Methods and systems for providing MEMS devices with a top cap and upper sense plate
First Claim
1. A method for fabricating a micro-electromechanical systems (MEMS) device having a top cap and an upper sense plate, said method comprising:
- producing a device wafer including an etched substrate, etched silicon, and interconnect metal, a portion of the interconnect metal being bond pads;
adding a metal wraparound layer to a back side, edges, and a portion of a front side of the device wafer;
producing an upper wafer including an etched substrate and interconnect metal;
bonding the device wafer and the upper wafer; and
dicing the bonded upper wafer and device wafer into individual MEMS devices.
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Abstract
A method for fabricating a MEMS device having a top cap and an upper sense plate is described. The method includes producing a device wafer including an etched substrate, etched MEMS device components, and interconnect metal, a portion of the interconnect metal being bond pads and adding a metal wraparound layer to a back side, edges, and a portion of a front side of the device wafer. The method also includes producing an upper wafer including an etched substrate and interconnect metal, bonding the device wafer and the upper wafer, and dicing the bonded upper wafer and device wafer into individual MEMS devices.
44 Citations
30 Claims
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1. A method for fabricating a micro-electromechanical systems (MEMS) device having a top cap and an upper sense plate, said method comprising:
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producing a device wafer including an etched substrate, etched silicon, and interconnect metal, a portion of the interconnect metal being bond pads;
adding a metal wraparound layer to a back side, edges, and a portion of a front side of the device wafer;
producing an upper wafer including an etched substrate and interconnect metal;
bonding the device wafer and the upper wafer; and
dicing the bonded upper wafer and device wafer into individual MEMS devices. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A top cap for a micro-electromechanical systems (MEMS) device comprising:
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a substrate comprising a surface and recesses formed in said surface;
interconnecting metal deposited into and extending out of said recesses and onto said surface;
at least one recess formed in said surface of said substrate, and positioned to be above a bond pad of a device wafer onto which said top cap is to be bonded. - View Dependent Claims (13)
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14-27. -27. (canceled)
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28. A method for preventing electrical shorts in a MEMS device including at least one electrical interconnection passing under a support ring, the electrical interconnection being in a recessed trench and a material filling the trench onto which the support ring is mounted, said method comprising forming a protective shield near the support ring, the shield substantially preventing incidents of particles shorting the support ring to the electrical interconnection.
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29. A method for fabricating a top cap and an upper sense plate for a micro-electromechanical systems (MEMS) device, the top cap to be bonded to a device wafer, the device wafer including bond pads, said method comprising:
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adding recesses to the top cap at positions above the bond pads after the bonding of the device wafer and the top cap; and
cutting into the top cap at the recesses. - View Dependent Claims (30)
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Specification