Structured resin systems with high thermal conductivity fillers

• US 20050277351A1
• Filed: 06/14/2005
• Published: 12/15/2005
• Est. Priority Date: 06/15/2004
• Status: Active Grant

• Current Assignee: Siemens Energy Incorporated (Siemens AG)
• Original Assignee: Siemens Westinghouse Power Corporation
• Inventors: Stevens, Gary, Smith, James David Blackhall, Wood, John William
• Granted Patent: US 8,216,672 B2
• Time in Patent Office: Days
• US Class Current: 442/110
• CPC Class Codes: C08K 2201/016 Additives defined by their aspect ratio
• CPC Class Codes: C08K 3/14 Carbides
• CPC Class Codes: C08K 3/22 of metals
• CPC Class Codes: C08K 3/28 Nitrogen-containing compounds
• CPC Class Codes: H05K 1/0373 containing additives, e.g. fillers H05K1/036 takes precedence
• CPC Class Codes: H05K 2201/0248 Needles or elongated particles; Elongated cluster of chemically bonded particles microfibers H05K2201/0251; stacked conductors H05K2201/0379
• CPC Class Codes: Y10T 428/24994 Fiber embedded in or on the surface of a polymeric matrix
• CPC Class Codes: Y10T 428/249986 Void-containing component contains also a solid fiber or solid particle
• CPC Class Codes: Y10T 428/28 Web or sheet containing structurally defined element or component and having an adhesive outermost layer
• CPC Class Codes: Y10T 442/2418 Coating or impregnation increases electrical conductivity or anti-static quality
• CPC Class Codes: Y10T 442/2992 Coated or impregnated glass fiber fabric
• CPC Class Codes: Y10T 442/50 FELT FABRIC

Abstract

In one embodiment the present invention provides for a high thermal conductivity highly structured resin that comprises a host highly structured resin matrix, and a high thermal conductivity filler 30. The high thermal conductivity fillers are from 1-1000 nm in length, and high thermal conductivity fillers have an aspect ratio of between 3-100. Particular highly structured highly structured resins include at least one of liquid crystal 40 polymers, interpenetrating networks, dendrimer type matrices, expanding polymers, ladder polymers, star polymers and structured organic-inorganic hybrids 60.

Claims

1. A high thermal conductivity highly structured resin comprising:

a host highly structured resin matrix; and

a high thermal conductivity filler;

wherein said high thermal conductivity fillers are from 1-1000 nm in length, and wherein high thermal conductivity fillers have an aspect ratio of between 3-100.

2. The high thermal conductivity highly structured resin of claim 1, wherein said HS highly structured resin is selected from at least one of liquid crystal polymers, interpenetrating networks, dendrimer type matrices, expanding polymers, ladder polymers, star polymers and structured organic-inorganic hybrids.

3. The high thermal conductivity highly structured resin of claim 1, wherein said high thermal conductivity filler forms a continuous organic-inorganic composite with said host highly structured resin matrix.

4. The high thermal conductivity highly structured resin of claim 1, wherein said high thermal conductivity fillers have an aspect ratio of between 10-50.

5. A continuous organic-inorganic highly structured resin comprising:

a host highly structured resin network; and

inorganic high thermal conductivity fillers evenly dispersed in said host highly structured resin network and essentially completely co-reacted with said host highly structured resin network;

wherein said high thermal conductivity fillers have a length of between 1-1000 nm and an aspect ratio of 10-50;

wherein said high thermal conductivity fillers are selected from at least one of oxides, nitrides, and carbides;

wherein said continuous organic-inorganic highly structured resin comprises a maximum of 60% by volume of said high thermal conductivity fillers.

6. The continuous organic-inorganic highly structured resin of claim 5, wherein said high thermal conductivity fillers have been surface treated to introduce surface functional groups that allows for the essentially complete co-reactivity with said host highly structured resin network.

7. The continuous organic-inorganic highly structured resin of claim 5, wherein said at least one of said oxides, nitrides, and carbides comprise Al2O3, AlN, MgO, ZnO, BeO, BN, Si3N4, SiC and SiO2 with mixed stoichiometric and non-stoichiometric combinations.

8. The continuous organic-inorganic highly structured resin of claim 5, wherein said continuous organic-inorganic highly structured resin comprises a maximum of 35% by volume of said high thermal conductivity fillers.

9. The continuous organic-inorganic highly structured resin of claim 5, wherein said functional groups comprise at least one of hydroxyl, carboxylic, amine, epoxide, silane and vinyl groups.

10. The continuous organic-inorganic highly structured resin of claim 5, wherein said host highly structured resin network includes epoxy, polyimide epoxy, liquid crystal epoxy and cyanate-ester.

11. The continuous organic-inorganic highly structured resin of claim 5, wherein said continuous organic-inorganic highly structured resin further comprises a cross-linking agent.

12. The continuous organic-inorganic highly structured resin of claim 5, wherein said continuous organic-inorganic highly structured resin is impregnated into a porous media.

13. A porous media impregnated with a high thermal conductivity highly structured resin comprising:

a porous media; and

a high thermal conductivity material loaded highly structured resin, wherein said high thermal conductivity material comprises 5-60% by volume of said highly structured resin;

wherein said high thermal conductivity materials have aspect ratios of 3-100;

wherein said highly structured resin is at least one of liquid crystal polymers, interpenetrating networks, dendrimer type matrices, expanding polymers, ladder polymers, star polymers and structured organic-inorganic hybrids.

14. The porous media impregnated with said high thermal conductivity highly structured resin of claim 13, HTC materials comprise at least one of silica, alumina, magnesium oxide, silicon carbide, boron nitride, aluminum nitride, zinc oxide and diamonds and dendrimers of approximately 1-1000 nm in size and have aspect ratios of 10-50.

15. The porous media impregnated with said high thermal conductivity highly structured resin of claim 13, wherein said high thermal conductivity material comprises 25-40% by volume of said highly structured resin.

16. The porous media impregnated with said high thermal conductivity highly structured resin of claim 13, wherein said porous media is a paper matrix.

17. The porous media impregnated with said high thermal conductivity highly structured resin of claim 16, wherein said paper matrix is a mica-glass insulating paper.

18. The porous media impregnated with said high thermal conductivity highly structured resin of claim 13, wherein said porous media is the glass fiber component of circuit boards.

19. The porous media impregnated with said high thermal conductivity highly structured resin of claim 13, wherein said porous media is a cloth malt.

20. The porous media impregnated with said high thermal conductivity highly structured resin of claim 13, wherein said porous media is felt.