Cooling device for light emitting diode lamp

• US 20060139935A1
• Filed: 12/28/2004
• Published: 06/29/2006
• Est. Priority Date: 12/28/2004
• Status: Abandoned Application

• Current Assignee: Chaun-Choung Technology Corp.
• Original Assignee: Chaun-Choung Technology Corp.
• Inventors: Huang, Meng-Cheng
• Application Number:
  US11/022,666
• Publication Number:
  US 20060139935A1
• Time in Patent Office: Days
• US Class Current: 362/373
• CPC Class Codes: F21V 29/51 using condensation or evaporation of a fluid, e.g. heat pipes
• CPC Class Codes: F21V 29/71 using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
• CPC Class Codes: F21V 29/89 Metals
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]

Abstract

A cooling device for LED lamp, which is disposed in an LED lamp set, includes a heat pipe. The cooling end of the heat pipe is disposed on the light reflection cover of the lamp set, while the reception end contacts the bottom portion of the light emitter. Therefore, the heat generated from the light emitter is transferred to the heat pipe and then to the light reflection cover. Thereafter, the heat is dissipated to the external environment, thereby achieving the cooling purpose.

Claims

1. A cooling device for light emitting diode lamp, comprising:

a light emitter; and

a heat pipe, which comprises a reception end and a cooling end, the reception end contacting the bottom portion of the light emitter,

whereby the heat generated from the light emitter is transferred to the heat pipe for further dissipation.

2. The device as recited in claim 1, wherein the light emitter comprises a light emitting diode.

3. The device as recited in claim 1, wherein the light emitter is disposed in a lamp mount, the pins of the light emitter being extended outside of the lamp mount for connecting therewith a conducting wire.

4. The device as recited in claim 1, wherein a circuit board is disposed between the light emitter and the heat pipe, a plurality of through holes being disposed on the circuit board for the pins of the light emitter to penetrate therethrough and be soldered thereon.

5. The device as recited in claim 4, wherein the circuit board comprises at least a light emitter soldered thereon, and a power source is provided to the light emitter via the circuit board.

6. The device as recited in claim 1, wherein a heat conducting plate made of a metallic material is disposed between the light emitter and the heat pipe, and an insulator is harnessed on the two pins for preventing short circuitry of the two pins from happening due to the presence of the heat conducting plate and the heat pipe.

7. The device as recited in claim 1, wherein a mount made of a plastic material is disposed between the light emitter and the heat pipe, a heat conducting element is embedded into the mount contacting the bottom portion of the light emitter, and an insulator is harnessed on the two pins for preventing short circuitry of the two pins from happening due to the presence of the heat pipe.

8. A cooling device for LED lamp, comprising:

a light reflection cover;

a light emitter; and

a heat pipe, which comprises a reception end and a cooling end, the reception end contacting the bottom portion of the light emitter,

whereby the heat generated from the light emitter is transferred to the heat pipe for further dissipation.

9. The device as recited in claim 8, wherein the light reflection cover comprises a plurality of separators.

10. The device as recited in claim 9, wherein the light reflection cover and the separator are made of aluminum, the separator having a plurality of through holes for disposing thereon the cooling end of the heat pipe.