Image sensor package

• US 20060011811A1
• Filed: 08/21/2004
• Published: 01/19/2006
• Est. Priority Date: 07/16/2004
• Status: Active Grant

• Current Assignee: KT Imaging USA, LLC (Texas IP Ventures II, LLC)
• Original Assignee: Kingpak Technology Inc.
• Inventors: Wang, Tony, Hsieh, Figo, Hsin, Chung Hsien, Chou, Chin Hai
• Granted Patent: US 7,511,261 B2
• Time in Patent Office: Days
• US Class Current: 250/208.100
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/8592 Applying permanent coating, e.g. protective coating
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 27/14625 Optical elements or arrangements associated with the device
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Abstract

An image sensor module structure includes a substrate, a photosensitive chip, a lens holder, and a lens barrel. The substrate has an upper surface on which first electrodes are formed, and a lower surface on which second electrodes are formed. The photosensitive chip is mounted on the upper surface of the substrate, and is electrically connected to the first electrodes of the substrate. The lens holder has an upper end face, a lower upper face, and an opening penetrating through the lens holder. The upper end of the opening is formed with an internal thread, and the lower end of the opening is formed with a breach. The lens holder is adhered on the upper surface of the substrate by glue, therefore, the photosensitive chip is located within the opening of the lens holder. The lens barrel has an upper end face, a lower end face, and an external thread screwed to the internal thread of the lens holder.

Claims

1. An image sensor module structure, the structure comprising:

a substrate having an upper surface on which first electrodes are formed, and a lower surface on which second electrodes are formed, the first electrodes are corresponding to electrically connect to the second electrode;

a photosensitive chip mounted on the upper surface of the substrate, and electrically connected to the first electrodes of the substrate;

a lens holder having an upper end face, a lower upper face, and an opening penetrating through the lens holder from the upper end face to the lower end face, the upper end of the opening formed with an internal thread and the lower end of the opening formed with a breach, so that the internal diameter of the upper end of the opening is smaller than the lower end of the opening, the lens holder adhered on the upper surface of the substrate by glue, therefore, the photosensitive chip is located within the opening of the lens holder; and

a lens barrel having an upper end face, a lower end face, and an external thread screwed to the internal thread of the lens holder.

2. The image sensor module structure according to claim 1, wherein the photosensitive chip is electrically connected to the first electrode of the substrate by wires.

3. The image sensor module structure according to claim 1, wherein the breach of the opening is a triangular form.

4. The image sensor module structure according to claim 2, wherein the glue is coated over the wires.

5. The image sensor module structure according to claim 2, wherein the glue is filled within the breach of the lens holder.