Die package, conductive element, semiconductor device including same, microlens, system including same, and methods of manufacture

• US 20060046347A1
• Filed: 09/02/2004
• Published: 03/02/2006
• Est. Priority Date: 09/02/2004
• Status: Active Grant

• Current Assignee: Micron Technology, Inc.
• Original Assignee: Micron Technology, Inc.
• Inventors: Watkins, Charles M., Farnworth, Warren M., Wood, Alan G., Benson, Peter A.
• Granted Patent: US 7,235,431 B2
• Time in Patent Office: Days
• US Class Current: 438/106
• CPC Class Codes: B33Y 10/00 Processes of additive manufacturing
• CPC Class Codes: B33Y 80/00 Products made by additive manufacturing
• CPC Class Codes: H01L 21/56 Encapsulations, e.g. encapsulation layers, coatings
• CPC Class Codes: H01L 2224/04105 Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
• CPC Class Codes: H01L 2224/20 Structure, shape, material or disposition of high density interconnect preforms
• CPC Class Codes: H01L 23/3128 the substrate having spherical bumps for external connection
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 27/14627 Microlenses
• CPC Class Codes: H01L 27/14685 Process for coatings or optical elements
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01027 Cobalt [Co]
• CPC Class Codes: H01L 2924/01046 Palladium [Pd]
• CPC Class Codes: H01L 2924/12041 LED

Abstract

A method of packaging at least a portion of a semiconductor die or dice is disclosed. Uncured material may be disposed proximate at least the periphery of at least one semiconductor die and at least partially cured substantially as a whole. Method of forming conductive elements such as traces, vias, and bond pads are also disclosed. More specifically, forming at least one organometallic layer to a substrate surface and selectively heating at least a portion thereof is disclosed. Also, forming a layer of conductive photopolymer over at least a portion of a surface of a substrate and removing at least a portion thereof is disclosed. A microlens having a plurality of mutually adhered layers of cured, optically transmissive material, methods of forming same, and systems so equipped are disclosed.

Claims

1. A method of packaging a plurality of semiconductor dice, comprising:

providing a plurality of semiconductor dice, each including an active surface and bond pads thereon, a backside generally opposite thereto, and an exterior periphery;

affixing the backside of each of the plurality of semiconductor dice to a carrier;

disposing flowable, uncured dielectric material at least partially around and between the plurality of semiconductor dice;

at least partially curing, substantially as a whole, the flowable, uncured dielectric material; and

singulating each of the plurality of the semiconductor dice through the cured dielectric material.

2. The method of claim 1, wherein disposing flowable, uncured dielectric material at least partially around and between the plurality of semiconductor dice comprises disposing uncured dielectric material over the active surface of each of the plurality of semiconductor dice.

3. The method of claim 2, wherein disposing flowable, uncured dielectric material at least partially around and between the plurality of semiconductor dice comprises at least one of immersing, dipping, spin-coating, printing, and spraying.

4. The method of claim 2, further comprising:

curing the flowable, uncured dielectric material over the bond pads of each of the plurality of semiconductor dice; and

removing a portion of the cured dielectric material to expose the bond pads of each of the plurality of semiconductor dice.

5. The method of claim 4, wherein removing the portion of the cured dielectric material to expose the bond pads of each of the plurality of semiconductor dice comprises:

forming a resist over at least a portion of a surface of the cured dielectric material;

etching the at least a portion of the surface of the cured dielectric material uncovered by the resist; and

removing the resist from the at least a portion of the surface of the cured dielectric material.

6. The method of claim 1, further comprising:

preventing the flowable, uncured dielectric material from contacting the bond pads of each of the plurality of semiconductor dice prior to at least partially curing, substantially as a whole, the flowable, uncured dielectric material.

7. The method of claim 6, wherein preventing the flowable, uncured dielectric material from contacting the bond pads comprises disposing a cover element in sealing engagement therewith.

8. The method of claim 6, wherein preventing the flowable, uncured dielectric material from contacting the bond pads comprises forming barrier structures extending from the active surface of each of the plurality of semiconductor dice and surrounds the bond pads thereof.

9. The method of claim 1, further comprising preventing the flowable, uncured dielectric material proximate to the bond pads of each of the plurality of semiconductor dice from curing.

10. The method of claim 1, further comprising forming conductive traces extending from the bond pads, respectively, of each of the plurality of semiconductor dice.

11. The method of claim 1, wherein at least partially curing, substantially as a whole, the flowable, uncured dielectric material proximate to at least the exterior periphery of at least one semiconductor die of the plurality of semiconductor dice to form a package thereabout comprises:

disposing the flowable, uncured dielectric material at least partially around and between the plurality of semiconductor dice to a first vertical level;

at least partially curing, substantially as a whole, the flowable, uncured dielectric material at the first vertical level;

disposing the flowable, uncured dielectric material at least partially around and between the plurality of semiconductor dice to a second vertical level; and

at least partially curing, substantially as a whole, the flowable, uncured dielectric material at the second vertical level.

12. The method of claim 1, further comprising installing a surface mount component in operable communication with each of the plurality of semiconductor dice, respectively.

13. The method of claim 1, wherein at least partially curing, substantially as a whole, the flowable, uncured dielectric material comprises exposing the flowable, uncured dielectric material to a light source.

14. The method of claim 13, wherein exposing the flowable, uncured dielectric material to a light source comprises exposing the flowable, uncured dielectric material to a light source through an exposure mask.

15. The method of claim 1, wherein at least partially curing, substantially as a whole, the flowable, uncured dielectric material comprises exposing the flowable, uncured dielectric material to a heat source.

16. The method of claim 1, wherein providing the plurality of semiconductor dice comprises providing a plurality of known good semiconductor dice.

17. A method of forming a conductive element onto a substrate, comprising:

forming an organometallic layer onto at least a portion of a surface of a substrate;

heating, at most, a portion of the organometallic layer; and

removing an unheated portion of the organometallic layer.

18. The method of claim 17, wherein removing the unheated portion of the organometallic layer comprises exposing the organometallic layer to a solvent after heating the portion of the organometallic layer.

19. The method of claim 17, wherein forming the conductive element comprises forming a conductive trace.

20. The method of claim 17, wherein forming the organometallic layer onto at least the portion of the surface of the substrate comprises forming an organometallic layer onto at least a portion of a surface of at least one of a ceramic substrate, an FR4 substrate, or a polyimide substrate.

21. The method of claim 17, wherein heating, at most, the portion of the organometallic layer comprises selectively heating the portion of the organometallic layer with a laser beam.

22. The method of claim 21, wherein removing the unheated portion of the organometallic layer comprises exposing the organometallic layer to a solvent after selectively heating the portion of the organometallic layer with the laser beam.

23. The method of claim 17, further comprising plating a metal onto the heated portion of the organometallic layer.

24. The method of claim 23, wherein plating the metal onto the selectively exposed portion of the organometallic layer comprises at least one of electrolytic plating and electroless plating.

25. A method of forming a conductive via, comprising:

forming a hole at least partially through a thickness of a substrate;

depositing an organometallic material within at least a portion of the hole;

selectively heating at least a portion of the organometallic material.

26. The method of claim 25, further comprising exposing the organometallic material to a solvent after selectively heating the at least a portion of the organometallic material.

27. The method of claim 26, wherein selectively heating the at least a portion of the organometallic material comprises selectively heating the at least a portion of the organometallic material with a laser beam.

28. The method of claim 25, further comprising plating a metal onto the at least a portion of the organometallic material.

29. The method of claim 28, wherein plating the metal onto the at least a portion of the organometallic layer comprises at least one of electrolytic plating and electroless plating.

30. The method of claim 25, wherein depositing the organometallic material within the at least a portion of the hole comprises depositing a plurality of sequential layers of the organometallic material within the at least a portion of the hole.

31. The method of claim 25, wherein forming the hole at least partially through the thickness of the substrate comprises ablating the hole at least partially through the thickness of the substrate with a laser beam.

32. The method of claim 25, wherein selectively heating the at least a portion of the organometallic material comprises heating the at least a portion of the organometallic material with a laser beam.

33. The method of claim 32, further comprising exposing the organometallic material to a solvent after selectively heating the at least a portion of the organometallic material with the laser beam.

34. The method of claim 25, wherein selectively heating the at least a portion of the organometallic material comprises selectively heating a portion of the organometallic material adjacent to a boundary wall of the hole and forming a bore therewith.

35. The method of claim 34, wherein selectively heating the portion of the organometallic material adjacent to the boundary wall of the hole and forming the bore therewith comprises selectively heating a plurality of sequential layers of the organometallic material adjacent to the boundary wall of the hole.

36. A method of forming a conductive element onto a substrate, the method comprising:

depositing a flowable, uncured conductive material onto a surface of a substrate;

selectively curing the flowable, uncured conductive material over at least a portion of the surface thereof;

removing a portion of the cured conductive material.

37. The method of claim 36, wherein depositing the flowable, uncured conductive material onto the surface of the substrate comprises at least one of immersing, dipping, spin-coating, stamping, printing, and spraying.

38. The method of claim 36, wherein depositing the flowable, uncured conductive material onto the surface of the substrate comprises depositing the flowable, uncured conductive material onto the surface of the substrate by way of at least one of maskless mesoscale materials deposition, 3-D printing deposition, and micropen deposition.

39. The method of claim 36, wherein selectively curing the flowable, uncured conductive material over the at least a portion of the surface thereof comprises curing the flowable, uncured conductive material over substantially the entire surface of the substrate.

40. The method of claim 36, wherein removing the portion of the cured conductive material comprises removing the portion by etching.

41. The method of claim 36, wherein depositing the flowable, uncured conductive material onto the surface of the substrate comprises depositing a conductive photopolymer.

42. The method of claim 41, wherein depositing the conductive photopolymer onto the surface of the substrate comprises at least one of immersing, dipping, spin-coating, printing, and spraying.

43. A method of fabrication of a microlens for use in an imaging device, comprising:

disposing a flowable, uncured optically transmissive material in at least one layer onto a surface of a substrate;

selectively curing at least a portion of the flowable, uncured optically transmissive material;

removing the flowable, uncured optically transmissive material from the surface of the substrate.

44. The method of claim 43, wherein disposing a flowable, uncured optically transmissive material in at least one layer onto a surface of a substrate comprises disposing a flowable, uncured optically transmissive material in at least one layer onto a surface of a substrate by way of at least one of maskless mesoscale materials deposition, 3-D printing deposition, and micropen deposition.

45. The method of claim 43, wherein disposing a flowable, uncured optically transmissive material in at least one layer onto a surface of a substrate comprises at least one of immersing, dipping, spin-coating, printing, stamping, and spraying.

46. The method of claim 43, further comprising:

micromachining at least one layer of the selectively cured optically transmissive material with a laser beam.

47. The method of claim 43, wherein disposing the flowable, uncured optically transmissive material in at least one layer onto a surface of a substrate comprises disposing at least one of a photopolymer and a thermoplastic onto the surface of the substrate.

48. The method of claim 43, further comprising:

heating at least the surface of the selectively cured optically transmissive material to a temperature exceeding a glass transition temperature thereof.

49. The method of claim 43, wherein selectively curing at least a portion of the flowable, uncured optically transmissive material comprises:

curing a first layer of the flowable, uncured optically transmissive material;

curing at least one additional layer of the flowable, uncured optically transmissive material;

wherein the at least one additional layer is superimposed in relationship to the first layer.

50. The method of claim 49, further comprising:

heating at least the surface of the optically transmissive material to a temperature exceeding a glass transition temperature thereof.

51. The method of claim 49, further comprising:

micromachining at least the first layer and the at least one additional layer with a laser beam.

52. The method of claim 43, wherein disposing the flowable, uncured optically transmissive material in at least one layer onto the surface of the substrate and selectively curing the at least a portion of the flowable, uncured optically transmissive material comprises sequentially forming the microlens of a plurality of vertically superimposed mutually adhered layers of the optically transmissive material.

53. The method of claim 52, further comprising:

micromachining at least one layer of the plurality of vertically superimposed mutually adhered layers with a laser beam.

54. The method of claim 52, further comprising:

heating at least a surface of the optically transmissive material to a temperature exceeding a glass transition temperature thereof.

55. The method of claim 43, wherein disposing the flowable, uncured optically transmissive material in at least one layer onto the surface of the substrate and selectively curing the at least a portion of the flowable, uncured optically transmissive material comprises repeatedly sequentially disposing the flowable, uncured optically transmissive material onto the surface of the substrate and selectively curing the at least a portion of the flowable, uncured optically transmissive material to form a plurality of superimposed mutually adhered layers of the cured optically transmissive material.

56. The method of claim 55, further comprising:

micromachining at least one layer of the plurality of superimposed mutually adhered layers with a laser beam.

57. The method of claim 55, further comprising:

heating at least a surface of the cured optically transmissive material to a temperature exceeding a glass transition temperature thereof.

58. A microlens for directing radiation toward a sensor of an imaging device, comprising:

a plurality of mutually adhered layers of cured optically transmissive material.

59. The microlens of claim 58, wherein an exterior surface thereof exhibits stair-stepping.

60. The microlens of claim 58, wherein the plurality of mutually adhered layers comprises at least one of a photopolymer and a thermoplastic.

61. A system, comprising:

at least one microprocessor;

a substrate including an array of microlenses formed thereon in electrical communication with the at least one microprocessor;

wherein the array of microlenses includes at least one microlens comprising a plurality of mutually adhered layers of cured optically transmissive material.

62. The system of claim 61, wherein an exterior surface thereof exhibits stair-stepping.

63. The system of claim 61, wherein the plurality of mutually adhered layers comprises at least one of a photopolymer and a thermoplastic.