System and method for protecting microelectromechanical systems array using structurally reinforced back-plate

• US 20060076648A1
• Filed: 03/25/2005
• Published: 04/13/2006
• Est. Priority Date: 09/27/2004
• Status: Active Grant

• Current Assignee: Snaptrack Incorporated (Qualcomm, Inc.)
• Original Assignee: Brian Gally, Lauren Palmateer, William J. Cummings
• Inventors: Palmateer, Lauren, Cummings, William J., Gally, Brian
• Granted Patent: US 7,405,924 B2
• Time in Patent Office: Days
• US Class Current: 257/619
• CPC Class Codes: B81B 3/007 For controlling stiffness, e.g. ribs
• CPC Class Codes: B81B 7/0058 for protecting against damages due to external chemical or mechanical influences, e.g. shocks or vibrations
• CPC Class Codes: B81C 2203/0163 Reinforcing a cap, e.g. with ribs
• CPC Class Codes: G02B 26/001 based on interference in an adjustable optical cavity interference filters G02B5/28; devices or arrangements using multiple reflections in spectrometry or monochromators G01J3/26

Abstract

Disclosed is an electronic device utilizing interferometric modulation and a package of the device. The packaged device includes a substrate, an interferometric modulation display array formed on the substrate, and a back-plate. The back-plate is placed over the display array with a gap between the back-plate and the display array. The device further includes reinforcing structures which are integrated with the back-plate. The reinforcing structures add stiffness to the back-plate. The back-plate may have a thickness varying along an edge thereof.

Claims

1. An electronic device, comprising:

a substrate;

an array of microelectromechanical devices formed on the substrate, the array having a back-surface facing away from the substrate;

a back-plate placed over the array and having an interior surface and an exterior surface, the interior surface facing the back-surface of the array with a gap therebetween, the exterior surface facing away from the substrate; and

one or more reinforcing structures integrated with the back-plate.

2. The electronic device of claim 1, wherein the reinforcing structures increases stiffness of the back-plate.

3. The electronic device of claim 1, wherein a distance between the interior surface and the substrate changes over the interior surface.

4. The electronic device of claim 3, wherein the interior surface comprises a central area and a peripheral area, and wherein the distance is generally greater in the central area than in the peripheral area.

5. The electronic device of claim 1, wherein the back-plate has a varying thickness.

6. The electronic device of claim 1, wherein the back-plate is bowed away from the array.

7. The electronic device of claim 1, wherein the one or more reinforcing structures are formed on at least one of the interior surface and the exterior surface of the back-plate.

8. The electronic device of claim 1, wherein the interior surface comprises a central area and a peripheral area, and wherein the one or more reinforcing structures are formed more densely in the central area than the peripheral area.

9. The electronic device of claim 1, wherein the one or more reinforcing structures comprise at least one interconnecting structure interconnecting two or more reinforcing structures.

10. The electronic device of claim 9, wherein the at least one interconnecting structure further adds stiffness to the back-plate.

11. The electronic device of claim 1, further comprising one or more spacers provided in the gap, wherein the one or more members prevent the back-plate from directly contacting the back-surface of the array.

12. The electronic device of claim 11, wherein the one or more spacers are formed on the interior surface or on the back-surface of the array.

13. The electronic device of claim 1, further comprises a seal sandwiched between the substrate and the back-plate along edges of the interior surface.

14. The electronic device of claim 1, wherein the back-plate comprises a protrusion extending toward the substrate along an edge of the back-plate.

15. The electronic device of claim 1, wherein the back-plate comprises a periphery along edges thereof, and wherein the periphery of the back-plate is directly formed on the substrate.

16. The electronic device of claim 1, wherein the array comprises a display array.

17. The electronic device of claim 1, wherein the one or more reinforcing structures are made of a material comprising the back-plate.

18. The electronic device of claim 1, wherein the one or more reinforcing structures are made of a material comprising a desiccant.

19. An electronic device, comprising:

a substrate;

a microelectromechanical array formed on the substrate, the array having a back-surface facing away from the substrate;

a back-plate placed over the array and having an interior surface, which faces the back-surface of the array with a gap therebetween, wherein the back-plate has a thickness varying along an edge thereof.

20. The electronic device of claim 19, wherein the interior surface comprises a central area and a peripheral area, and wherein the thickness of the back-plate is greater in the central area than in the peripheral area.

21. The electronic device of claim 19, further comprising one or more reinforcing structures formed on the back-plate.

22. The electronic device of claim 21, wherein the interior surface comprises a central area, and wherein the one or more reinforcing structures are formed primarily in the central area.

23. The electronic device of claim 19, wherein a distance between-the back-plate and the substrate changes over the interior surface.

24. The electronic device of claim 23, wherein the interior surface comprises a central area and a peripheral area, and wherein the distance is greater in the central area than in the peripheral area.

25. An electronic device, comprising:

a substrate;

an array of interferometric modulators formed on the substrate, the array having a back-surface facing away from the substrate;

a back-plate placed over the array and having an interior surface facing the back-surface of the array with a gap between the interior surface and the back-surface of the array; and

means for preventing the interior surface from directly contacting the back-surface of the array.

26. The electronic device of claim 25, wherein the preventing means comprises means for adding stiffness of the back-plate.

27. The electronic device of claim 25, wherein the preventing means comprises stops placed in the gap.

28. The electronic device of claim 25, wherein the preventing means comprises varying thickness of the back-plate.

29. The electronic device of claim 25, wherein the preventing means comprises a reinforcing structure formed on the back-plate.

30. A method of making an electronic device, comprising:

providing an intermediate device comprising a substrate and an array of microelectromechanical devices formed on the substrate; and

forming a back-plate over the array of the intermediate device with a gap between the back-plate and the array, the back-plate having an interior surface and an exterior surface, the interior surface facing the array, the back-plate being integrated with one or more reinforcing structures formed on at least one of the interior surface and the exterior surface.

31. The method of claim 30, wherein forming the back-plate further comprises:

placing the back-plate over the array of the intermediate device; and

binding the back-plate with the substrate along a periphery of the back-plate.

32. The method of claim 30, wherein forming the back-plate further comprises:

forming a sacrificial layer over the array of the intermediate device;

selectively etching the sacrificial layer so as to form one or more recesses;

thereafter depositing a back-plate layer over the sacrificial layer; and

removing the sacrificial layer so as to form a gap between the array and the back-plate layer.

33. The method of claim 32, further comprising filling the one or more recesses with a material prior to depositing the back-plate layer.

34. An electronic device produced by a method comprising:

providing an intermediate device comprising a substrate and an array of microelectromechanical devices formed on the substrate; and

forming a back-plate over the array of the intermediate device with a gap between the back-plate and the array, the back-plate having an interior surface and an exterior surface, the interior surface facing the array, the back-plate being integrated with one or more reinforcing structures formed on at least one of the interior surface and the exterior surface.

35. The electronic device of claim 34, wherein a distance between the back-plate and the substrate changes over the interior surface.

36. The electronic device of claim 34, wherein the interior surface comprises a central area and a peripheral area, and wherein the distance is greater in the central area than in the peripheral area.