Conductive inks for metalization in integrated polymer microsystems

• US 20060029731A1
• Filed: 10/03/2005
• Published: 02/09/2006
• Est. Priority Date: 07/26/2002
• Status: Active Grant

• Current Assignee: Lawrence Livermore National Security LLC (Government of the United States of America)
• Original Assignee: Regents of the University of California (University of California)
• Inventors: Krulevitch, Peter A., Hamilton, Julie K., Benett, William J., Maghribi, Mariam N., Davidson, James Courtney, Tovar, Armando R.
• Granted Patent: US 8,202,566 B2
• Time in Patent Office: Days
• US Class Current: 427/240
• CPC Class Codes: H01L 23/145 Organic substrates, e.g. plastic
• CPC Class Codes: H01L 23/5387 Flexible insulating substrates H01L23/5388 takes precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/1433 Application-specific integrated circuit [ASIC]
• CPC Class Codes: H05K 1/0272 Adaptations for fluid transport, e.g. channels, holes
• CPC Class Codes: H05K 1/0283 Stretchable printed circuits
• CPC Class Codes: H05K 1/032 consisting of one material
• CPC Class Codes: H05K 1/0393 Flexible materials H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups
• CPC Class Codes: H05K 1/095 for polymer thick films, i.e. having a permanent organic polymeric binder
• CPC Class Codes: H05K 2201/0162 Silicon containing polymer, e.g. silicone
• CPC Class Codes: H05K 2203/0108 Male die used for patterning, punching or transferring
• CPC Class Codes: H05K 2203/0126 Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
• CPC Class Codes: H05K 2203/082 Suction, e.g. for holding solder balls or components
• CPC Class Codes: H05K 3/101 by casting or moulding of conductive material
• CPC Class Codes: H05K 3/12 using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
• CPC Class Codes: H05K 3/1216 by screen printing or stencil printing
• CPC Class Codes: H05K 3/1258 by using a substrate provided with a shape pattern, e.g. grooves, banks, resist pattern
• CPC Class Codes: H05K 3/1275 by other printing techniques, e.g. letterpress printing, intaglio printing, lithographic printing, offset printing
• CPC Class Codes: Y10S 428/901 Printed circuit
• CPC Class Codes: Y10T 428/24917 : including metal layer

Abstract

A system of metalization in an integrated polymer microsystem. A flexible polymer substrate is provided and conductive ink is applied to the substrate. In one embodiment the flexible polymer substrate is silicone. In another embodiment the flexible polymer substrate comprises poly(dimethylsiloxane).

Claims

1. A method of metalization in an integrated polymer microsystem, comprising the steps of:

providing a flexible polymer substrate, and

applying conductive ink to said substrate.

2. The method of metalization of claim 1 wherein said flexible polymer substrate is silicone.

3. The method of metalization of claim 1 wherein said flexible polymer substrate comprises poly(dimethylsiloxane).

4. The method of metalization of claim 1 wherein said step of applying conductive inks to said flexible polymer substrate comprises producing three-dimensional microfluidic channels in said flexible polymer substrate and filling said three-dimensional microfluidic channels with said conductive ink.

5. The method of metalization of claim 4 including the step of curing said conductive ink to produce embedded conducting networks within said flexible polymer substrate.

6. The method of metalization of claim 4 wherein said step of filling said three-dimensional microfluidic channels with said conductive ink comprises injecting said conductive ink into said three-dimensional microfluidic channels.

7. The method of metalization of claim 4 wherein said step of filling said three-dimensional microfluidic channels with said conductive ink comprises injecting said conductive ink into said three-dimensional microfluidic channels using a syringe.

8. The method of metalization of claim 4 wherein said step of filling said three-dimensional microfluidic channels with said conductive ink comprises using a vacuum to draw said conductive ink through said three-dimensional microfluidic channels.

9. The method of metalization of claim 1 wherein said step of applying conductive inks to said flexible polymer substrate comprises using a stamp to place said conductive ink in a desired pattern on said flexible polymer substrate.

10. The method of metalization of claim 1 wherein said step of applying conductive inks to said flexible polymer substrate uses photolithography.

11. The method of metalization of claim 1 wherein said step of applying conductive inks to said flexible polymer substrate comprises spreading said conductive ink onto said flexible polymer substrate.

12. The method of metalization of claim 1 wherein said step of applying conductive inks to said flexible polymer substrate comprises spreading said conductive ink onto said flexible polymer substrate by spin-coating.

13. The method of metalization of claim 1 wherein said step of applying conductive inks to said flexible polymer substrate comprises spreading said conductive ink onto said flexible polymer substrate by spraying.

14. The method of metalization of claim 1 wherein said step of applying conductive inks to said flexible polymer substrate comprises screen printing.

15. The method of metalization of claim 1 wherein said step of applying conductive inks to said flexible polymer substrate comprises screen printing using a permeable screen mesh.

16. The method of metalization of claim 1 wherein said step of applying conductive inks to said flexible polymer substrate comprises screen printing using a permeable screen mesh of monofilament polyester.

17. The method of metalization of claim 1 wherein said step of applying conductive inks to said flexible polymer substrate comprises screen printing using a permeable screen mesh of stainless steel.

18. The method of metalization of claim 1 wherein said step of applying conductive inks to said flexible polymer substrate comprises screen printing using a screen mesh of polyamide.

19. The method of metalization of claim 1 wherein said step of applying conductive inks to said flexible polymer substrate comprises screen printing using a mechanical stencil of a direct type.

20. The method of metalization of claim 1 wherein said step of applying conductive inks to said flexible polymer substrate comprises screen printing using a mechanical stencil of an indirect type.

21. The method of metalization of claim 1 wherein said step of applying conductive inks to said flexible polymer substrate comprises screen printing using a photomechanical stencil of a direct type.

22. The method of metalization of claim 1 wherein said step of applying conductive inks to said flexible polymer substrate comprises screen printing using a photomechanical stencil of an indirect type.