Method and structures for testing a semiconductor wafer prior to performing a flip chip bumping process

  • US 20060066327A1
  • Filed: 09/29/2004
  • Published: 03/30/2006
  • Est. Priority Date: 09/29/2004
  • Status: Active Grant
First Claim
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1. An interface assembly for a semiconductor wafer, said interface assembly comprising:

  • a flip chip bonding pad including a region for performing a bumping process; and

    a test pad integrally constructed with said bonding pad, said test pad being coplanar relative to said flip chip bonding pad and including a probe region for performing wafer-level testing prior to performing said bumping process.

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