Interference display cell and fabrication method thereof
First Claim
Patent Images
1. A method for fabricating an optical interference display unit disposed on a transparent substrate, the method comprising:
- forming a first electrode on the transparent substrate;
forming a sacrificial layer on the first electrode;
forming at least two openings in the sacrificial layer and the first electrode;
forming support structures in the openings;
forming a first material layer on the sacrificial layer and the support structures;
forming a second material layer on the first material layer;
forming a patterned photoresist layer on the second material layer;
while using the patterned photoresist layer as a mask, etching the second material layer to expose the first material layer;
stripping the patterned photoresist layer;
while using the second material layer as a mask, etching the first material layer to expose the support structures; and
removing the sacrificial layer.
4 Assignments
0 Petitions
Accused Products
Abstract
An optical interference display unit with a first electrode, a second electrode and support structures located between the two electrodes is provided. The second electrode has at least a first material layer and a second material layer. At least one material layer of the two is made from conductive material and the second conductive layer is used as a mask while an etching process is performed to etch the first material layer to define the second electrode.
140 Citations
8 Claims
-
1. A method for fabricating an optical interference display unit disposed on a transparent substrate, the method comprising:
-
forming a first electrode on the transparent substrate;
forming a sacrificial layer on the first electrode;
forming at least two openings in the sacrificial layer and the first electrode;
forming support structures in the openings;
forming a first material layer on the sacrificial layer and the support structures;
forming a second material layer on the first material layer;
forming a patterned photoresist layer on the second material layer;
while using the patterned photoresist layer as a mask, etching the second material layer to expose the first material layer;
stripping the patterned photoresist layer;
while using the second material layer as a mask, etching the first material layer to expose the support structures; and
removing the sacrificial layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
-
Specification