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Method and system for sealing a substrate

  • US 20060079098A1
  • Filed: 03/16/2005
  • Published: 04/13/2006
  • Est. Priority Date: 09/27/2004
  • Status: Active Grant
First Claim
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1. A method of sealing a microelectromechanical system (MEMS) device from ambient conditions, comprising:

  • forming a substantially metal seal on a substrate comprising a MEMS device; and

    attaching a backplane to said metal seal so as to seal said MEMS device from ambient conditions.

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