Methods and apparatuses relating to findable balls

• US 20060122007A1
• Filed: 10/11/2005
• Published: 06/08/2006
• Est. Priority Date: 09/26/2003
• Status: Active Grant

• Current Assignee: Topgolf International Inc. (Topgolf Callaway Brands Corp.)
• Original Assignee: Radar Corporation
• Inventors: Savarese, Chris, McGill, Susan, Ng, Harold W., Marshall, Noel H.C., Cadomiga, Lauro C.
• Granted Patent: US 7,766,766 B2
• Time in Patent Office: Days
• US Class Current: 473/351
• CPC Class Codes: A63B 2024/0053 for locating an object, e.g. a lost ball
• CPC Class Codes: A63B 2225/50 Wireless data transmission, e.g. by radio transmitters or telemetry
• CPC Class Codes: A63B 24/0021 Tracking a path or terminating locations
• CPC Class Codes: A63B 37/0003 Golf balls
• CPC Class Codes: A63B 37/0055 with non-spherical insert(s)
• CPC Class Codes: A63B 37/0088 Frequency
• CPC Class Codes: A63B 43/00 Balls with special arrangements
• CPC Class Codes: A63B 45/00 Apparatus or methods for manufacturing balls working of plastics or substances in a plastic state B29
• CPC Class Codes: G01S 13/04 Systems determining presence of a target based on relative movement of target G01S13/56
• CPC Class Codes: G01S 13/75 using transponders powered from received waves, e.g. using passive transponders , or using passive reflectors
• CPC Class Codes: G06K 19/07758 arrangements for adhering the record carrier to further objects or living beings, functioning as an identification tag
• CPC Class Codes: H01L 2924/15153 the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2924/15165 Monolayer substrate
• CPC Class Codes: H01Q 1/2225 used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
• CPC Class Codes: H01Q 1/40 Radiating elements coated with or embedded in protective material
• CPC Class Codes: Y10T 29/49004 including measuring or testing of device or component part
• CPC Class Codes: Y10T 29/49018 with other electrical component

Abstract

Golf balls and methods and systems for manufacturing golf balls. In one exemplary embodiment, a portion of a golf ball comprises a core material having a void, a semiconductor component disposed at least partially in the void, and a filler material in the void and surrounding the semiconductor component, the filler material being placed in the void in a liquid state and occupying a first volume in the liquid state and the filler material transforming into a solid state which occupies substantially the first volume. Methods for manufacturing golf balls and fixtures and apparatuses for manufacturing golf balls are also described.

Claims

1. A portion of a golf ball, the portion comprising:

a core material having a void;

a semiconductor component disposed at least partially in the void;

a filler material in the void and surrounding the semiconductor component, the filler material being placed in the void in a liquid state and occupying a first volume in the liquid state and the filler material transforming into a solid state which occupies substantially the first volume.

2. A portion of a golf ball as in claim 1 wherein a difference in volume between the liquid state and the solid state is less than about 0.2% of the liquid state.

3. A portion as in claim 1 wherein the filler material cures without evaporating a solvent.

4. A portion as in claim 1 wherein the filler material cures by a chemical reaction between components in the filler material, and wherein the filler material and the semiconductor component occupy substantially all space in the void, and wherein the filler material changes from the liquid state to the solid state without any significant shrinkage or expansion.

5. A portion as in claim 1 further comprising:

a shell material which encapsulates the core material and wherein the void is on an outer surface of the core material.

6. A portion as in claim 1 further comprising:

at least one elastic conductive antenna attached to the core material and coupled to the semiconductor component, and wherein the semiconductor component is one of a diode or transistor or a Radio Frequency Identification integrated circuit which stores an identification value.

7. A method of forming a portion of a golf ball, the method comprising:

applying a material into a void of a core of a golf ball, the material occupying a first volume when it is applied;

curing the material, the material occupying substantially the first volume after the curing.

8. A method as in claim 7 further comprising:

depositing a semiconductor component at least partially into the void, the semiconductor component being surrounded on its sides and bottom by the material as the material is curing.

9. A method as in claim 8 further comprising:

removing any excess of the material with a solvent, wherein the solvent does not effect an elastic conductive antenna.

10. A method as in claim 9 further comprising:

coupling the semiconductor component to the elastic conductive antenna.

11. A method as in claim 10 further comprising:

forming a shell material around the core, and wherein the curing is about 70°

F.

12. A method as in claim 8 wherein the material and the semiconductor component occupy substantially all space in the void.

13. A method as in claim 10 further comprising:

printing the elastic conductive antenna on the core.

14. A method of forming a golf ball, the method comprising:

forming, on a portion of a golf ball, a first segment of a first antenna, the first segment having a first pattern;

forming, on the portion of the golf ball, a second segment of the first antenna after forming the first segment, the second segment having a second pattern.

15. A method as in claim 14, wherein the portion is a core of the golf ball and wherein the first pattern is different than the second pattern and wherein the forming of both the first and the second segments comprises a printing.

16. A method as in claim 15 wherein the first segment is printed at least twice and the second segment is printed at least twice.

17. A method as in claim 15 wherein the core is moved in a fixture after forming the first segment and before forming the second segment.

18. A method as in claim 15 further comprising:

forming, on a portion of another golf ball and while concurrently forming the first segment, a segment of another antenna, the segment of the another antenna having the second pattern.

19. An apparatus for forming a portion of a golf ball, the apparatus comprising:

a dispenser to hold antenna material for at least one of a first segment of an antenna and a second segment of the antenna;

a fixture coupled to the dispenser, the fixture to hold a portion of a golf ball to receive separately the first segment and the second segment.

20. An apparatus as in claim 19 wherein the dispenser comprises a first dispenser to hold antenna material in a first pattern and a second dispenser to hold antenna material in a second pattern, and wherein the apparatus further comprises:

a first transfer medium coupled to a first station, the first transfer medium to transfer antenna material from the first dispenser to the portion of the golf ball; and

a second transfer medium coupled to a second station, the second transfer medium to transfer antenna material from the second dispenser to the portion of the golf ball; and

wherein the portion is a core of the golf ball.

21. An apparatus as in claim 20, wherein the first transfer medium is a first pad which prints the first segment and the second transfer medium is a second pad which prints the second segment and wherein the antenna material is an elastic conductive material which is cured at a temperature of less than about 200°

C.

22. An apparatus as in claim 20 further comprising:

a further fixture coupled to the dispenser, the further fixture to hold a portion of another golf ball to receive separately the first segment and the second segment, and wherein the fixture moves relative to the first station and the second station and the further fixture moves relative to the first station and the second station.

23. A method of manufacturing golf balls, the method comprising:

moving a first core of a golf ball, held by a first fixture, into a first station;

moving a second core of a golf ball, held by a second fixture, into a second station;

applying a first antenna material in a first pattern onto a first transfer medium and transferring the first antenna material in the first pattern onto the first core;

applying second antenna material in a second pattern onto a second transfer medium and transferring the second antenna material in the second pattern onto the second core, the second core having already received some antenna material in the first pattern;

moving the second core out of the second station and then moving the first core into the second station;

applying third antenna material in the second pattern onto the second transfer medium and transferring the third antenna material onto the first core while the first core is in the second station.

24. A method as in claim 23 wherein the moving of the second core out of the second station and the moving of the first core into the second station occur substantially concurrently along a predetermined path and wherein at least one of the first core and the second transfer medium are rotated relative to each other in connection with the moving of the first core into the second station.

25. A method as in claim 24 wherein the applying of the first antenna material in the first pattern and the applying of the second antenna material in the second pattern occur substantially concurrently and wherein antenna material in the first pattern is transferred multiple times to the first core and wherein antenna material in the second pattern is transferred multiple times to the second core.

26. A method as in claim 25 wherein each of the first, second and third antenna materials is an elastic conductive material which is applied by pad printing.

27. A method as in claim 23 further comprising:

curing the first, second and third antenna materials with at least one of a temperature of less than about 200°

C. or with electromagnetic radiation;

applying a second antenna, in separate segments, on the first core;

applying a first filler material into a first void on a surface of the first core and depositing a first semiconductor component at least partially into the first void;

applying a second filler material into a second void on a surface of the first core and depositing a second semiconductor component at least partially into the second void.

28. A method as in claim 23 further comprising:

aligning a void on a surface of the first core with a registration feature on the first fixture.

29. A method of fabricating a golf ball, the method comprising:

depositing a filler material into a void on a surface of a core of a golf ball;

depositing a semiconductor component at least partially into the void;

removing any excess filler material from the surface of the core.

30. A method as in claim 29 wherein the removing comprises wiping the surface with a lint-free cleaning material and a solvent of the filler material.

31. A method as in claim 30 wherein the solvent does not significantly dissolve any antenna on the surface of the core.

32. A method as in claim 31 wherein the antenna is pad printed on the core before depositing the filler material and wherein the antenna comprises a conductive elastic material.

33. A method as in claim 30 wherein the filler material is cured at a temperature of less than about 90°

F.

34. A method of fabricating a golf ball, the method comprising:

depositing a filler material into a void on a surface of a core of a golf ball;

depositing a semiconductor component at least partially into the void;

curing the filler material at a temperature of less than about 90°

F.

35. A method as in claim 34 wherein the curing is at a temperature of about 65°

F. to 75°

F. and a relative humidity of about 30% to 60% and for a period of time less than about 120 minutes.

36. A method as in claim 34 further comprising:

depositing the filler material into an additional void on the surface of the core;

depositing an additional semiconductor component at least partially into the additional void;

removing any excess filler material from the surface of the core, wherein the void and the additional void form an angle of about 180°

.

37. A method of fabricating a golf ball, the method comprising:

applying an antenna to a core of a golf ball;

coupling a semiconductor component to the antenna;

coating the core after the semiconductor component has been coupled to the antenna with a first material which is compatible with a shell material;

applying the shell material to enclose the core and the semiconductor component and the antenna within the shell material.

38. A method of fabricating a golf ball as in claim 37, wherein the applying of the shell material comprises injection molding the shell material and wherein the first material is the shell material and wherein a connection between the semiconductor component and the antenna is cured before coating the core.

39. A method of fabricating a golf ball as in claim 37, the method further comprising:

applying an additional antenna to the core;

coupling an additional semiconductor component to the additional antenna wherein the shell material also encloses the additional antenna and the additional semiconductor component; and

wherein the semiconductor component is at least partially disposed in a first void with a first filler material and the additional semiconductor component is at least partially disposed in a second void with a second filler material and wherein the first filler material and the semiconductor component occupy substantially all space in the first void and the second filler material and the additional semiconductor component occupy substantially all space in the second void.

40. A method of fabricating a golf ball, the method comprising:

applying an antenna to a core of a golf ball;

coupling a semiconductor component to the antenna;

testing the antenna and the semiconductor component for a radio frequency response;

applying a material to enclose the core and the semiconductor component and the antenna within the material if the radio frequency (RF) response is acceptable.

41. A method as in claim 40 wherein the applying of the material comprises injection molding the material and wherein the antenna and the semiconductor component are tested again for an RF response after applying the material.

42. A method as in claim 40, the method further comprising:

applying an additional antenna to the core;

coupling an additional semiconductor component to the additional antenna wherein the material also encloses the additional antenna and the additional semiconductor component;

and wherein the semiconductor component is at least partially disposed in a first void with a first filler material and the additional semiconductor component is at least partially disposed in a second void with a second filler material and wherein the first filler material and the semiconductor component occupy substantially all space in the first void and the second filler material and the additional semiconductor component occupy substantially all space in the second void.

43. A method of fabricating a golf ball, the method comprising:

placing a core of a golf ball into a fixture;

aligning a feature on the core relative to a registration position of the fixture, the feature having a predetermined position relative to a void on the core.

44. A method as in claim 43 further comprising:

depositing a semiconductor component at least partially in the void;

applying an antenna on a surface of the core and coupling the antenna to the semiconductor component and wherein the aligning is optically performed.

45. A mold for making a golf ball, the mold comprising:

a body which is used to form at least a portion of a golf ball, the body having a surface which has a shape and size to form the portion in a desired shape and size, the body having at least one opening on the surface and the body defining a cavity;

a protrusion which retractably extends beyond the opening into the cavity to form a void in a ball material, the void being designed to receive at least a portion of an electrical component of a tag.

46. A mold as in claim 45 wherein the protrusion slides through the opening into the cavity and the protrusion comprises a plunger which is pushed through the opening and wherein the cavity'"'"'s shape and size forms the portion of the golf ball.

47. A mold as in claim 46 wherein the protrusion extends into the cavity when the ball material is being molded within the cavity and the protrusion is retracted, through the opening, such that the protrusion does not extend into the cavity, after the ball material has been molded.

48. A mold as in claim 47, the mold further comprising:

an additional protrusion which retractably extends beyond an additional opening into the cavity to form an additional void in the ball material.

49. A mold for making a golf ball, the mold comprising:

a body which is used to form at least a portion of a golf ball, the body having a surface which has a shape and size to form the portion in a desired shape and size;

a feature on the surface, the feature to make a void in a ball material, the void being designed to receive at least a portion of an electrical component of a tag, the feature having a wall which has an angle, relative to the body, to allow a formed portion of the golf ball to be removed.

50. A mold as in claim 49 wherein a face of the wall is substantially parallel to a direction of removal of the formed portion.

51. A mold as in claim 49 wherein the feature forms a first angle relative to the surface and a second angle, relative to the surface, which is different than the first angle.

52. A method for locating a golf ball, the method comprising:

placing at least one of a golf ball with a radio frequency circuit or a cellular telephone or an RF activated car key or other interference sources in a container which includes a radio frequency shielding layer;

activating a radio frequency transmitter to locate a golf ball.

53. A method as in claim 52 wherein the container is a pouch which is capable of being coupled to a bag for golf clubs.

54. A container for holding at least one object, the container comprising:

a radio frequency (RF) shielding material which defines a void, the RF shielding material significantly attenuating RF emissions from an RF transmitter which is designed to locate a golf ball, the void to hold at least one of a golf ball with an RF circuit, or a cellular telephone or a car key.

55. A container as in claim 54 further comprising:

a closure which is coupled to the RF shielding material and to the void, and wherein the RF shielding material attenuates the RF emissions by at least about 70% and wherein the void has a volume sufficient to hold up to only two golf balls.

56. A fixture for holding a portion of a golf ball during fabrication of the golf ball, the fixture comprising:

a horizontal support which restricts horizontal movement of the portion;

a vertical support which restricts vertical movement of the portion, the horizontal support being capable of vertical movement above the vertical support, wherein the horizontal support is coupled to the portion and the vertical support is coupled to the portion.

57. A fixture as in claim 56 wherein the vertical support counteracts a force from a transfer medium which applies, in a vertical direction, an antenna material onto the portion and wherein the horizontal support comprises a surface with pins which engage the portion and wherein a biasing spring in the horizontal support secures the portion in the horizontal support.

58. A fixture for holding a portion of a golf ball during fabrication of the golf ball, the fixture comprising:

a first axis support which restricts movement of the portion in the first axis;

a second axis support which restricts movement of the portion in the second axis, the first axis support being capable of free movement along the second axis, and wherein the first axis support and the second axis support are each coupled to the portion.

59. A fixture as in claim 58 wherein the first axis and the second axis are substantially perpendicular and wherein the second axis support counteracts a force from a transfer medium which applies an antenna material onto the portion.

60. A golf ball comprising:

a golf ball material having a void at a surface of the golf ball material;

a semiconductor component disposed at least partially in the void;

a filler material in the void and surrounding the semiconductor component on at least two sides of the semiconductor component.

61. A golf ball as in claim 60 wherein the filler material surrounds the semiconductor component on four side surfaces and on a bottom surface of the semiconductor component.

62. A golf ball as in claim 61 wherein the filler material is applied into the void as a liquid and wherein the surface of the golf ball material defines an upper edge of the void which is substantially planar with an upper surface of the filler material and an upper edge of the semiconductor component.

63. A golf ball as in claim 61 wherein an upper surface of the filler material and the surface of the core material provide a relatively smooth surface to support an antenna and wherein a precise amount of filler material is applied into the void.

64. A golf ball comprising:

a golf ball material having a void at a surface of the golf ball material;

a semiconductor component disposed at least partially in the void, wherein an electrical connection surface of the semiconductor component faces the golf ball material at a side of the void.

65. A golf ball as in claim 64 further comprising:

an antenna disposed on the surface of the golf ball material and at least partially on the side of the void and being coupled to the electrical connection surface.

66. A golf ball as in claim 65 further comprising:

a filler material disposed in the void, and wherein the side of the void is a bottom surface of the void.

67. A package comprising:

at least one new golf ball, each containing a radio frequency (RF) circuit to respond to a golf ball locator which transmits an RF signal;

an RF attenuating material which surrounds the at least one new golf ball, the RF attenuating material being part of a packaging for the package.

68. A package as in claim 67 wherein the packaging is an exterior surface of the package.

69. A package as in claim 67 further comprising:

a cardboard container enclosing the at least one new golf ball and the RF attenuating material which is a foil.

70. A method of fabricating a golf ball, the method comprising:

applying an antenna to a core material of a golf ball;

coupling a semiconductor component to the antenna;

coating the core material, after the semiconductor has been coupled to the antenna, with a sealant to create a sealed core;

shipping the sealed core before applying a shell material to enclose the sealed core.

71. A method as in claim 70 wherein the sealant prevents the core material from being exposed to air and moisture, and wherein the shell material is applied more than two weeks after the coating.

72. A golf ball comprising:

a core material;

an antenna coupled to the core material;

a semiconductor component coupled to the antenna;

a sealant encasing the antenna and the semiconductor component and the core material, wherein the sealant is applied before applying a shell material.

73. A golf ball as in claim 72 wherein the sealant prevents the core material from being exposed to air and moisture before the shell material is applied.

74. A method of fabricating a golf ball, the method comprising:

applying an antenna to a core material of a golf ball;

coupling a semiconductor component to the antenna;

storing the core material with the antenna and semiconductor component in a vacuum chamber.

75. A method as in claim 74 further comprising:

shipping the vacuum chamber from a first golf ball manufacturing facility to a second golf ball manufacturing facility, and wherein the vacuum chamber comprises a sealed vacuum bag.

76. A method of fabricating a golf ball, the method comprising:

picking a semiconductor component with a robotic arm;

optically detecting a void on a surface of a core material;

placing, with the robotic arm, the semiconductor component into the void.

77. A method of manufacturing a golf ball, the method comprising:

controlling an environment to provide a relatively constant temperature and humidity;

applying a conductive ink onto cores of golf balls in the environment.

78. A method as in claim 77 further comprising:

storing the conductive ink in the environment before applying the conductive ink onto cores, and wherein the environment is maintained at the constant temperature and humidity for 24 hours per day, 7 days per week.

79. A golf ball comprising:

a core material;

at least one of an antenna disposed on the core material and a semiconductor component disposed on the core material;

a sealant encasing the at least one of the antenna and the semiconductor component, wherein the sealant is applied before applying a shell material.

80. A golf ball as in claim 79 wherein the sealant prevents the core material from being exposed to air and moisture before the shell material is applied and wherein the shell material is applied no sooner than two weeks after the sealant was applied to the golf ball.

81. A method of fabricating a golf ball, the method comprising:

attaching a core to a fixture;

aligning the core to receive a semiconductor component into a void;

attaching the semiconductor component to the void.

82. A method as in claim 81 wherein the aligning comprises rotating the core while capturing images of the core, and wherein the semiconductor component is deposited into the void, and wherein a plurality of cores are attached to the fixture and are aligned in the fixture to receive a corresponding plurality of semiconductor components.

83. An apparatus for fabricating a golf ball, the apparatus comprising:

a fixture to receive and hold at least one core;

a camera coupled to the fixture, the camera to locate a void on the at least one core;

an arm coupled to the fixture, the arm to dispense a semiconductor component into the void.

84. An apparatus as in claim 83 wherein the camera is used to align the void relative to the fixture and the fixture rotates the core to align the void and wherein a plurality of cores are held by the fixture.

85. A method of fabricating a golf ball, the method comprising:

attaching at least one core to a fixture;

positioning a dispenser adjacent to a void on the at least one core;

dispensing filler material from the dispenser into the void.

86. A method as in claim 85 further comprising:

sensing a pressure at the dispenser to position the dispenser adjacent to the void;

moving the at least one core away from the dispenser after the dispensing; and

wherein the fixture holds a plurality of cores.

87. An apparatus for fabricating a golf ball, the apparatus comprising:

a fixture to receive and hold at least one core;

a dispenser coupled to the fixture to dispense automatically a filler material into a void of the at least one core.

88. An apparatus as in claim 87 further comprising:

a pressure sensor coupled to the dispenser, the pressure sensor to sense when the dispenser has contacted the void.

89. A method of fabricating a golf ball, the method comprising:

attaching at least one core to a fixture;

positioning a mask over the at least one core;

applying an antenna material, through the mask, onto the core.

90. A method as in claim 89 wherein the mask has an opening having a shape corresponding to a desired antenna shape.

91. An apparatus for fabricating a golf ball, the apparatus comprising:

a fixture to receive and hold at least one core;

a mask having an opening which has a shape corresponding to at least a portion of an antenna, the mask being coupled to the fixture;

a dispenser coupled to the fixture, the dispenser to apply an antenna material, through the mask, onto the at least one core.

92. An apparatus as in claim 91 wherein the antenna material comprises an elastic conductive ink and wherein the mask contacts at least a portion of the one core.

93. A method of fabricating a golf ball, the method comprising:

attaching at least one core to a fixture;

inserting a semiconductor component into a void of the one core;

applying automatically an antenna structure onto the one core, the applying including a connection to the semiconductor component.

94. A method as in claim 93 wherein the antenna structure applied by the applying includes the connection.

95. An apparatus for fabricating a golf ball, the apparatus comprising:

a fixture to receive and hold at least one core;

a dispenser coupled to the fixture, the dispenser to apply an antenna structure onto the one core which includes a connection to a semiconductor component on the one core.

96. An apparatus for fabricating a golf ball, the apparatus comprising:

a fixture to receive and hold at least one core;

an arm coupled to the fixture, the arm to pick a semiconductor component and to place the semiconductor component into a void on the one core.

97. An apparatus as in claim 96 wherein the arm picks the semiconductor component from a reel containing a plurality of semiconductor components.

98. A method of fabricating a golf ball, the method comprising:

attaching a core to a fixture;

aligning, through a machine vision system, a feature, on the core, relative to the fixture.

99. A method as in claim 98 wherein the feature is a void on the core and wherein the machine vision system comprises a camera and an image recognition system and wherein the aligning is performed prior to at least one fabrication operation.

100. An apparatus for fabricating a golf ball, the apparatus comprising:

a fixture to receive and hold at least one core;

a camera coupled to the fixture, the camera to locate a feature on the at least one core;

an image recognition system coupled to the camera, the image recognition system causing an alignment of the feature relative to the fixture.