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System and method for high performance heat sink for multiple chip devices

  • US 20060060988A1
  • Filed: 09/30/2005
  • Published: 03/23/2006
  • Est. Priority Date: 12/31/2003
  • Status: Active Grant
First Claim
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1. A method for removing energy from a semiconductor device on a substrate, comprising:

  • forming a lid having at least one cavity, the at least one cavity operable to receive at least one die mounted on the substrate;

    depositing a conductive layer within the at least one cavity, the conductive layer comprising a material having a thermal conductivity greater than 10 W/m-°

    C., and operable to conform to the shape of the die; and

    mating the lid to the substrate, wherein the mating comprises an assembly by placing the at least one cavity over the at least one die, the at least one die substantially surrounded by the at least one cavity, and the conductive layer filling the space between at least a first face of the lid and a first face of the die.

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