Producing method of solid state pickup device, and attaching method and device for the same

• US 20060107518A1
• Filed: 01/11/2006
• Published: 05/25/2006
• Est. Priority Date: 04/24/2002
• Status: Active Grant

• Current Assignee: Fujifilm Corporation (Fujifilm Holdings Corporation)
• Original Assignee: Fujifilm Corporation (Fujifilm Holdings Corporation)
• Inventors: Misawa, Atsushi, Misawa, Takeshi, Yamazaki, Akihisa
• Granted Patent: US 7,676,901 B2
• Time in Patent Office: Days
• US Class Current: 29/592.100
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 27/14625 Optical elements or arrangements associated with the device
• CPC Class Codes: H01L 27/14685 Process for coatings or optical elements
• CPC Class Codes: H01L 27/14687 Wafer level processing
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 31/0203 Containers; Encapsulations , e.g. encapsulation of photodiodesfor photovoltaic devices H01L31/048; for organic photosensitive devices H10K30/80
• CPC Class Codes: H01L 31/0232 Optical elements or arrangements associated with the device H01L31/0236 takes precedence; for photovoltaic cells H01L31/054; for photovoltaic modules H02S40/20
• CPC Class Codes: H04N 23/54 Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
• CPC Class Codes: H04N 23/57 Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
• CPC Class Codes: Y10T 29/49002 Electrical device making
• CPC Class Codes: Y10T 29/49007 Indicating transducer
• CPC Class Codes: Y10T 29/4908 Acoustic transducer
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49798 Dividing sequentially from leading end, e.g., by cutting or breaking
• CPC Class Codes: Y10T 29/49826 Assembling or joining
• CPC Class Codes: Y10T 29/49904 Assembling a subassembly, then assembling with a second subassembly
• CPC Class Codes: Y10T 29/5313 Means to assemble electrical device
• CPC Class Codes: Y10T 29/53174 Means to fasten electrical component to wiring board, base, or substrate
• CPC Class Codes: Y10T 29/53265 with work-holder for assembly

Abstract

A producing method of producing a solid state pickup device is provided. Imaging elements are formed on a wafer in a matrix form. Each of the imaging elements has a light receiving surface and plural contact points. Receiving surface border portions are formed on a glass plate to protrude therefrom in a matrix form by etching. The receiving surface border portions are attached to the wafer to surround the light receiving surface in each of the receiving surface border portions. The light receiving surface is spaced from the glass plate. The glass plate is diced outside respectively the receiving surface border portions, to form shield glass for covering the light receiving surface. The wafer is diced for each of the imaging elements, to obtain the solid state pickup device having the shield glass and one of the imaging elements.

Claims

1. An attaching method of attaching a solid state pickup device to an electronic camera including a lens barrel, and a condenser lens supported in said lens barrel, said attaching method comprising steps of:

placing said solid state pickup device in a receiving recess formed in a rear portion of said lens barrel, said receiving recess having a size larger than said solid state pickup device; and

pressing said solid state pickup device in an optical axis direction of said condenser lens and a crosswise direction crosswise to said optical axis direction, for fitting and positioning a front face and a partial end face of said solid state pickup device into said receiving recess.

2. An attaching method as defined in claim 1, wherein said solid state pickup device includes an imaging element and a box-shaped shield glass, said imaging element has a light receiving surface and plural contact points, said shield glass has a plate portion and a receiving surface border portion, said plate portion is disposed over said light receiving surface, and said receiving surface border portion has substantially a quadrilateral shape, and attached to said imaging element to surround said light receiving surface.

3. An attaching method as defined in claim 2, wherein said imaging element is pushed by a biasing force in said crosswise direction, and pressed against an inside of said receiving recess.

4. An attaching method as defined in claim 3, wherein said imaging element has substantially a quadrilateral shape, and said crosswise direction comprises two directions defined along two adjacent side lines of said imaging element.

5. An attaching method as defined in claim 3, wherein said imaging element has substantially a quadrilateral shape, and said crosswise direction is defined along a diagonal line of said imaging element.

6. An attaching method of attaching a solid state pickup device to an electronic camera including a lens barrel, and a condenser lens supported in said lens barrel, said solid state pickup device having a wiring pattern disposed on an outside thereof, said attaching method comprising steps of:

placing said solid state pickup device in a receiving recess formed in a rear portion of said lens barrel, said receiving recess having a size larger than said solid state pickup device; and

pressing said solid state pickup device in an optical axis direction of said condenser lens and a crosswise direction crosswise to said optical axis direction, for tightly fitting a front face and a partial end face of said solid state pickup device into said receiving recess, to position said solid state pickup device on said lens barrel, wherein said front face and said partial end face lacks said wiring pattern.

7. An attaching method as defined in claim 6, wherein said solid state pickup device includes:

an imaging element having a light receiving surface directed to a front;

a shield glass layer attached to said imaging element to cover said light receiving surface; and

a reinforcing glass layer attached to said imaging element on a side opposite to said light receiving surface.

8. An attaching method as defined in claim 7, wherein said solid state pickup device has substantially a quadrilateral shape, and includes a first end face for being fitted in said receiving recess, a second end face disposed opposite to said first end face, first and second lateral faces directed opposite to each other, and a rear face directed opposite to said front face;

said wiring pattern extends from at least one of said first and second lateral faces toward said rear face.

9. An attaching method as defined in claim 8, wherein said solid state pickup device is pressed in said crosswise direction by a clamper or pressure pad.

10. An attaching method as defined in claim 9, wherein said clamper includes first and second clamp jaws, biased toward each other, for clamping said solid state pickup device therebetween, to position said solid state pickup device in said optical axis direction.

11. An attaching method as defined in claim 10, wherein said clamper clamps said second end face, or clamps a corner between said second end face and said second lateral face, and presses said first end face against said receiving recess, or presses a corner between said first end face and said first lateral face against said receiving recess.

12. An attaching method as defined in claim 9, wherein said pressure pad has an inclined face directed toward a front with an inclination;

said second end face is directed toward a rear with an inclination, pressed by said inclined face, to position said solid state pickup device in said optical axis direction.

13. An attaching method of attaching a solid state pickup device to a taking lens barrel, comprising steps of:

forming plural light receiving surfaces on a wafer, each of said light receiving surfaces being adapted to convert incident light of an image to an electric signal;

forming first and second grooves in a shield glass plate substantially in parallel with each other;

attaching said shield glass plate to said wafer by opposing said first and second grooves to positions offset from said light receiving surface, wherein ends of said first and second grooves appear externally;

attaching a reinforcing glass plate to said wafer on a side opposite to said shield glass plate;

dicing said wafer, said shield glass plate and said reinforcing glass plate together for each of said light receiving surfaces, to obtain said solid state pickup device;

inserting first and second projections into end openings of said first and second grooves, said first and second projections projecting from a first auxiliary panel, whereby said first auxiliary panel is connected with said solid state pickup device;

inserting third and fourth projections into end openings of said first and second grooves, said third and fourth projections projecting from a second auxiliary panel, whereby said second auxiliary panel is connected with said solid state pickup device; and

attaching said first and second auxiliary panels to a rear of said lens barrel.