Electronic component comprising a multilayer wiring frame and method for producing the same

• US 20060043539A1
• Filed: 06/30/2003
• Published: 03/02/2006
• Est. Priority Date: 07/01/2002
• Status: Active Grant

• Current Assignee: Polaris Innovations Limited (Wi-LAN Inc.)
• Original Assignee: Qimonda AG (Infineon Technologies AG)
• Inventors: Thomas, Jochen, Wennemuth, Ingo
• Granted Patent: US 7,294,910 B2
• Time in Patent Office: Days
• US Class Current: 257/659
• CPC Class Codes: B82Y 10/00 Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/4824 Connecting between the body and an opposite side of the item with respect to the body
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/48471 the other connecting portion not on the bonding area being a ball bond, i.e. wedge-to-ball, reverse stitch
• CPC Class Codes: H01L 2224/73215 Layer and wire connectors
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/85399 Material
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 23/3128 the substrate having spherical bumps for external connection
• CPC Class Codes: H01L 23/49572 consisting of thin flexible metallic tape with or without a film carrier H01L23/49503 - H01L23/49568 and H01L23/49575 - H01L23/49579 take precedence
• CPC Class Codes: H01L 23/49816 Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
• CPC Class Codes: H01L 23/49827 Via connections through the substrates, e.g. pins going through the substrate, coaxial cables H01L23/49822, H01L23/49833, H01L23/4985, H01L23/49861 take precedence
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 24/32 of an individual layer connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/50 : Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto thin flexible metallic tape with or without a film carrier H01L23/49572, flexible insulating substrates H01L23/4985, H01L23/5387
• CPC Class Codes: H01L 24/73 : Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 24/86 : using tape automated bonding [TAB]
• CPC Class Codes: H01L 24/97 : the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01004 : Beryllium [Be]
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01012 : Magnesium [Mg]
• CPC Class Codes: H01L 2924/01014 : Silicon [Si]
• CPC Class Codes: H01L 2924/01026 : Iron [Fe]
• CPC Class Codes: H01L 2924/01027 : Cobalt [Co]
• CPC Class Codes: H01L 2924/01028 : Nickel [Ni]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01032 : Germanium [Ge]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01052 : Tellurium [Te]
• CPC Class Codes: H01L 2924/01057 : Lanthanum [La]
• CPC Class Codes: H01L 2924/01058 : Cerium [Ce]
• CPC Class Codes: H01L 2924/01068 : Erbium [Er]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/0132 : Binary Alloys
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/07802 : not being an ohmic electrical conductor
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding

Abstract

The invention relates to an electronic component having a multilayered rewiring plate, which carries a circuit chip, in particular a magnetic memory chip, and connects contact areas of the chip to external contacts of the electronic component via rewiring lines. The rewiring plate has at least one patterned, magnetic shielding layer made of an amorphous metal or an amorphous metal alloy. Furthermore, the invention encompasses a method for producing this electronic component.

Claims

1-27. -27. (canceled)

28. An electronic component comprising:

a multilayered rewiring plate;

a circuit chip, including a magnetic memory chip, carried on the rewiring plate, wherein the rewiring plate connects contact areas of the chip to external contacts of the electronic component via rewiring lines, the rewiring plate having at least one patterned, magnetic shielding layer made of an amorphous metal or an amorphous metal alloy.

29. The electronic component of claim 28, comprising wherein the circuit chip has magnetic memory cells.

30. The electronic component of claim 28, comprising wherein the circuit chip is a logic chip.

31. The electronic component of claim 28, comprising wherein the shielding layer is a patterned shielding film having a thickness of between 20 and 75 micrometers.

32. The electronic component of claim 28, comprising wherein the shielding layer has a plurality of stacked shielding films laminated one on top of the other.

33. The electronic component of claim 28, comprising wherein the amorphous metal comprises a cobalt or cobalt alloy.

34. The electronic component of claim 28, comprising wherein the amorphous metal comprises a boron/iron alloy.

35. The electronic component of claim 28, comprising wherein the amorphous metal has a saturation induction of between 0.5 and 1 tesla.

36. The electronic component of claim 28, comprising wherein the amorphous metal has a saturation magnetostriction of less than 0.2×

10<sup>−

6.</sup>

37. The electronic component of claim 28, comprising wherein the amorphous metal has a Curie point of between 200°

C. and 500°

C.

38. The electronic component of claim 28, comprising wherein the patterned shielding layer is arranged on the outer side of the rewiring plate, which is opposite to the circuit chip, the shielding film having at least openings for external contacts arranged in a predetermined pitch annularly or in a matrix.

39. The electronic component of claim 28, comprising wherein the patterned shielding layer of the rewiring plate of a memory chip has at least one bonding channel opening.

40. The electronic component of claim 28, comprising wherein the patterned shielding layer is arranged on the chip side of the rewiring plate and has at least openings for bonding contact areas.

41. The electronic component of claim 28, comprising wherein the circuit chip has a shielding film on its rear side.

42. The electronic component of claim 28, comprising wherein the circuit chip has a patterned shielding film on its active front side, in which shielding film at least openings for the contact areas of the circuit chips are provided.

43. The electronic component of claim 28, comprising wherein the shielding layer on the rewiring plate has at least a shielding factor of between 50 and 100.

44. A method for producing an electronic component comprising:

defining the electronic component to include a multilayered rewiring plate, which carries at least one circuit chip and connects contact areas of the circuit chip to external contacts of the electronic component via rewiring lines, the rewiring plate having at least one patterned, magnetic shielding layer made of an amorphous metal or an amorphous metal alloy;

patterning of a shielding film made of amorphous metal or an amorphous metal alloy for a panel with a plurality of component positions;

laminating the patterned shielding film onto the rewiring plate of the panel;

applying and electrical connecting of circuit chips in the component positions of the rewiring plate of the panel;

applying a plastic housing composition to the panel embedding the circuit chips and the electrical connections;

applying external contacts in the component positions of the panel; and

singulation of the component positions of the panel to form individual electronic components.

45. The method of claim 44, comprising:

Stamping predetermined patterns of openings to define the patterning of the shielding films.

46. The method of claim 44, comprising:

using laser removal to pattern the shielding films.

47. The method of claim 44, comprising patterning of the shielding films by etching methods through an etching mask.

48. The method of claim 44 comprising:

prior to the application of the circuit chips to the chip side of the rewiring plate, which carries the circuit chips, the patterned shielding film is laminated on, leaving the areas provided for the bonding connections free.

49. The method according of claim 44, comprising laminating the patterned shielding film onto the outer side of the rewiring plate, which carries the external contacts, with the areas provided for the external contacts being left free.

50. The method according to one of claims 44, comprising:

in the component positions of the panel, applying the circuit chips with magnetic memory cells to the rewiring plate.

51. The method of claim 44, comprising:

in the component positions of the panel, applying circuit chips with logic circuits to the rewiring plate.

52. The method of claim 44, comprising:

laminating a plurality of patterned shielding films one on top of the other.

53. The method of claim 44, comprising:

applying shielding films on the rear sides of the circuit chips, prior to the application of the circuit chips to the rewiring plate.

54. The method of claim 44, comprising:

applying patterned shielding films on the active front side of the circuit chips with the contact areas of the circuit chips being left free, prior to the application of the circuit chips to the rewiring plate.

55. An electronic component comprising:

a multilayered rewiring plate;

a circuit chip, including a magnetic memory chip, carried on the rewiring plate, wherein the rewiring plate includes connecting means for connecting contact areas of the chip to external contacts of the electronic component via rewiring lines, the rewiring plate having at least one patterned, magnetic shielding layer made of an amorphous metal or an amorphous metal alloy.