Capacitive micromachined ultrasonic transducer array with through-substrate electrical connection and method of fabricating same

  • US 20060075818A1
  • Filed: 06/04/2005
  • Published: 04/13/2006
  • Est. Priority Date: 06/04/2004
  • Status: Active Grant
First Claim
Patent Images

1. A transducer array comprising a conductive substrate having a front side and a backside, a plurality of transducer elements provided on the front side of the substrate, a plurality of electrodes provided on the backside of the substrate and electrically isolated from each other, the plurality of electrodes for addressing through the substrate the respective plurality of transducer elements.

View all claims

    Thank you for your feedback