Wiring pattern drawing formation method and circuit board manufactured by using the same

• US 20060154074A1
• Filed: 12/20/2005
• Published: 07/13/2006
• Est. Priority Date: 01/11/2005
• Status: Abandoned Application

• Current Assignee: Japan Aviation Electronics Industry Limited
• Original Assignee: Japan Aviation Electronics Industry Limited
• Inventors: Miyashita, Takuya
• Application Number:
  US11/314,282
• Publication Number:
  US 20060154074A1
• Time in Patent Office: Days
• US Class Current: 428/409
• CPC Class Codes: C23C 26/02 applying molten material to the substrate
• CPC Class Codes: C23C 6/00 Coating by casting molten material on the substrate
• CPC Class Codes: H05K 1/0393 Flexible materials H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups
• CPC Class Codes: H05K 2203/013 Inkjet printing, e.g. for printing insulating material or resist using ink-jet printing to form a conductive pattern H05K3/125
• CPC Class Codes: H05K 2203/095 Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes
• CPC Class Codes: H05K 3/1208 Pretreatment of the circuit board, e.g. modifying wetting properties; Patterning by using affinity patterns providing shape patterns H05K3/1258; adhesion treatments H05K3/38
• CPC Class Codes: H05K 3/125 by ink-jet printing
• CPC Class Codes: H05K 3/381 by special treatment of the substrate
• CPC Class Codes: H05K 3/389 by the use of a coupling agent, e.g. silane
• CPC Class Codes: Y10T 428/31 Surface property or characteristic of web, sheet or block

Abstract

In a method of forming by drawing a wiring pattern on a board by drip feeding a liquid solution including an electrically conductive constituent, there is used, for the board, a board with elemental oxygen included in a surface of the board, the surface having a critical surface tension at 25° C. of less than 25 dyn/cm, and for the liquid solution, there is used a liquid solution having a surface tension which is greater than the aforementioned critical surface tension. With the method, it is possible to combine drawability and adherence.

Claims

1. A method of forming by drawing a wiring pattern on a board by drip feeding a liquid solution including an electrically conductive constituent, wherein

for said board, there is used a board which has elemental oxygen included in a surface of the board, said surface having a critical surface tension at 25°

C. of less than 25 dyn/cm; and

for said liquid solution, there is used a liquid solution, the surface tension of which is greater than said critical surface tension.

4. A wiring pattern drawing formation method according to any of claims 1 to 3, wherein elemental fluorine is included in said surface.

5. A wiring pattern drawing formation method according to any of claims 1 to 3, wherein the surface tension at 25°

C. of said liquid solution is equal to or greater than 25 dyn/cm and equal to or smaller than 35 dyn/cm.

6. A wiring pattern drawing formation method according to any of claims 1 to 3, wherein, for said liquid solution, there is used a liquid solution in which electrically conductive grains of sub-micron size or smaller are dispersed.

7. A wiring pattern drawing formation method according to any of claims 1 to 3, wherein, for said liquid solution drip feeding, a dispenser or an inkjet apparatus is used.

8. A circuit board characterized in that the wiring pattern is formed by using a wiring pattern drawing formation method according to any of claims 1 to 3.

2. A method of forming by drawing a wiring pattern on a board by drip feeding a liquid solution including an electrically conductive constituent, wherein

for said board, there is used a board which has elemental oxygen and elemental silicon included in a surface of the board, said surface having a critical surface tension at 25°

C. of less than 25 dyn/cm; and

for said liquid solution, there is used a liquid solution, the surface tension of which is greater than said critical surface tension.

3. A method of forming by drawing a wiring pattern on a board by drip feeding a liquid solution including an electrically conductive constituent, wherein

a coating layer is formed on said board, the formation by drawing being carried out on said coating layer;

said coating layer has elemental oxygen and elemental silicon included, the surface thereof having a critical surface tension at 25°

C. of less than 25 dyn/cm; and

for said liquid solution, there is used a liquid solution, the surface tension of which is greater than said critical surface tension.