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Semiconductor (LED) chip attachment

  • US 20050253159A1
  • Filed: 04/28/2004
  • Published: 11/17/2005
  • Est. Priority Date: 04/28/2004
  • Status: Abandoned Application
First Claim
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1. A device comprising:

  • a semiconductor component having a lower face;

    a support member having a surface supporting the lower face of the semiconductor component; and

    attaching material connecting the lower face of the semiconductor component to the surface of the support member;

    wherein the surface includes at least two non-parallel lines of scoring below the lower face of the semiconductor component.

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