Wafer packaging and singulation method

• US 20060088981A1
• Filed: 12/14/2004
• Published: 04/27/2006
• Est. Priority Date: 10/27/2004
• Status: Active Grant

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Hewlett-Packard Development Company, L.P. (HP Inc.)
• Inventors: Chen, Chien-Hua, Geissler, Steven R.
• Granted Patent: US 7,682,934 B2
• Time in Patent Office: Days
• US Class Current: 438/460
• CPC Class Codes: B81C 1/00888 Multistep processes involving only mechanical separation, e.g. grooving followed by cleaving
• CPC Class Codes: H01L 21/78 with subsequent division of the substrate into plural individual devices cutting to change the surface-physical characteristics or shape of semiconductor bodies H01L21/304
• CPC Class Codes: H01L 23/10 characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A method includes providing a micro device wafer having micro devices supported by a wafer substrate and a multi-device lid substrate coupled to and spaced from the wafer substrate. The method further includes sawing through the multi-device lid substrate to a depth between the wafer substrate and the lid substrate.

Claims

1. A method comprising:

providing a micro device wafer having micro devices supported by a wafer substrate and a multi-device lid substrate coupled to and spaced from the wafer substrate; and

sawing through the multi-device lid substrate to a depth between the wafer substrate and the lid substrate.

2. The method of claim 1, wherein each micro device includes a main portion and a contact point projecting from the main portion, wherein the sawing forms an opening adjacent to at least one contact point of at least one device.

3. The device of claim 2, wherein the opening is adjacent a first contact point of a first micro device and a second contact point of a consecutive second micro device.

4. The method of claim 3, wherein each micro device has a plurality of contact points projecting from the main portion and wherein the opening is adjacent the plurality of contact points.

5. The method of claim 1, wherein each micro device has a main portion, a first contact point on a first side of the main portion and a second contact point on a second side of the main portion and wherein the saw is configured to form openings adjacent the first contact point and the second contact point.

6. The method of claim 1, wherein the sawing forms openings extending opposite a passageway portion of the micro device wafer and wherein the micro device wafer is separated into dies along separation lines

7. The method of claim 1, wherein the multi-lid substrate includes a glass material.

8. The method of claim 1 including forming a spacer between the wafer and the lid substrate.

9. The method of claim 8, wherein the formed spacer spaces the wafer substrate from the lid substrate by at least 10 micrometers.

10. The method of claim 8, wherein the formed spacer spaces the wafer substrate from the lid substrate by at least about 30 micrometers.

11. The method of claim 8, wherein each micro device includes a main portion and a contact point projecting from the main portion and wherein the formed spacer comprises a seal between a lid substrate and the wafer substrate and about each main portion between each main portion and each contact point.

12. The method of claim 11, wherein the seal comprises a bond ring.

13. The method of claim 12 including coupling the bond ring to the lid substrate prior to coupling the lid substrate to the wafer substrate.

14. The method of claim 12 including coupling the bond ring to the wafer substrate prior to coupling the lid substrate to the wafer substrate.

15. The method of claim 1, wherein at least one of the micro devices includes a micro-machine.

16. The method of claim 15, wherein at least one of the micro devices includes at least one display micro-machine.

17. The method of claim 1, wherein the lid substrate is at least semi-transparent.

18. The method of claim 1, wherein the lid substrate is formed from a non-silicon material.

19. The method of claim 1 including separating the micro device wafer into dies.

20. The method of claim 1, wherein the micro device includes a main portion and at least one contact point projecting from the main portion and wherein that further includes providing a protective material between at least one of the contact points and the lid substrate.

21. The method of claim 20 including coating the lid substrate opposite the contact points of the protective material.

22. The method of claim 20 including applying the protective material over the contact points.

23. The method of claim 22 including removing the protective material and the contact points.

24. The method of claim 1, wherein each micro device includes a main portion and a contact point projecting from the main portion and wherein the method further includes forming a spacer between the wafer substrate and the lid substrate, wherein the spacer includes a portion extending between the contact points and the lid substrate.

25. The method of claim 24 including removing the portion.

26. The method of claim 1, wherein the saw used for sawing the lid substrate has a maximum position variance and wherein the lid substrate is spaced from the wafer substrate by a distance greater than the maximum position variance.

27. A method comprising:

providing a micro device wafer having micro devices supported by a wafer substrate, each micro device having a main portion and a contact point projecting from the main portion;

coupling a multi-lid substrate to a wafer substrate such that the lid substrate is supported and spaced above the contact point of each device; and

sawing through the lid substrate to a depth between the wafer substrate and the lid substrate so as to expose the contact point of each micro device.

28. The method of claim 27, wherein the saw used for sawing the lid substrate has a maximum position variance and wherein the lid substrate is spaced from the wafer substrate by a distance greater than the maximum position variance.

29. An apparatus comprising:

a micro device wafer;

a multi-device lid; and

a bond ring moving between the wafer and the lid, wherein the bond ring has height of at least 10 micrometers.

30. The apparatus of claim 29, wherein the bond ring has a height of at least about 30 micrometers.

31. An apparatus comprising:

a micro device wafer;

a multi-device lid; and

spacing the lid from the wafer by a distance greater than the maximum position variance of the saw during sawing of the lid without sawing the wafer.