Wafer level capped sensor
First Claim
Patent Images
1. A sensor comprising:
- a die having a working portion;
a cap coupled with the die to at least partially cover the working portion;
a sensing component within the working portion;
amplification circuitry operatively coupled with the sensing component; and
a conductive pathway extending through the cap to the working portion, the pathway providing an electrical interface to the working portion, the amplification circuitry being electrically between the sensing component and the conductive pathway.
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Abstract
A sensor has a die (with a working portion), a cap coupled with the die to at least partially cover the working portion, and a conductive pathway extending through the cap to the working portion. The pathway provides an electrical interface to the working portion.
60 Citations
20 Claims
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1. A sensor comprising:
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a die having a working portion;
a cap coupled with the die to at least partially cover the working portion;
a sensing component within the working portion;
amplification circuitry operatively coupled with the sensing component; and
a conductive pathway extending through the cap to the working portion, the pathway providing an electrical interface to the working portion, the amplification circuitry being electrically between the sensing component and the conductive pathway. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A method of producing a sensor, the method comprising:
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forming a plurality of working portions on a first wafer;
forming a plurality of through-holes and cavities on a second wafer;
securing the second wafer to the first wafer, at least one of the cavities aligning to at least one of the working portions;
filling the through holes with conductive material to form a plurality of conductive paths;
forming a sensing component and amplification circuitry within each working portion, the amplification circuitry being electrically between the conductive material and the sensing component for each working portion; and
dicing the first and second wafers. - View Dependent Claims (12, 13, 14, 15, 16)
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17. The product produced by the process defined by clam 11.
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18. A sensor comprising:
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a die having a working portion with movable structure and circuitry for detecting movement of the movable structure, the working portion also having amplification circuitry;
a cap having a conductive pathway therethrough, the amplification circuitry being electrically between the conductive pathway and the movable structure. - View Dependent Claims (19, 20)
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Specification