Heater for heating a wafer and method for fabricating the same

• US 20050252903A1
• Filed: 05/25/2005
• Published: 11/17/2005
• Est. Priority Date: 08/27/2003
• Status: Active Grant

• Current Assignee: Kyocera Corporation
• Original Assignee: Kyocera Corporation
• Inventors: Masuyama, Hiroyuki, Takenouchi, Hiroshi, Nakamura, Tsunehiko, Maki, Seiichirou
• Granted Patent: US 7,361,865 B2
• Time in Patent Office: Days
• US Class Current: 219/270
• CPC Class Codes: H01L 21/67103 mainly by conduction
• CPC Class Codes: H05B 3/143 applied to semiconductors, e.g. wafers heating H05B3/0047 takes precedence

Abstract

The invention is to provide a heater capable of having a high uniform heating characteristic and substantially equally heating a wafer etc. mounted thereon, and a wafer heating device using the same, as well as a method thereof. In order to solve the above object, the invention provides a heater which comprises a plate shaped body, a belt-like resistance heating element formed on the plate shaped body and having a channel for adjusting the resistance value, and a positioning mark formed on the plate shaped body, which serves as a reference for positioning the channel.

Claims

1. A heater comprising:

a plate shaped body and

a belt-like resistance heating element formed on a surface of the plate shaped body,

wherein the belt-like resistance heating element is provided with channels,

wherein the plate shaped body is provided with positioning marks on the surface thereof, and

wherein the positioning marks are formed on a position corresponding to the channels.

2. The heater according to claim 1, wherein the channels are provided in the belt-like resistance for adjusting a resistance value of the resistance heating element.

3. The heater according to claim 1, wherein the plate shaped body is made of ceramics.

4. The heater according to claim 1, wherein the positioning mark is a protrusion protruded from the belt-like resistance heating element in a lateral direction.

6. The heater according to claim 1, wherein the resistance heating element is made of a composite material of an insulating composition and a conductive composition, and the conductive composition on the surface of the channel has a density less than that of an interior of the resistance heating element.

7. The heater according to claim 6, wherein the conductive composition has an average particle size of 1 to 20 μ

m on the surface of the channel.

8. The heater according to claim 6, wherein the resistance heating element has the insulating composition enclosed by conductive particles made of the conductive composition.

9. The heater according to claim 1, wherein the resistance heating element is formed in an approximately concentric circular shape on the circular plate shaped body, and the resistance heating element is provided with a group of channels at a substantially center in a width direction thereof.

10. The heater according to claim 1, wherein the resistance heating element is formed in an approximately concentric circular shape on a circular plate shaped body, and the channel is unilaterally distributed on the inner side in the radial direction of the plate shaped body or the outer side in the radial direction of the plate shaped body on the resistance heating element.

11. The heater according to claim 1, wherein the resistance heating element is provided with a plurality of channels extended along a length direction thereof and arranged in a direction substantially perpendicular to the length direction or in the width direction thereof.

12. The heater according to claim 11, wherein some of the plurality of channels have a length different from the others.

13. The heater according to claim 11, wherein among the plurality of channels, the channel located on the outer side in the width direction of the resistance heating elements has a length different from the others.

14. The heater according to claim 1, wherein the channel has an edge of an arc shape.

15. The heater according to claim 14, wherein the arc shaped portion on the edge of the channel has a radius of curvature corresponding to the circle diameter of 0.5 to 3 times a width of the channel.

16. The heater according to claim 14, wherein the edge of the channel is formed with a passivation layer.

17. The heater according to claim 1, wherein the resistance heating element has a plurality of groups consisting of a plurality of channels that are formed in a substantially equal length along a length direction of the resistance heating element and also arranged in a direction substantially perpendicular to the length direction, and an interval between adjacent groups is smaller than width of the resistance heating element.

18. The heater according to claim 17, wherein the interval between the adjacent groups of channels is 1 mm or less.

19. The heater according to claim 1, wherein the channel is formed by means of a laser.

20. A wafer heating device comprising:

the heater according to claim 1 comprising a plate shaped body having a pair of main surfaces;

one main surface being provided with a plurality of resistance heating elements thereon and the other serving as a mounting surface for mounting a wafer;

a power supply part for independently supplying electric power to the plurality of resistance heating elements; and

a metal case enclosing the power supply part,

wherein the plurality of resistance heating elements are provided with a circular resistance heating element zone formed at the center of the plate shaped body, and a plurality of annular resistance heating element zones formed in a shape of a concentric circle on an outer side thereof, and

wherein the annular resistance heating element zones located at least at the outermost circumference have a plurality of positioning marks located on a plurality of straight lines extending from a center with a substantially equal central angle therebetween on the concentric circle.

21. A wafer heating device comprising:

the heater according to claim 4 comprising a plate shaped body having a pair of main surfaces, one main surface being provided with a plurality of resistance heating elements thereon and the other main surface serving as a mounting surface for mounting a wafer;

a power supply part for independently supplying electric power to the plurality of resistance heating elements; and

a metal case enclosing the power supply part,

wherein the plurality of resistance heating elements has a circular resistance heating element zone formed at the center of the plate shaped body, and a plurality of annular resistance heating element zones formed in a shape of a concentric circle on an outer side thereof, and

wherein the annular resistance heating element zones located at least at the outermost circumference have a plurality of protrusions located on a plurality of straight lines extending from a center with a substantially equal central angle therebetween on the concentric circle.

5. A heater comprising:

a plate shaped body and

a belt-like resistance heating element formed on the plate shaped body and provided with channels,

wherein the belt-like resistance heating element is provided with protrusions protruded from the resistance heating element in a lateral direction.

22. A method of fabricating a heater comprising a plate shaped body, and a resistance heating element provided on one main surface of the plate shaped body and having a plurality of channels, comprising the steps of:

forming, on the one main surface of the plate shaped body, the resistance heating element and positioning marks serving as a basis of positioning the channel;

measuring a resistance value for a certain section of the resistance heating element; and

comparing the measured resistance value with a predetermined resistance value to form, in a part of the certain section of the resistance heating element,

forming a channel on the basis of a positioning mark by means of a laser beam such that the resistance value for the certain section is corresponding to the predetermined resistance value.