Lead-free glass material for use in sealing and, sealed article and method for sealing using the same

• US 20050233885A1
• Filed: 06/21/2005
• Published: 10/20/2005
• Est. Priority Date: 02/19/2003
• Status: Active Grant

• Current Assignee: Yamato Electronic Co., Ltd.
• Original Assignee: Yamato Electronic Co., Ltd.
• Inventors: Yoshida, Masahiro, Honda, Tomoyuki, Hatate, Yasuo, Sarata, Tsugumitsu, Iwashita, Masahiro, Fukunaga, Hiroyuki, Uemura, Yoshimitsu
• Granted Patent: US 7,425,518 B2
• Time in Patent Office: Days
• US Class Current: 501/15
• CPC Class Codes: C03C 27/044 of glass, glass-ceramic or ceramic material only
• CPC Class Codes: C03C 3/122 containing oxides of As, Sb, Bi, Mo, W, V, Te as glass formers
• CPC Class Codes: C03C 3/14 containing boron
• CPC Class Codes: C03C 8/04 containing zinc
• CPC Class Codes: C03C 8/14 Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions
• CPC Class Codes: C03C 8/24 Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders
• CPC Class Codes: C04B 2235/3215 Barium oxides or oxide-forming salts thereof
• CPC Class Codes: C04B 2235/3239 Vanadium oxides, vanadates or oxide forming salts thereof, e.g. magnesium vanadate
• CPC Class Codes: C04B 2235/3284 Zinc oxides, zincates, cadmium oxides, cadmiates, mercury oxides, mercurates or oxide forming salts thereof
• CPC Class Codes: C04B 2235/3298 Bismuth oxides, bismuthates or oxide forming salts thereof, e.g. zinc bismuthate
• CPC Class Codes: C04B 2235/3409 Boron oxide, borates, boric acids, or oxide forming salts thereof, e.g. borax
• CPC Class Codes: C04B 2235/9607 Thermal properties, e.g. thermal expansion coefficient
• CPC Class Codes: C04B 35/01 based on oxide ceramics
• CPC Class Codes: C04B 35/453 based on zinc, tin, or bismuth oxides or solid solutions thereof with other oxides, e.g. zincates, stannates or bismuthates
• CPC Class Codes: C04B 35/495 based on vanadium, niobium, tantalum, molybdenum or tungsten oxides or solid solutions thereof with other oxides, e.g. vanadates, niobates, tantalates, molybdates or tungstates
• CPC Class Codes: C04B 35/547 based on sulfides or selenides or tellurides
• CPC Class Codes: C04B 35/653 Processes involving a melting step

Abstract

Provided with a glass composition including a network-former oxide composed of any one of or both of B₂O₃ and V₂O₅ of 20-80% by weight, ZnO of 0-60% by weight and BaO of 0-80% by weight, wherein at least one of ZnO and BaO is included as an essential ingredient. The present invention is a glass material for use in sealing, which is of lead-free series, can be used for sealing at a low processing temperature and within a wide temperature range, has a low thermal expansion coefficient, superior adhesion, superior sealing processability, superior adherence, superior chemical stability, superior strength and the like and comprises sufficient practical performance to substitute for lead glass.

Claims

1. A lead-free glass material for use in sealing, which has a glass composition including a network-former oxide composed of any one of or both of B₂O₃ and V₂O₅ of 20-80% by weight, ZnO of 0-60% by weight and BaO of 0-80% by weight, wherein at least one of ZnO and BaO is included as an essential ingredient.

2. The lead-free glass material for use in sealing according to claim 1, which has a glass composition composed of B₂O₃ of 20-80% by weight, ZnO of 0-50% by weight and BaO of 0-60% by weight.

3. The lead-free glass material for use in sealing according to claim 1, which has a glass composition composed of B₂O₃ of 2040% by weight, ZnO of 0-50% by weight and BaO of 10-60% by weight.

4. The lead-free glass material for use in sealing according to claim 1, which has a glass composition composed of B₂O₃ of 20-35% by weight, ZnO of 10-35% by weight and BaO of 40-60% by weight.

5. A lead-free glass material for use in sealing, which has a glass composition including any one of or both of TeO₂ and Bi₂O₃ of 50-500 part by weight compounded for an oxide having the glass composition according to any one of claim 2, 3 or 4 of total amount of 100 part by weight.

6. The lead-free glass material for use in sealing according to claim 1, which has a glass composition composed of V₂O₅ of 30-80% by weight, ZnO of 0-50% by weight and BaO of 10-60% by weight.

7. The lead-free glass material for use in sealing according to claim 1, which has a glass composition composed of V₂O₅ of 25-75% by weight, ZnO of 0-45% by weight and BaO of 15-55% by weight.

8. A lead-free glass material for use in sealing, which has a glass composition including any one of or both of TeO₂ and Bi₂O₃ of 1-60 part by weight compounded for an oxide having the glass composition according to claim 6 or 7 of the total amount of 100 part by weight.

9. A lead-free glass material for use in sealing, which includes a refractory filler mixed with glass powder having the glass composition according to claim 1.

10. The lead-free glass material for use in sealing according to claim 9, wherein the refractory filler is low-expansion ceramic powder and the compounding quantity thereof is less than or equal to 150 part by weight for glass powder of 100 part by weight.

11. A lead-free glass material for use in sealing, which is composed of glass powder having the glass composition according to claim 1, or mixed powder paste including a refractory filler added to the glass powder.

12. A glass-based, ceramic-based or metal-based sealed matter having an opening or a joint sealed with the lead-free glass material for use in sealing according to claim 1.

13. The sealed matter according to claim 12, which is a vacuum package with an inside thereof being kept in a high vacuum.

14. A sealing method, wherein a sealed portion of an article to be sealed is coated with a lead-free glass material for use in sealing composed of paste according to claim 11, tentative burning is performed for the article at around a softening point of a lead-free glass included in the paste and then main burning is performed at around a crystallization starting temperature of the lead-free glass.

15. The sealing method according to claim 14, wherein the tentative burning is performed within a temperature range between the softening point minus 10°

C. and the softening point plus 40°

C. and the main burning is performed within a temperature range between the crystallization starting temperature minus 20°

C. and the crystallization starting temperature plus 50°

C.