Vaporizer

• US 20060065254A1
• Filed: 09/27/2005
• Published: 03/30/2006
• Est. Priority Date: 09/30/2004
• Status: Active Grant

• Current Assignee: Tokyo Electron Limited
• Original Assignee: Tokyo Electron Limited
• Inventors: Okabe, Tsuneyuki, Okura, Shigeyuki
• Granted Patent: US 7,452,424 B2
• Time in Patent Office: Days
• US Class Current: 123/557
• CPC Class Codes: C23C 16/4486 by producing an aerosol and subsequent evaporation of the droplets or particles
• CPC Class Codes: H01L 21/67017 Apparatus for fluid treatment H01L21/67126, H01L21/6715 take precedence
• CPC Class Codes: H01L 21/67109 mainly by convection

Abstract

A vaporizer for generating a process gas from a gas-liquid mixture fluid includes a container defining a process space of the vaporizer. A supply head having a plurality of spray holes to spray the fluid is disposed within the container. A heating passage is disposed below the spray holes within the container. The heating passage is configured to heat the fluid passing therethrough and thereby generate the process gas. A gas delivery passage is connected to the container to laterally deliver the process gas from below the heating passage. A mist receiver is provided at the container below the gas delivery passage.

Claims

1. A vaporizer for generating a process gas from a gas-liquid mixture fluid, the vaporizer comprising:

a container defining a process space of the vaporizer;

a supply head having a plurality of spray holes to spray the fluid within the container;

a heating passage disposed below the spray holes within the container, the heating passage being configured to heat the fluid passing therethrough and thereby generate the process gas;

a gas delivery passage connected to the container to laterally deliver the process gas from below the heating passage; and

a mist receiver provided at the container below the gas delivery passage.

2. The vaporizer according to claim 1, wherein the heating passage comprises a plurality of passage portions disposed in parallel with each other and respectively defined by heating walls.

3. The vaporizer according to claim 1, wherein the spray holes are oriented diagonally downward and outward in different directions.

4. The vaporizer according to claim 1, wherein the mist receiver is disposed at a bottom inside the container, to which a discharge pump is connected.

5. The vaporizer according to claim 1, further comprising a mechanism configured to apply ultrasonic vibration to the container.

6. A gas generating apparatus for generating a process gas from a liquid material, the apparatus comprising:

a pre-treatment unit configured to generate a gas-liquid mixture fluid from the liquid material; and

a vaporizer to which the fluid is supplied from the pre-treatment unit through a fluid supply passage,

wherein the vaporizer comprises

a container defining a process space of the vaporizer,

a supply head connected to the fluid supply passage and having a plurality of spray holes to spray the fluid within the container,

a heating passage disposed below the spray holes within the container, the heating passage being configured to heat the fluid passing therethrough and thereby generate the process gas,

a gas delivery passage connected to the container to laterally deliver the process gas from below the heating passage, and

a mist receiver provided at the container below the gas delivery passage.

7. The apparatus according to claim 6, further comprising a mechanism configured to apply ultrasonic vibration to the fluid supply passage.

8. The apparatus according to claim 6, wherein the pre-treatment unit is configured such that the liquid material is supplied into a low-pressure space to vaporize part of the liquid material by adiabatic expansion and thereby generate the fluid.

9. The apparatus according to claim 6, wherein the heating passage comprises a plurality of passage portions disposed in parallel with each other and respectively defined by heating walls.

10. The apparatus according to claim 6, wherein the spray holes are oriented diagonally downward and outward in different directions.

11. A semiconductor processing system comprising:

a process chamber configured to accommodate a target substrate;

a support member configured to support the target substrate inside the process chamber;

a heater configured to heat the target substrate inside the process chamber;

an exhaust system configured to exhaust gas inside the process chamber;

a gas supply system configured to supply a process gas into the process chamber, and including a gas generating apparatus for generating the process gas from a liquid material,

wherein the gas generating apparatus comprises

a pre-treatment unit configured to generate a gas-liquid mixture fluid from the liquid material, and

a vaporizer to which the fluid is supplied from the pre-treatment unit through a fluid supply passage,

wherein the vaporizer comprises

a container defining a process space of the vaporizer,

a supply head connected to the fluid supply passage and having a plurality of spray holes to spray the fluid within the container,

a heating passage disposed below the spray holes within the container, the heating passage being configured to heat the fluid passing therethrough and thereby generate the process gas,

a gas delivery passage connected to the container to laterally deliver the process gas from below the heating passage, and

a mist receiver provided at the container below the gas delivery passage.

12. The system according to claim 11, further comprising a mechanism configured to apply ultrasonic vibration to the fluid supply passage.

13. The system according to claim 11, wherein the pre-treatment unit is configured such that the liquid material is supplied into a low-pressure space to vaporize part of the liquid material by adiabatic expansion and thereby generate the fluid.

14. The system according to claim 11, wherein the heating passage comprises a plurality of passage portions disposed in parallel with each other and respectively defined by heating walls.

15. The system according to claim 11, wherein the spray holes are oriented diagonally downward and outward in different directions.

16. The system according to claim 11, wherein the mist receiver is disposed at a bottom inside the container, to which a discharge pump is connected.

17. The system according to claim 11, further comprising a mechanism configured to apply ultrasonic vibration to the container.

18. The system according to claim 11, further comprising a storage vessel for storing the liquid material, connected to the pre-treatment unit through a liquid material supply passage, and

a gas supply unit configured to supply a pressurized gas to the storage vessel, so as to send the liquid material by pressure from the storage vessel to the pre-treatment unit through the liquid material supply passage.

19. The system according to claim 13, further comprising a gas supply unit configured to supply a carrier gas to the pre-treatment unit, wherein the fluid is supplied along with the carrier gas from the pre-treatment unit to the fluid vaporizer.

20. The system according to claim 11, wherein the gas supply system is configured to supply, as the process gas, a gas for forming a thin film on the target substrate by CVD.