Cooling apparatus, system, and associated method

• US 20060146496A1
• Filed: 01/06/2005
• Published: 07/06/2006
• Est. Priority Date: 01/06/2005
• Status: Active Grant

• Current Assignee: The Boeing Co.
• Original Assignee: The Boeing Co.
• Inventors: Chen, Chung-Lung, Cai, Qingjun, Asfia, Julie F.
• Granted Patent: US 7,345,877 B2
• Time in Patent Office: Days
• US Class Current: 361/700
• CPC Class Codes: F28D 15/0266 with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers F28D15/043 takes precedence
• CPC Class Codes: H05K 1/0203 Cooling of mounted components H05K1/0272 takes precedence
• CPC Class Codes: H05K 1/0272 Adaptations for fluid transport, e.g. channels, holes
• CPC Class Codes: H05K 7/20672 within sub-racks for removing heat from electronic boards
• CPC Class Codes: H05K 7/20681 within cabinets for removing heat from sub-racks

Abstract

A cooling apparatus, system, and method are provided. The cooling apparatus includes at least one printed circuit board having opposed major surfaces, and at least one electrical component or other heat source positioned on one major surface of the printed circuit board. The cooling apparatus also includes a pulsating heat pipe having at least a portion that is positioned to either extend along and proximate to one of the major surfaces or be embedded within the printed circuit board. As such, the pulsating heat pipe is capable of transferring heat from the printed circuit board.

Claims

1. A cooling apparatus comprising:

at least one printed circuit board having opposed major surfaces;

at least one heat source positioned on one major surface of the printed circuit board; and

a pulsating heat pipe having at least a portion that is positioned to either extend along and proximate to one of the major surfaces or be embedded within the printed circuit board such that the pulsating heat pipe is capable of transferring heat from the printed circuit board.

2. The apparatus according to claim 1, further comprising at least one sheet formed of thermally conductive material positioned adjacent to, and between, the pulsating heat pipe and the printed circuit board.

3. The apparatus according to claim 1, further comprising a loop heat pipe thermally coupled to the pulsating heat pipe, the loop heat pipe comprising an evaporator and a condenser.

4. The apparatus according to claim 3, wherein the pulsating heat pipe comprises an evaporator and a condenser, and wherein the evaporator of the loop heat pipe is thermally coupled to the condenser of the pulsating heat pipe.

5. The apparatus according to claim 1, wherein the pulsating heat pipe comprises an evaporator and a condenser, and wherein the evaporator of the pulsating heat pipe is positioned adjacent to the major surface of the printed circuit board opposite the heat source.

6. The apparatus according to claim 1, further comprising a pair of printed circuit boards, wherein the pulsating heat pipe is positioned between the pair of printed circuit boards.

7. A cooling system comprising:

a chassis housing;

at least one printed circuit board having opposed major surfaces and positioned within the chassis housing;

at least one heat source positioned on one major surface of the printed circuit board; and

a pulsating heat pipe having at least a portion that is positioned to either extend along and proximate to one of the major surfaces or be embedded within the printed circuit board such that the pulsating heat pipe is capable of transferring heat from the printed circuit board and out of the chassis housing.

8. The system according to claim 7, wherein the pulsating heat pipe comprises an evaporator and a condenser.

9. The system according to claim 8, wherein the condenser is positioned one of adjacent to an inner surface, adjacent to an outer surface, and within a wall of the chassis housing.

10. The system according to claim 8, further comprising a pair of printed circuit boards, wherein the evaporator is positioned between the pair of the printed circuit boards.

11. The system according to claim 8, wherein the evaporator extends collinear to the condenser.

12. The system according to claim 7, further comprising a loop heat pipe thermally coupled to the pulsating heat pipe, the loop heat pipe comprising an evaporator and a condenser.

13. The system according to claim 12, wherein the pulsating heat pipe comprises an evaporator and a condenser, and wherein the evaporator of the loop heat pipe is thermally coupled to the condenser of the pulsating heat pipe.

14. The system according to claim 12, wherein the loop heat pipe is positioned adjacent to an outer surface of the chassis housing.

15. The system according to claim 12, further comprising a pair of connectors positioned on opposing ends of the pulsating heat pipe, wherein the connectors are capable of conducting heat from the pulsating heat pipe to the loop heat pipe.

16. The system according to claim 7, further comprising a pair of sheets formed of thermally conductive material each positioned adjacent to a respective printed circuit board, wherein the pulsating heat pipe is positioned between the pair of sheets.

17. A method for cooling at least one printed circuit board, the method comprising:

providing a cooling system comprising;

a chassis housing;

at least one printed circuit board having opposed major surfaces and positioned within the chassis housing;

at least one heat source positioned on one major surface of the printed circuit board; and

a pulsating heat pipe having at least a portion that is positioned to either extend along and proximate to one of the major surfaces or be embedded within the printed circuit board;

transferring heat from the printed circuit board with the pulsating heat pipe; and

transferring heat away from the printed circuit board and out of the chassis housing by movement of the heat through the pulsating heat pipe.

18. The method according to claim 17, wherein providing further comprises positioning at least one sheet formed of a thermally conductive material adjacent to, and between, the pulsating heat pipe and the printed circuit board.

19. The method according to claim 17, wherein providing further comprises positioning a loop heat pipe adjacent to an outer surface of the pulsating heat pipe such that the loop heat pipe is thermally coupled to the pulsating heat pipe.

20. The method according to claim 19, further comprising transferring heat from the pulsating heat pipe to the loop heat pipe.

21. The method according to claim 19, wherein providing further comprises positioning a pair of connectors on opposing ends of the pulsating heat pipe, wherein the connectors are capable of conducting heat between the pulsating heat pipe and the loop heat pipe.

22. The method according to claim 21, further comprising transferring heat from the connectors, through the chassis housing, and to the loop heat pipe.

23. The method according to claim 17, wherein providing further comprises positioning an evaporator of the pulsating heat pipe adjacent to the major surface of the printed circuit board opposite the heat source.

24. The method according to claim 17, wherein providing further comprises positioning a condenser of the pulsating heat pipe one of adjacent to an inner surface, adjacent to an outer surface, and within a wall of the chassis housing.

25. The method according to claim 17, wherein providing further comprises installing a plurality of printed circuit boards within the chassis housing.

26. The method according to claim 25, wherein providing further comprises positioning a pulsating heat pipe between each of a pair of the printed circuit boards.