Sealing material for liquid crystal and liquid crystal display cell using same
First Claim
1. A sealing material for liquid crystals comprising:
- (A) as a curing resin a mixture of (a) an epoxy group-containing curing resin and (b) a (meth)acryloyl group-containing curing resin, or (c) a curing resin containing an epoxy group and a (meth)acryloyl group;
(B) a radical-forming photopolymerization initiator;
(C) an isophthalic acid dihydrazide having an average particle diameter of 3 μ
m or smaller; and
(D) a filler having an average particle diameter of 3 μ
m or smaller.
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Accused Products
Abstract
The objective of the present invention is to develop a sealing material for liquid crystals which hardly contaminates liquid crystals, shows excellent coating workability and bonding property when applied to a substrate, and has a long working time (pot life), a low-temperature curing property and an excellent adhesion strength. The sealing material for liquid crystals is characterized by comprising: (A) as a curing resin a mixture of (a) an epoxy group-containing curing resin and (b) a (meth)acryloyl group-containing curing resin, or (c) a curing resin containing an epoxy group and a (meth)acryloyl group; (B) a radical-forming photopolymerization initiator; (C) an isophthalic acid dihydrazide having an average particle diameter of 3 μm or smaller; and (D) a filler having an average particle diameter of 3 μm or smaller.
23 Citations
14 Claims
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1. A sealing material for liquid crystals comprising:
- (A) as a curing resin a mixture of (a) an epoxy group-containing curing resin and (b) a (meth)acryloyl group-containing curing resin, or (c) a curing resin containing an epoxy group and a (meth)acryloyl group;
(B) a radical-forming photopolymerization initiator;
(C) an isophthalic acid dihydrazide having an average particle diameter of 3 μ
m or smaller; and
(D) a filler having an average particle diameter of 3 μ
m or smaller. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
- (A) as a curing resin a mixture of (a) an epoxy group-containing curing resin and (b) a (meth)acryloyl group-containing curing resin, or (c) a curing resin containing an epoxy group and a (meth)acryloyl group;
Specification