 13)
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Specification