System and method for high performance heat sink for multiple chip devices
First Claim
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1. A method for removing energy from a semiconductor device on a substrate, comprising:
- forming a lid having at least one cavity, the at least one cavity operable to receive at least one die mounted on the substrate;
depositing a conductive layer within the at least one cavity, the conductive layer comprising a material having a thermal conductivity greater than 10 W/m-°
C., and operable to conform to the shape of the die; and
mating the lid to the substrate, wherein the mating comprises an assembly by placing the at least one cavity over the at least one die, the at least one die substantially surrounded by the at least one cavity, and the conductive layer filling the space between at least a first face of the lid and a first face of the die.
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Abstract
A custom-molded heat sink corresponds to an individual substrate and includes a heat sink lid having at least one cavity corresponding to at least one die mounted on a substrate. A conductive layer is deposited in the at least one cavity that substantially fills the space between the at least one cavity and the at least one die when the lid is coupled to the substrate.
19 Citations
15 Claims
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1. A method for removing energy from a semiconductor device on a substrate, comprising:
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forming a lid having at least one cavity, the at least one cavity operable to receive at least one die mounted on the substrate;
depositing a conductive layer within the at least one cavity, the conductive layer comprising a material having a thermal conductivity greater than 10 W/m-°
C., and operable to conform to the shape of the die; and
mating the lid to the substrate, wherein the mating comprises an assembly by placing the at least one cavity over the at least one die, the at least one die substantially surrounded by the at least one cavity, and the conductive layer filling the space between at least a first face of the lid and a first face of the die. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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15-24. -24. (canceled)
Specification