Method and device for separating a reinforcing-plate fixed to a reinforced semiconductor wafer
First Claim
1. A method for separating a reinforcing-plate fixed to a reinforced semiconductor wafer;
- the wafer comprising a semiconductor wafer and a double-side adhesive sheet having, on at least one surface thereof, a peelable adhesive layer, wherein the peelable adhesive layer is stuck to a front face of the semiconductor wafer and the reinforcing-plate is fixed to the other adhesive layer of the double-side adhesive sheet; and
the reinforcing-plate being separated together with the double-side adhesive sheet from the reinforced semiconductor wafer by the peeling-effect of the peelable adhesive layer of the double-side adhesive sheet;
in which the reinforcing-plate is separated from an arbitrarily selected edge of the semiconductor wafer toward an edge thereof different from the above-mentioned edge.
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Accused Products
Abstract
A reinforcing-plate fixed to a reinforced semiconductor wafer is separated from the wafer which includes a semiconductor wafer, a double-side adhesive sheet having, on at least one surface thereof, a peelable adhesive layer stuck to a front face of the semiconductor wafer, and the reinforcing-plate fixed to the other adhesive layer of the double-side adhesive sheet. A method includes separating the reinforcing-plate together with the double-side adhesive sheet from the reinforced semiconductor wafer by the peeling-effect of the peelable adhesive layer of the double-side adhesive sheet. The method further includes separating the reinforcing-plate from an arbitrarily selected edge of the semiconductor wafer toward an edge thereof different from the above-mentioned edge.
28 Citations
14 Claims
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1. A method for separating a reinforcing-plate fixed to a reinforced semiconductor wafer;
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the wafer comprising a semiconductor wafer and a double-side adhesive sheet having, on at least one surface thereof, a peelable adhesive layer, wherein the peelable adhesive layer is stuck to a front face of the semiconductor wafer and the reinforcing-plate is fixed to the other adhesive layer of the double-side adhesive sheet; and
the reinforcing-plate being separated together with the double-side adhesive sheet from the reinforced semiconductor wafer by the peeling-effect of the peelable adhesive layer of the double-side adhesive sheet;
in which the reinforcing-plate is separated from an arbitrarily selected edge of the semiconductor wafer toward an edge thereof different from the above-mentioned edge. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A method for processing a reinforced semiconductor wafer, comprising:
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providing a reinforced semiconductor wafer comprising (i) a semiconductor wafer, (ii) a double-side adhesive sheet, one side of which is a peelable adhesive layer stuck to a front face of the semiconductor wafer, and (iii) a reinforcing-plate fixed to the other side of the double-side adhesive sheet;
processing a rear face of the semiconductor wafer to which the reinforcing-plate remains fixed;
loosening adhesion of the peelable adhesive layer using external energy; and
separating the reinforcing-plate together with the double-side adhesive sheet from the semiconductor wafer from an edge of the semiconductor wafer toward another edge as the loosening of the peelable adhesive layer progresses. - View Dependent Claims (10, 11, 12, 13, 14)
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Specification