Semiconductor (LED) chip attachment
First Claim
1. A device comprising:
- a semiconductor component having a lower face;
a support member having a surface supporting the lower face of the semiconductor component; and
attaching material connecting the lower face of the semiconductor component to the surface of the support member;
wherein the surface includes at least two non-parallel lines of scoring below the lower face of the semiconductor component.
1 Assignment
0 Petitions
Accused Products
Abstract
A device comprising a semiconductor component having a lower face and a support member having a surface supporting the lower face of the semiconductor component. Attaching material connects the lower face of the semiconductor optical radiation emitting component to the surface of the support member. The surface can include scoring below the lower face of the semiconductor component. Additionally, or as alternative to the scoring, the surface can have a contour for allowing a locating machine to accurately visually locate a placement location for the semiconductor component, for maintaining a position and orientation of each semiconductor component at the placement location on the surface and/or for routing a fluxing agent to a position surrounding the semiconductor component during attachment of the semiconductor component to the support member.
27 Citations
91 Claims
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1. A device comprising:
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a semiconductor component having a lower face;
a support member having a surface supporting the lower face of the semiconductor component; and
attaching material connecting the lower face of the semiconductor component to the surface of the support member;
wherein the surface includes at least two non-parallel lines of scoring below the lower face of the semiconductor component. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A device comprising:
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a semiconductor optical radiation emitting component having a lower face;
a lead frame having a surface supporting the lower face of the semiconductor optical radiation emitting component; and
attaching material connecting the lower face of the semiconductor optical radiation emitting component to the surface of the support member;
wherein the surface includes scoring below the lower face of the semiconductor optical radiation emitting component. - View Dependent Claims (11, 12, 13, 14, 15, 16, 17)
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18. A device comprising:
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a semiconductor component having a lower face;
a support member including a surface supporting the lower face of the semiconductor component; and
attaching material connecting the lower face of the semiconductor component to the surface of the support member;
the support member having a reflective wall surrounding the surface;
wherein the surface includes scoring below the lower face of the semiconductor component. - View Dependent Claims (19, 20, 21, 22, 23, 24, 25, 26)
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27. A device comprising:
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at least one semiconductor component having a lower face;
a support member having a surface supporting the lower face of the at least one semiconductor component, the support member including a substantially planar area under the lower face of the at least one semiconductor component; and
attaching material connecting the lower face of the at least one semiconductor component to the planar area of the surface of the support member;
the surface having a contour allowing a locating machine to accurately visually locate a placement location for each at least one semiconductor component. - View Dependent Claims (28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43, 44, 45, 46)
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47. A device comprising:
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at least one semiconductor component having a lower face;
a support member having a surface supporting the lower face of the at least one semiconductor component, the support member including a substantially planar area under the lower face of the at least one semiconductor component; and
attaching material connecting the lower face of the at least one semiconductor component to the planar area of the surface of the support member;
the surface having a contour maintaining a position and orientation of each at least one semiconductor component at a placement location on the surface. - View Dependent Claims (48, 49, 50, 51, 52, 53, 54, 55, 56, 57, 58, 59, 60, 61, 62, 63, 64, 65, 66)
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67. A device comprising:
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at least one semiconductor component having a lower face;
a support member having a surface supporting the lower face of the at least one semiconductor component, the support member including a substantially planar area under the lower face of the at least one semiconductor component; and
attaching material connecting the lower face of the at least one semiconductor component to the planar area of the surface of the support member;
the surface having a contour for routing a fluxing agent to a position surrounding the at least one semiconductor component during attachment of the at least one semiconductor component to the support member. - View Dependent Claims (68, 69, 70, 71, 72, 73, 74, 75, 76, 77, 78, 79, 80, 81, 82, 83, 84, 85, 86)
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87. A method of positioning at least one semiconductor component on a surface comprising:
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providing the surface with a contour defining at least one placement location;
viewing the contour of the surface with a locating machine to determine the at least one placement location on the surface;
placing attaching material on the at least one placement location; and
placing each at least one semiconductor component on one at least one placement location. - View Dependent Claims (88)
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89. A method of positioning at least one semiconductor component on a surface comprising:
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providing the surface with a contour defining at least one placement location;
placing attaching material on the at least one placement location;
placing each at least one semiconductor component on the placement location; and
maintaining the at least one semiconductor component on the at least one placement location and in a selected orientation with the contour of the surface. - View Dependent Claims (90)
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91. A method of routing a fluxing agent during attachment of a semiconductor component on a surface comprising:
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providing a surface having a contour and a planar area;
placing attaching material on the planar area;
placing the semiconductor component on the planar area;
heating the attaching material and the fluxing agent; and
routing the fluxing agent to a position surrounding the semiconductor component via the contour of the surface.
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Specification