IC chip coating material and vacuum fluorescent display device using same

• US 20060180825A1
• Filed: 02/14/2006
• Published: 08/17/2006
• Est. Priority Date: 02/14/2005
• Status: Active Grant

• Current Assignee: Futaba Corporation
• Original Assignee: Futaba Corporation
• Inventors: Kato, Masahiro, Fujiwara, Kouji, Yasuoka, Yusuke, Watanabe, Teruo
• Granted Patent: US 8,053,896 B2
• Time in Patent Office: Days
• US Class Current: 257/99
• CPC Class Codes: H01J 29/96 One or more circuit elements structurally associated with the tube
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/83192 wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/83801 Soldering or alloying
• CPC Class Codes: H01L 2224/8592 Applying permanent coating, e.g. protective coating
• CPC Class Codes: H01L 23/291 Oxides or nitrides or carbides, e.g. ceramics, glass
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 24/83 using a layer connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01025 Manganese [Mn]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/01087 : Francium [Fr]
• CPC Class Codes: H01L 2924/10253 : Silicon [Si]
• CPC Class Codes: H01L 2924/12044 : OLED
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/1815 : Shape
• CPC Class Codes: H01L 2924/207 : Diameter ranges
• CPC Class Codes: H01L 2924/3512 : Cracking

Abstract

An IC chip coating material includes first metal oxide particles; a metal alkoxide; an organic solvent; and second metal oxide particles and/or flat particles of a composite oxide, the second metal oxide particles having a composition identical to or different from that of the first metal oxide particles and also having a mean particle size and/or a shape different from that of the first metal oxide particles. Further, a vacuum fluorescent display device includes an IC chip, wherein the IC chip is at least partially coated by a coating material layer including the first metal oxide particles; a metal forming metal alkoxide; and the second metal oxide particles and/or flat particles of a composite oxide.

Claims

1. An IC chip coating material comprising:

first metal oxide particles;

a metal alkoxide;

an organic solvent; and

second metal oxide particles and/or flat particles of a composite oxide, the second metal oxide particles having a composition identical to or different from that of the first metal oxide particles and also having a mean particle size and/or a shape different from that of the first metal oxide particles.

2. The IC chip coating material of claim 1, wherein the first and second metal oxide particles include oxide particles of at least one metal selected from the group consisting of Fe, Cr, Mn, Al and Si.

3. The IC chip coating material of claim 1, wherein the metal alkoxide is an Al alkoxide.

4. The IC chip coating material of claim 1, wherein the organic solvent has a boiling point ranging from about 100°

C. to 250°

C. and is non-volatile at room temperature.

5. The IC chip coating material of claim 2, wherein the metal alkoxide is an Al alkoxide.

6. The IC chip coating material of claim 2, wherein the organic solvent has a boiling point ranging from about 100°

C. to 250°

C. and is non-volatile at room temperature.

7. The IC chip coating material of claim 3, wherein the organic solvent has a boiling point ranging from about 100°

C. to 250°

C. and is non-volatile at room temperature.

8. The IC chip coating material of claim 5, wherein the organic solvent has a boiling point ranging from about 100°

C. to 250°

C. and is non-volatile at room temperature.

9. A vacuum fluorescent display device comprising:

an IC chip,

wherein the IC chip is at least partially coated by a coating material layer including first metal oxide particles;

a metal forming metal alkoxide; and

second metal oxide particles and/or flat particles of a composite oxide, the second metal oxide particles having a composition identical to or different from that of the first metal oxide particles and also having a mean particle size and/or a shape different from that of the first metal oxide particles.

10. The vacuum fluorescent display device of claim 9, wherein the first and the second metal oxide particles include oxide particles of at least one metal selected from the group consisting of Fe, Cr, Mn, Al and Si.

11. The vacuum fluorescent display device of claim 9, wherein the IC chip and all of bonding wires connected to an electrode of the IC chip are entirely coated with the coating material layer.

12. The vacuum fluorescent display device of claim 9, wherein the coating material layer for coating the IC chip is black.

13. The vacuum fluorescent display device of claim 10, wherein the IC chip and all of bonding wires connected to an electrode of the IC chip are entirely coated with the coating material layer.

14. The vacuum fluorescent display device of claim 10, wherein the coating material layer for coating the IC chip is black.

15. The vacuum fluorescent display device of claim 11, wherein the coating material layer for coating the IC chip is black.

16. The vacuum fluorescent display device of claim 13, wherein the coating material layer for coating the IC chip is black.