Transparent resin composition for optical sensor filter, optical sensor, and process of producing method therefor

• US 20060049533A1
• Filed: 01/16/2004
• Published: 03/09/2006
• Est. Priority Date: 01/20/2003
• Status: Abandoned Application

• Current Assignee: Sharp Kabushiki Kaisha (Hon Hai Precision Industry Co., Ltd.)
• Original Assignee: Sharp Kabushiki Kaisha (Hon Hai Precision Industry Co., Ltd.)
• Inventors: Kamoshita, Shoichi
• Application Number:
  US10/542,492
• Publication Number:
  US 20060049533A1
• Time in Patent Office: Days
• US Class Current: 264/1.700
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/12036 PN diode
• CPC Class Codes: H01L 2924/12043 Photo diode
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding
• CPC Class Codes: H01L 31/0203 Containers; Encapsulations , e.g. encapsulation of photodiodesfor photovoltaic devices H01L31/048; for organic photosensitive devices H10K30/80
• CPC Class Codes: H01L 31/02162 for filtering or shielding light, e.g. multicolour filters for photodetectors

Abstract

It is an object of the present invention to provide a highly reliable optical sensor and a production process of the same, the optical sensor being excellent in the characteristic of blocking infrared radiation and capable of being manufactured at a low cost without an increase in the number of steps carried out in the assembly of electronic apparatus. The present invention includes: a substrate 1 having an electrode 3; a photodetector 2 electrically connected to the electrode 3; and a light-transmissive resin encapsulating portion 11 for encapsulating the photodetector 2 on the substrate 1, the optical sensor further including an infrared-blocking layer either inside the light-transmissive resin encapsulating portion 11 or on an outer surface of the light-transmissive resin encapsulating portion 11 for blocking infrared radiation from the outside from reaching the photodetector.

Claims

1. An optical sensor comprising:

a substrate having an electrode;

a photodetector electrically connected to the electrode; and

a light-transmissive resin encapsulating portion for encapsulating the photodetector on the substrate, the optical sensor characterized by further comprising an infrared-blocking layer either inside the light-transmissive resin encapsulating portion or on an outer surface of the light-transmissive resin encapsulating portion for blocking infrared radiation from the outside from reaching the photodetector.

3. The optical sensor as set forth in claim 1, wherein the infrared-blocking layer is formed on the outer surface of the light-transmissive resin encapsulating portion and is either an infrared-absorbing layer containing an infrared-absorbing substance or an infrared-reflecting layer containing an infrared-reflecting substance.

4. The optical sensor as set forth in claim 1, wherein the light-transmissive resin encapsulating portion has an inner resin portion for encapsulating the photodetector and an outer resin portion for covering the inner resin portion and wherein the infrared-blocking layer is interposed between the inner resin portion and the outer resin portion and is either an infrared-absorbing layer containing an infrared-absorbing substance or an infrared-reflecting layer containing an infrared-reflecting substance.

6. The optical sensor as set forth in claim 1, further comprising a light-shielding frame for covering all the outer surfaces of the light-transmissive resin encapsulating portion except an outer surface thereof on a light-receiving surface side of the photodetector.

7. The optical sensor as set forth in claim 1, wherein the transmittance of the light-transmissive resin encapsulating portion in the visible-light region is substantially constant in the range of blue light (450 nm) to red light (650 nm).

11. The optical sensor as set forth in claim 1, wherein the photodetector is a Si phototransistor.

2. An optical sensor comprising:

a substrate having an electrode;

a photodetector electrically connected to the electrode; and

a light-transmissive resin encapsulating portion for encapsulating the photodetector on the substrate, the optical sensor characterized in that the light-transmissive resin encapsulating portion contains an infrared-absorbing substance.

5. The optical sensor as set forth in claim 2 wherein the infrared-absorbing substance is a phthalocyanine compound represented by the general formula (I):

wherein Zi (i=1-16) is SR₁, OR₂, NHR₃ or a halogen atom, wherein R₁, R₂ and R₃ are a phenyl group which may have substituent(s), an aralkyl group which may have substituent(s) or a C₁-C₂₀ alkyl group which may have substituent(s); and

M is a nonmetal, a metal, a metallic oxide or a metallic halide.

8. The optical sensor as set forth in claim 2, containing two or more different infrared-absorbing substances.

9. The optical sensor as set forth in claim 8, wherein the two or more different infrared-absorbing substances are phthalocyanine compounds having absorption peaks at different infrared wavelengths.

10. The optical sensor as set forth in claim 9, wherein the infrared-absorbing substances are phthalocyanine compounds having absorption peaks in the range of wavelengths of 750 nm to 1000 nm.

12. A process of producing an optical sensor, comprising the steps of:

electrically connecting a photodetector to an electrode provided on a substrate; and

forming a light-transmissive resin encapsulating portion on the substrate so that the photodetector is entirely encapsulated in the light-transmissive resin encapsulating portion, the process characterized in that the step of forming the light-transmissive resin encapsulating portion includes the step of forming an infrared-blocking layer either inside the light-transmissive resin encapsulating portion or on an outer surface of the light-transmissive resin encapsulating portion for blocking infrared radiation from the outside from reaching the photodetector.

14. The process of producing an optical sensor as set forth in claim 12, wherein the step of forming the infrared-blocking layer includes forming, on the outer surface of the light-transmissive resin encapsulating portion, either an infrared-absorbing layer containing an infrared-absorbing substance or an infrared-reflecting layer containing an infrared-reflecting substance.

15. The process of producing an optical sensor as set forth in claim 12, wherein the step of forming the resin encapsulating portion includes the steps of:

forming an inner resin portion for encapsulating the photodetector;

forming the infrared-blocking layer for covering an outer surface of the inner resin portion with either an infrared-absorbing layer containing an infrared-absorbing substance or an infrared-reflecting layer containing an infrared-reflecting substance; and

forming an outer resin portion for covering an outer surface of either the infrared-absorbing layer or the infrared-reflecting layer.

16. The process of producing an optical sensor as set forth in claim 12, further comprising the step of forming a light-shielding frame for covering all the outer surface of the light-transmissive resin encapsulating portion except an outer surface thereof on a light-receiving surface side of the photodetector, the step of forming the light-shielding frame being carried out before the step of forming the resin encapsulating portion.

17. The process of producing an optical sensor as set forth in claim 12, wherein the step of forming the resin encapsulating portion comprises:

holding the substrate, having a plurality of said photodetectors mounted thereon, between an upper mold and a lower mold, the upper mold having, in correspondence with the photodetectors, a plurality of recesses to be used for formation of the light-transmissive resin encapsulating portion;

pouring a light-transmissive resin into the recesses inside the mold; and

then curing the resin thereby to form the resin encapsulating portions.

13. A process of producing an optical sensor, comprising the steps of:

electrically connecting a photodetector to an electrode provided on a substrate; and

forming a light-transmissive resin encapsulating portion on the substrate so that the photodetector is entirely encapsulated in the light-transmissive resin encapsulating portion, the process characterized in that in the step of forming the light-transmissive resin encapsulating portion, the light-transmissive resin encapsulating portion is formed of a transparent resin containing an infrared-absorbing substance.

18. A light-transmissive resin composition both for an optical sensor filter and for encapsulating a photodetector of an optical sensor, the light-transmissive resin composition having an infrared radiation blockage function provided by addition of a plurality of phthalocyanine dyes as infrared-absorbing substances to a light-transmissive resin.