Pattern forming method, arranged fine particle pattern forming method, conductive pattern forming method, and conductive pattern material

• US 20050215721A1
• Filed: 03/23/2005
• Published: 09/29/2005
• Est. Priority Date: 03/23/2004
• Status: Active Grant

• Current Assignee: Fujifilm Corporation (Fujifilm Holdings Corporation)
• Original Assignee: Fuji Photo Film Co Limited (Fujifilm Holdings Corporation)
• Inventors: Kawamura, Koichi
• Granted Patent: US 7,393,567 B2
• Time in Patent Office: Days
• US Class Current: 525/286
• CPC Class Codes: C23C 18/1608 from pretreatment step, i.e. selective pre-treatment
• CPC Class Codes: C23C 18/1612 through irradiation means
• CPC Class Codes: C23C 18/1868 Radiation, e.g. UV, laser
• CPC Class Codes: C23C 18/1893 with use of organic or inorganic compounds other than metals, first
• CPC Class Codes: C23C 18/204 Radiation, e.g. UV, laser
• CPC Class Codes: C23C 18/2086 with use of organic or inorganic compounds other than metals, first
• CPC Class Codes: C23C 18/30 Activating or accelerating or sensitising with palladium or other noble metal
• CPC Class Codes: C23C 18/405 Formaldehyde
• CPC Class Codes: C23C 18/44 using reducing agents
• CPC Class Codes: C23C 18/50 with alloys based on iron, cobalt or nickel
• CPC Class Codes: G03F 7/029 Inorganic compounds; Onium compounds; Organic compounds having hetero atoms other than oxygen, nitrogen or sulfur
• CPC Class Codes: G03F 7/165 Monolayers, e.g. Langmuir-Blodgett
• CPC Class Codes: H05K 2203/1157 Using means for chemical reduction
• CPC Class Codes: H05K 2203/1168 Graft-polymerization
• CPC Class Codes: H05K 3/185 by making a catalytic pattern by photo-imaging
• CPC Class Codes: H05K 3/389 by the use of a coupling agent, e.g. silane

Abstract

The present invention provides a pattern forming method comprising bonding a compound to a substrate, the compound having both a polymerization initiating moiety capable of undergoing photocleavage to initiate radical polymerization and a substrate bonding moiety, contacting a radical-polymerizable unsaturated compound with the substrate, and exposing light thereto patternwise, so as to form a region where a graft polymer is generated and a region where a graft polymer is not generated. A conductive pattern forming method applying the pattern forming method, and a conductive pattern material obtained by the conductive film forming method.

Claims

1. A pattern forming method comprising:

bonding a compound to a substrate, the compound having both a polymerization initiating moiety capable of undergoing photocleavage to initiate radical polymerization and a substrate bonding moiety, and

contacting a radical-polymerizable unsaturated compound with the substrate, and exposing light thereto patternwise, so as to form a region where a graft polymer is generated and a region where a graft polymer is not generated.

2. The pattern forming method according to claim 1, wherein the polymerization initiating moiety contains a bond selected from the group consisting of a C—

C bond, a C—

N bond, a C—

O bond, a C—

Cl bond, a N—

O bond, and a S—

N bond.

3. The pattern forming method according to claim 1, wherein the graft polymer has a hydrophilic group.

4. An arranged fine particle pattern forming method comprising:

bonding a compound to a substrate, the compound having both a polymerization initiating moiety capable of undergoing photocleavage to initiate radical polymerization and a substrate bonding moiety,

contacting a radical-polymerizable unsaturated compound with the substrate, and exposing light thereto patternwise, so as to form a region where a graft polymer is generated and a region where a graft polymer is not generated, and

adhering fine particles to the region where the graft polymer is generated.

5. The arranged fine particle pattern forming method according to claim 4, wherein the polymerization initiating moiety contains a bond selected from the group consisting of a C—

C bond, a C—

N bond, a C—

O bond, a C—

Cl bond, a N—

O bond, and a S—

N bond.

6. The arranged fine particle pattern forming method according to claim 4, wherein the graft polymer has a polar group.

7. The arranged fine particle pattern forming method according to claim 4, the diameter of the fine particle is in a rage of from 0.1 mm to 1 μ

m.

8. A conductive pattern forming method comprising:

bonding a compound to a substrate, the compound having both a polymerization initiating moiety capable of undergoing photocleavage to initiate radical polymerization and a substrate bonding moiety,

contacting a radical-polymerizable unsaturated compound with the substrate, and exposing light thereto patternwise, so as to form a region where a graft polymer is generated and a region where a graft polymer is not generated,

providing a metal ion or a metal salt to the region where the graft polymer is generated, and

reducing the metal ion or a metal ion in the metal salt to deposit a metal.

9. The conductive pattern forming method according to claim 8, wherein the polymerization initiating moiety contains a bond selected from the group consisting of a C—

C bond, a C—

N bond, a C—

O bond, a C—

Cl bond, a N—

O bond, and a S—

N bond.

10. The conductive pattern forming method according to claim 8, wherein the graft polymer has a polar group.

11. A conductive pattern material obtained by the conductive pattern forming method according to claim 8.

12. A conductive pattern forming method comprising:

bonding a compound to a substrate, the compound having both a polymerization initiating moiety capable of undergoing photocleavage to initiate radical polymerization and a substrate bonding moiety,

contacting a compound, that has both a radical-polymerizable functional group and a functional group that interacts with either an electroless plating catalyst or a precursor thereof, with the substrate, and exposing light thereto patternwise, so as to form a region where a graft polymer is generated and a region where a graft polymer is not generated,

providing an electroless plating catalyst or a precursor thereof to the region where the graft polymer is generated, and

carrying out electroless plating to form a patterned thin metal layer.

13. The conductive pattern forming method according to claim 12, wherein the polymerization initiating moiety comprises a bond selected from the group consisting of a C—

C bond, a C—

N bond, a C—

O bond, a C—

Cl bond, a N—

O bond, and a S—

N bond.

14. A conductive pattern material obtained by the conductive pattern forming method according to claim 12.