Roll-to-roll fabricated light sheet and encapsulated semiconductor circuit devices
First Claim
1. ) A method of making a light active sheet, comprising the steps of:
- Providing a bottom substrate having an electrically conductive surface;
Providing an electrically insulative adhesive;
Fixing light active semiconductor elements to the electrically insulative adhesive, said light active semiconductor elements each having an n-side and a p-side;
Providing a top transparent substrate having a transparent conductive layer disposed thereon;
Inserting the electrically insulative adhesive having the light active semiconductor elements fixed thereon between the electrically conductive surface and the transparent conductive layer to form a lamination; and
Activating the electrically insulative adhesive to electrically insulate and bind the top substrate to the bottom substrate so that one of said n-side or said p-side of the light active semiconductor elements is in electrical communication with the transparent conductive layer of the top substrate and so that the other of said n-side or said p-side of each said light active semiconductor element is in electrical communication with the electrically conductive surface of the bottom substrate to form a light active device.
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Accused Products
Abstract
A method of making a light active sheet. A bottom substrate having an electrically conductive surface is provided. A hotmelt adhesive sheet is provided. Light active semiconductor elements, such as LED die, are embedded in the hotmelt adhesive sheet. The LED die each have a top electrode and a bottom electrode. A top transparent substrate is provided having a transparent conductive layer. The hotmelt adhesive sheet with the embedded LED die is inserted between the electrically conductive surface and the transparent conductive layer to form a lamination. The lamination is run through a heated pressure roller system to melt the hotmelt adhesive sheet and electrically insulate and bind the top substrate to the bottom substrate. As the hotmelt sheet is softened, the LED die breakthrough so that the top electrode comes into electrical contact with the transparent conductive layer of the top substrate and the bottom electrode comes into electrical contact with the electrically conductive surface of the bottom substrate. Thus, the p and n sides of each LED die are automatically connected to the top conductive layer and the bottom conductive surface. Each LED die is encapsulated and secured between the substrates in the flexible, hotmelt adhesive sheet layer. The bottom substrate, the hotmelt adhesive (with the embedded LED die) and the top substrate can be provided as rolls of material. The rolls are brought together in a continuous roll fabrication process, resulting in a flexible sheet of lighting material.
124 Citations
38 Claims
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1. ) A method of making a light active sheet, comprising the steps of:
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Providing a bottom substrate having an electrically conductive surface;
Providing an electrically insulative adhesive;
Fixing light active semiconductor elements to the electrically insulative adhesive, said light active semiconductor elements each having an n-side and a p-side;
Providing a top transparent substrate having a transparent conductive layer disposed thereon;
Inserting the electrically insulative adhesive having the light active semiconductor elements fixed thereon between the electrically conductive surface and the transparent conductive layer to form a lamination; and
Activating the electrically insulative adhesive to electrically insulate and bind the top substrate to the bottom substrate so that one of said n-side or said p-side of the light active semiconductor elements is in electrical communication with the transparent conductive layer of the top substrate and so that the other of said n-side or said p-side of each said light active semiconductor element is in electrical communication with the electrically conductive surface of the bottom substrate to form a light active device. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17)
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18. ) A method of making an electronically active sheet, comprising the steps of:
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Providing a bottom planar substrate having an electrically conductive surface;
Providing an adhesive;
Fixing at least one semiconductor element to the adhesive, said semiconductor element having a top conductor and a bottom conductor;
Providing a top substrate having an electrically conductive pattern disposed thereon;
Inserting the adhesive with said semiconductor element fixed thereto between the electrically conductive surface and the electrically conductive pattern to form a lamination; and
Activating the adhesive to bind the top substrate to the bottom substrate so that one of said top conductor and said bottom conductor of said semiconductor element is automatically brought into and maintained in electrical communication with the electrically conductive pattern of the top substrate and so that the other of said top conductor and said bottom conductor of each said semiconductor element is automatically brought into and maintained in electrical communication with the electrically conductive surface of the bottom substrate to form an electronically active sheet. - View Dependent Claims (19, 20, 21, 22, 23, 24, 25, 26, 27)
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28. ) A method of making an encapsulated semiconductor device, comprising the steps of:
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Providing a bottom substrate having an electrically conductive surface;
Providing an adhesive layer on the electrically conductive surface;
Fixing a predetermined pattern of semiconductor elements to the adhesive, said semiconductor elements each having a top device conductor and a bottom device conductor;
Providing a top substrate having a conductive pattern disposed thereon to form a lamination so that the need for metallic insulates and binds the top substrate to the bottom substrate so that one of said top device conductor and bottom device conductor of the semiconductor elements is in electrical communication with the conductive pattern of the top substrate and so that the other of said top device conductor and bottom device conductor of each said semiconductor element is in electrical communication with the electrically conductive layer of the bottom substrate. - View Dependent Claims (29, 30, 31, 32, 33, 34, 35, 36, 37, 38)
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Specification