Method for manufacturing light guide plate mold cores

• US 20050276914A1
• Filed: 06/15/2004
• Published: 12/15/2005
• Est. Priority Date: 06/15/2004
• Status: Abandoned Application

• Current Assignee: Coretronic Corporation
• Original Assignee: Coretronic Corporation
• Inventors: Hou, Shu-Chi, Liu, Ming-Dah
• Application Number:
  US10/866,661
• Publication Number:
  US 20050276914A1
• Time in Patent Office: Days
• US Class Current: 427/133
• CPC Class Codes: C23C 18/1605 by masking
• CPC Class Codes: C23C 18/1651 Two or more layers only obtained by electroless plating
• CPC Class Codes: C23C 18/31 Coating with metals
• CPC Class Codes: C25D 5/022 using masking means
• CPC Class Codes: G02B 6/0036 2-D arrangement of prisms, protrusions, indentations or roughened surfaces
• CPC Class Codes: G02B 6/0038 Linear indentations or grooves, e.g. arc-shaped grooves or meandering grooves, extending over the full length or width of the light guide
• CPC Class Codes: G02B 6/0043 provided on the surface of the light guide
• CPC Class Codes: G02B 6/0061 to provide homogeneous light output intensity
• CPC Class Codes: G02B 6/0065 Manufacturing aspects; Material aspects
• CPC Class Codes: G03F 7/0017 for the production of embossing, cutting or similar devices; for the production of casting means

Abstract

A method for manufacturing light guide plate mold cores to form a precise pattern on a light guide mold core to produce light guide plates for back light modules. The method includes forming a metal layer of a selected pattern by a micro lithography process that has varying heights, and plating a layer of non-electrolyzed nickel (nickel-phosphorus alloy) to form the surface of the light guide plate mold core. The mold core thus formed, has a smooth surface, a desired mold releasing property and is durable.

Claims

1. A method for manufacturing light guide plate mold cores, comprising steps of:

(a) forming a non-metallic layer of a selected pattern on a surface of a metal substrate;

(b) forming a metal layer on the surface of the metal substrate that is not covered by the non-metallic layer at a thickness not greater than the non-metallic layer;

(c) removing the non-metallic layer; and

(d) forming a surface layer on the surfaces of the metal substrate and the metal layer.

2. The method according to claim 1, wherein the non-metallic layer is a photoresist layer.

3. The method according to claim 2, wherein the step (a) includes coating a photoresist layer on the metal substrate, and forming a selected pattern on the photoresist layer on the metal substrate by exposing and developing processes.

4. The method according to claim 1, wherein the step (b) includes forming the metal layer by electroplating or electroless plating.

5. The method according to claim 1, wherein the step (c) includes using an etching solution or water to remove the non-metallic layer.

6. The method according to claim 1, wherein the step (d) includes using electroless plating to form the surface layer.

7. The method according to claim 6, wherein the electroless plating uses a metallic material which includes non-electrolyzed nickel or non-electrolyzed iron.