Semiconductor light emitting device mounting substrates including a conductive lead extending therein and methods of packaging same
First Claim
1. A mounting substrate for a semiconductor light emitting device comprising:
- a thermally conductive mounting block having in a first face thereof a cavity that is configured to mount a semiconductor light emitting device therein and to reflect light that is emitted by the semiconductor light emitting device that is mounted therein away from the cavity; and
a conductive lead inserted in the mounting block and extending into the cavity, the conductive lead being electrically isolated from the mounting block and having an exposed contact portion in the cavity.
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Accused Products
Abstract
A mounting substrate for a semiconductor light emitting device includes a thermally conductive mounting block. The mounting block has, in a first face thereof, a cavity that is configured to mount a semiconductor light emitting device therein and to reflect light that is emitted by the semiconductor light emitting device that is mounted therein away from the cavity. A conductive lead inserted into the mounting block extends into the cavity. The conductive lead is electrically isolated from the mounting block and has an exposed contact portion in the cavity. The conductive lead may be a plurality of conductive leads each having an exposed contact portion at different locations in the cavity. Related packaging methods also may be provided.
110 Citations
61 Claims
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1. A mounting substrate for a semiconductor light emitting device comprising:
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a thermally conductive mounting block having in a first face thereof a cavity that is configured to mount a semiconductor light emitting device therein and to reflect light that is emitted by the semiconductor light emitting device that is mounted therein away from the cavity; and
a conductive lead inserted in the mounting block and extending into the cavity, the conductive lead being electrically isolated from the mounting block and having an exposed contact portion in the cavity. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 56)
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34. A mounting substrate for a semiconductor light emitting device comprising:
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a thermally conductive mounting block having a first and second opposing face and a side face therebetween, the first face including thereon a mounting surface that is configured to receive a semiconductor light emitting device thereon;
a conductive lead extending inwardly from the side face of the mounting block inserted into the mounting block, the conductive lead being electrically isolated from the mounting block and having an exposed contact pad on a surface thereof facing the first face of the mounting block; and
a passageway in the first face of the mounting block and extending towards the exposed contact pad to allow passage of an electrical connection from the first face of the mounting block to the exposed contact pad. - View Dependent Claims (35, 36, 37, 38, 39, 40, 41, 42, 43, 44, 45, 46, 47, 48, 49, 50, 51, 52, 53, 54, 55)
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57. A semiconductor light emitting device packaging method comprising:
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fabricating a solid metal mounting block including first and second opposing metal faces, the first metal face including therein a cavity configured to mount a semiconductor light emitting device therein and to reflect light that is emitted by the semiconductor light emitting device that is mounted therein away from the cavity;
7fabricating a molded lead having a non-conductive molded body portion and a conductive lead extending therethrough;
inserting the molded lead into the mounting block and extending into the cavity, the molded lead having an exposed contact portion in the cavity;
mounting the semiconductor light emitting device in the cavity; and
electrically connecting the semiconductor device to the exposed contact portion. - View Dependent Claims (58, 59, 60, 61)
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Specification